UST961007I4 - Production of electrically conductive paths on an insulating substrate - Google Patents
Production of electrically conductive paths on an insulating substrate Download PDFInfo
- Publication number
- UST961007I4 UST961007I4 US05/712,373 US71237376A UST961007I4 US T961007 I4 UST961007 I4 US T961007I4 US 71237376 A US71237376 A US 71237376A US T961007 I4 UST961007 I4 US T961007I4
- Authority
- US
- United States
- Prior art keywords
- substrate
- contacting
- conductive paths
- nickel
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
Abstract
this process applies to printed circuits obtained by the imagewise deposition of nickel using a procedure such as that described in U.S. Pat. No. 3,853,589 followed by electroless copper plating onto the nickel pattern. We have found that by depositing the nickel before the copper, as compared with direct deposition of the copper, gives less deposition on the areas between the conductive paths and hence better insulation between them.
The process can be performed in five stages including (a) coating a substrate, for instance by a gravure technique, with an active agent including a water-soluble quaternized bipyridilium compound, e.g. N,N'-dimethyl-4,4'-bipyridilium dimethosulphate or N,N'-bis(4-cyanophenyl)4,4"-bipyridilium dichloride and a suitable binder therefore such as polyvinyl alcohol, (b) imagewise exposing the coating where the conductive paths are to be deposited to sensitizing radiation, (c) contacting the surface with a solution of palladium chloride in hydrochloric acid, preferably containing 0.5 to 0.15 g/l PdCl2, (d) contacting the substrate with an aqueous electroless nickel plating bath, preferably at pH 8 to 9, and (e) contacting the substrate with an electroless copper plating bath.
Further reduction in the metal deposition between the conductive paths is obtained by contacting the surface of the substrate with an aqueous solution of a reducing agent such as sodium hypophosphite between steps (c) and (d), rubbing the surface of the substrate between steps (d) and (e), or both procedures.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| UK33542/75 | 1975-08-12 | ||
| GB33542/75A GB1499552A (en) | 1975-08-12 | 1975-08-12 | Production of electrically conductive paths on an insulating substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| UST961007I4 true UST961007I4 (en) | 1977-08-02 |
Family
ID=10354299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US05/712,373 Pending UST961007I4 (en) | 1975-08-12 | 1976-08-06 | Production of electrically conductive paths on an insulating substrate |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | UST961007I4 (en) |
| GB (1) | GB1499552A (en) |
-
1975
- 1975-08-12 GB GB33542/75A patent/GB1499552A/en not_active Expired
-
1976
- 1976-08-06 US US05/712,373 patent/UST961007I4/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB1499552A (en) | 1978-02-01 |
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