CN103009708A - 镀膜件及其制造方法 - Google Patents

镀膜件及其制造方法 Download PDF

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CN103009708A
CN103009708A CN2011102817117A CN201110281711A CN103009708A CN 103009708 A CN103009708 A CN 103009708A CN 2011102817117 A CN2011102817117 A CN 2011102817117A CN 201110281711 A CN201110281711 A CN 201110281711A CN 103009708 A CN103009708 A CN 103009708A
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film
coated part
copper layer
forms
matrix
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吕相华
林和贤
何维仁
闫世杰
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Shenzhen Futaihong Precision Industry Co Ltd
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    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
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    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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    • C25D3/00—Electroplating: Baths therefor
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Abstract

本发明提供一种镀膜件，包括基体、形成于基体上的铜层、镍层及真空镀膜层，所述真空镀膜层的材料选自铝、钛、铬及锌中的至少一种。该镀膜件可减缓金属镍的析出。本发明还提供了所述镀膜件的制造方法。

Description

镀膜件及其制造方法
技术领域
本发明涉及一种镀膜件及其制造方法。
背景技术
现有技术，为了降低生产成本，通常选用塑料基材代替金属基材，并通过在塑料基材上依次电镀镍层及铬层以提高塑料基材的防护性及耐磨性。但，传统的电镀镍产品的镍层中的镍易于析出，而导致镍与使用者的皮肤接触引发镍过敏症状；此外，传统的塑料电镀镍产品的强度不够，难以满足塑料镀膜件在强度方面的需求。
发明内容
鉴于此，本发明提供一种可减缓金属镍析出的镀膜件。
另外，本发明还提供一种上述镀膜件的制造方法。
一种镀膜件，包括基体、形成于基体上的铜层、镍层及真空镀膜层，所述真空镀膜层的材料选自铝、钛、铬及锌中的至少一种。
一种镀膜件的制造方法，其包括如下步骤：
提供基体；
采用电镀的方式，于所述基体上形成铜层；
采用电镀的方式，于所述铜层上形成镍层；
采用真空镀膜法，以铝、钛、铬及锌中的任一种为靶材，在该镍层上形成真空镀膜层，所述真空镀膜层的材料选自铝、钛、铬及锌中的至少一种。
通过上述方法形成的真空镀膜层具有良好的致密性，如此可有效地阻止镍层的镍金属的析出。
附图说明
图1为本发明一较佳实施例镀膜件的剖视图。
图2是本发明一较佳实施例真空镀膜机的示意图。
主要元件符号说明
镀膜件 10
基体 11
化学镀层 13
铜层 15
镍层 17
真空镀膜层 19
真空镀膜机 100
镀膜室 21
靶材 23
轨迹 25
气源通道 27
真空泵 30
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明一较佳实施例的镀膜件10包括基体11、依次形成于基体11表面的化学镀层13、铜层15、镍层17及真空镀膜层19。该镀膜件10可以为电子装置零部件，也可以为钟表外壳及金属卫浴件等。
所述基体11由塑料制成，所述塑料可为丙烯腈-苯乙烯-丁二烯共聚合物(ABS)、聚碳酸酯(PC)、聚酰胺（PA）、聚苯硫醚（PPS）、乙二醇改性聚酯及聚丙烯（PP）等聚合物及其改性物中的至少一种。
所述化学镀层13使所述基体11金属化，使基体11后续可以进行电镀处理。本实施例中，所述化学镀层13可为化学镀铜层或化学镀镍层。所述化学镀层13的厚度为2-5μm。
所述铜层15用以提高所述基体11的导电性及后续镀覆于铜层15上的镍层17的均匀性。所述铜层15通过电镀的方式形成，其厚度为6~9μm。
所述镍层17通过直流或脉冲电流沉积的方式形成。该镍层17的厚度为30~50μm。该镍层17主要由粒径为10nm~100nm的纳米颗粒组成。
所述真空镀膜层19可阻止镍的析出。该真空镀膜层19的材料选自铝（Al）、钛（Ti）、铬（Cr）及锌（Zn）中的至少一种，其厚度为3~4μm。
本发明一较佳实施方式的镀膜件10的制造方法包括以下步骤：
提供基体11。
对所述基体11进行预处理。所述预处理包括化学除油和粗化。所述粗化处理用以提高后续镀层与基体11之间的附着力。本实例中，所述粗化液中含有240~280m/L的PA粗化剂（由美国罗门哈斯公司提供，型号为PM847）及720~760m/L的乙二醇。粗化液温度为55~60℃，粗化时间为15~25min。
对经预处理后的所述基体11进行敏化及活化处理。
采用化学镀的方式，对经上述处理后的基体11表面形成化学镀层13。所述化学镀层13为化学镀铜层或化学镀镍层。用以形成该化学镀层13的化学镀液中主要含有铜或镍的金属盐及还原剂。其中，所述金属盐为硫酸铜或硫酸镍，所述还原剂为次亚磷酸钠。本实例中，所述化学镀液中，硫酸铜或硫酸镍的浓度为20~24g/L，次亚磷酸钠的浓度为28~32g/L；化学镀液的温度为45~50℃，pH值为9.0~9.4，化学镀镍的时间为28~32min。
于所述化学镀层13上电镀形成一铜层15，用以形成该铜层15的电镀液中主要含有五水硫酸铜、硫酸、氯离子及整平剂。其中，五水硫酸铜的浓度为60~90g/L,硫酸的浓度为180~220g/L，氯离子的浓度为0.05~1.5ml/L的，整平剂（由美国罗门哈斯公司提供，型号为PCM）的浓度为3~8ml/L；电流密度为0.4~1.5A/dm2，所述电镀液的温度为20~40℃，电镀时间为10~15min，所述铜层15的厚度为6~9μm。
采用电镀的方式，于所述铜层15上沉积形成一镍层17。用以形成该镍层17的电镀液中主要含有硫酸镍、氯化镍及硼酸。其中，硫酸镍的浓度为260~300g/L，氯化镍的浓度为40~50g/L，硼酸的浓度为40~50g/L；电镀液的温度为10~50℃，电流密度为0.2~4A/dm2。该镍层17的厚度为30~50μm，该镍层17主要由粒径为10nm~100nm的纳米颗粒组成。
结合参阅图2，提供一真空镀膜机100，该真空镀膜机100包括一镀膜室21及连接于镀膜室21的一真空泵30，真空泵30用以对镀膜室21抽真空。该镀膜室21内设有转架(未图示)及相对设置的二靶材23。转架带动基体11沿圆形的轨迹25公转，且基体11在沿轨迹25公转时亦自转。每一靶材23的两端均设有气源通道27，气体经该气源通道27进入所述镀膜室21中。其中，所述靶材23的材料为铝、钛、铬及锌中的至少一种。
在镍层17上溅射一真空镀膜层19。形成真空镀膜层19的方法：将基体11放入真空镀膜机100的镀膜室内，将镀膜室21抽真空至6×10-3~8×10-3Pa；然后向镀膜室21内通入流量为150~200sccm(标准状态毫升/分钟)的氩气(纯度为99.999%)，并施加-100~-150V的偏压于基体11，将基体温度控制在25~55℃。开启靶材23，并设置所述靶材23的功率为12~15kW，对基体11溅射60~120min，以于形成镍层17上形成该真空镀膜层19。
可以理解的，根据实际生产需要，所述基体11可为金属。
可以理解的，当所述基体11为金属时，所述化学镀层13及铜层15可以省略。
通过上述真空镀膜方法形成的真空镀膜层19具有良好的致密性，如此可有效地阻止镍层17的镍金属的析出。另外，相较于传统的电镀镍层，本发明所述镍层17具有较小的金属晶粒粒径，如此可提高所述镍层17的硬度及强度，进而使所述镀膜件10具有较高的硬度及强度。
实施例
（1）提供一基体11，该基体11的材质为PC+30%GF型改性塑料。
（2）对基体11进行化学除油、粗化、敏化及活化处理。该粗化处理的工业参数为：所述粗化液中含有260m/L的PA粗化剂（由美国罗门哈斯公司提供，型号为PM847）及740m/L的乙二醇。粗化液温度为55℃，粗化时间为20min。
（3）化学镀形成化学镀层13：该化学镀层13为化学镀镍层，用以形成该化学镀层13的化学镀液中主要含有硫酸镍及次亚磷酸钠，其中，硫酸镍的浓度为22g/L，次亚磷酸钠的浓度为32 g/L；化学镀液的温度为50℃，pH值9.2，化学镀镍的时间为30min。
（4）电镀形成铜层15：用以形成该铜层15的电镀液含有浓度为80g/L的五水硫酸铜,浓度为200G/L的硫酸，浓度为0.07ml/L的氯离子，浓度为4ml/L的整平剂（由美国罗门哈斯公司提供，型号为PCM），电流密度为1.5A/dm2，所述电镀液的温度为28℃，电镀时间为8min。
（5）电镀形成镍层17：用以形成该镍层17的电镀液中含有浓度为280g/L硫酸镍，浓度为45g/L氯化镍，浓度为45g/L硼酸。电流密度为4A/dm2，电镀时间为30min。
（6）磁控溅射法形成真空镀膜层19：将基体11放入真空镀膜机100的镀膜室21内，将镀膜室21抽真空至8×10-3Pa；然后向镀膜室21内通入流量为180sccm的氩气，并施加-100V的偏压于基体11，将基体11温度控制在40℃。开启靶材23，并设置所述靶材23的功率为10kW，对基体11溅射80min。其中所述靶材23为铬靶。
（7）镍析出量测试：按照欧洲标准EN1811中规定的镍析出量测试方法，对实施例所制得的镀膜件10进行镍析出量测试。结果表明，所述镀膜件10的镍析出量为0.1978μg/cm2?week，其符合欧洲标准EN1811中规定的不超过0.5μg/cm2?week的标准。

Claims (11)

1.一种镀膜件，包括基体、形成于基体上的铜层及镍层，其特征在于：该镀膜件还包括形成于所述镍层上的真空镀膜层，所述真空镀膜层的材料选自铝、钛、铬及锌中的至少一种。
2.如权利要求1所述的镀膜件，其特征在于：所述真空镀膜层厚度为3~4μm。
3.如权利要求1所述的镀膜件，其特征在于：所述铜层通过电镀的方式形成，其厚度为6~9μm。
4.如权利要求1所述的镀膜件，其特征在于：所述镍层通过电镀的方式形成。
5.如权利要求1所述的镀膜件，其特征在于：所述镍层的厚度为30~50μm。
6.如权利要求1所述的镀膜件，其特征在于：所述镍层主要由粒径为10nm~100nm的纳米颗粒组成。
7.如权利要求1所述的镀膜件，其特征在于：所述镀膜件还包括形成于所述基体与所述铜层之间的化学镀层，该化学镀层为化学镀铜层或化学镀镍层。
8.一种镀膜件的制造方法，其包括如下步骤：
提供基体；
采用电镀的方式，于所述基体上形成铜层；
采用电镀的方式，于所述铜层上形成镍层；
采用真空镀膜法，以铝、钛、铬及锌中的任一种为靶材，在该镍层上形成真空镀膜层，所述真空镀膜层的材料选自铝、钛、铬及锌中的至少一种。
9.如权利要求8所述的镀膜件的制造方法，其特征在于：形成该铜层的工艺参数为：用以形成该铜层的电镀液中主要含有五水硫酸铜、硫酸、氯离子及整平剂；其中，五水硫酸铜的浓度为60~90g/L,硫酸的浓度为180~220g/L，氯离子的浓度为0.05~1.5ml/L的，整平剂的浓度为3~8ml/L；电流密度为0.4~1.5A/dm2，所述电镀液的温度为20~40℃，电镀时间为10~15min。
10.如权利要求8所述的镀膜件的制造方法，其特征在于：形成所述镍层的工艺参数为：用以形成该镍层的电镀液中主要含有硫酸镍、氯化镍及硼酸；其中，硫酸镍的浓度为260~300g/L，氯化镍的浓度为40~50g/L，硼酸的浓度为40~50g/L；电镀液的温度为10~50℃，电流密度为0.2~4A/dm2。
11.如权利要求8所述的镀膜件的制造方法，其特征在于：形成所述铜层的方法为：采用磁控溅射镀膜法，设置靶材的功率为12~15kW，以氩气为工作气体，氩气的流量为150~200sccm，施加于基体的偏压为-100~-150V，镀膜温度为25~55℃，镀膜时间为60~120min。
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