KR880002413A - 프린트배선판의 제조방법 - Google Patents

프린트배선판의 제조방법 Download PDF

Info

Publication number
KR880002413A
KR880002413A KR1019860007119A KR860007119A KR880002413A KR 880002413 A KR880002413 A KR 880002413A KR 1019860007119 A KR1019860007119 A KR 1019860007119A KR 860007119 A KR860007119 A KR 860007119A KR 880002413 A KR880002413 A KR 880002413A
Authority
KR
South Korea
Prior art keywords
printed wiring
wiring board
manufacturing
electrolytic cell
resist film
Prior art date
Application number
KR1019860007119A
Other languages
English (en)
Other versions
KR900001798B1 (ko
Inventor
기요시 이도
히도시 아라이
Original Assignee
시끼모리야
미쓰비시전기 주식회사
야마다 모또조
간사이 페인트 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시끼모리야, 미쓰비시전기 주식회사, 야마다 모또조, 간사이 페인트 가부시끼가이샤 filed Critical 시끼모리야
Publication of KR880002413A publication Critical patent/KR880002413A/ko
Application granted granted Critical
Publication of KR900001798B1 publication Critical patent/KR900001798B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Abstract

내용 없음

Description

프린트배선판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 이 발명의 일실시예의 실시사항을 표시하는 단면도.
제2도는 상기 실시예에 있어서의 전해조를 자동처리라인에 조성한 응용예를 표시하는 개념적 측면도.
제5도는 이 드라이필름의 첨부상황을 표시하는 원리적 측면도.

Claims (3)

  1. 관통공등의 구멍이 있는 프린트배선판에 있어서, 이 관통공내 및 프린트배선용 동박적층절연판의 표면에 감광성 레지스트막을 형성하는 경우에 상기 동박적층절연판을 전착도장용 전해조에 수용한 전착도료화 수용성 감광수지에 침지하고 직류전해에 의하여 감광성 레지스트막을 석출시키는 공정이 있는 것을 특징으로 하는 프린트배선판의 제조방법.
  2. 제1항에 있어서, 동박적층절연판을 수용성이나 수분산성의 광경화성수지를 주성분으로 하는 전착도료의 도장용 전해조에 침지하는 것을 특징으로 하는 프린트배선판의 제조방법.
  3. 제1항 또는 제2항에 있어서, 자동처리용 탱크군중에 조정된 전착도장용 전해조에 있어서 자동처리의 1단계로서 감광성 레지스트막을 형성하는 것을 특징으로 하는 프린트배선판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860007119A 1986-07-09 1986-08-27 프린트배선판의 제조방법 KR900001798B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP161422 1986-07-09
JP61161422A JPS6317592A (ja) 1986-07-09 1986-07-09 プリント配線板の製造方法
JP86-161422 1986-07-09

Publications (2)

Publication Number Publication Date
KR880002413A true KR880002413A (ko) 1988-04-30
KR900001798B1 KR900001798B1 (ko) 1990-03-24

Family

ID=15734800

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860007119A KR900001798B1 (ko) 1986-07-09 1986-08-27 프린트배선판의 제조방법

Country Status (5)

Country Link
JP (1) JPS6317592A (ko)
KR (1) KR900001798B1 (ko)
CN (1) CN86105392A (ko)
DE (1) DE3628340A1 (ko)
GB (1) GB2193727A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100465613B1 (ko) * 2002-11-01 2005-01-13 태창엔지니어링 주식회사 전착 레지스트 코팅장치

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943346A (en) * 1988-09-29 1990-07-24 Siemens Aktiengesellschaft Method for manufacturing printed circuit boards
EP0370133A1 (de) * 1988-11-24 1990-05-30 Siemens Aktiengesellschaft Verfahren zur Herstellung von Leiterplatten
US5268256A (en) * 1990-08-02 1993-12-07 Ppg Industries, Inc. Photoimageable electrodepositable photoresist composition for producing non-tacky films
DE69130691T2 (de) * 1990-08-02 1999-07-22 Ppg Industries Inc Lichtempfindliche, elektroabscheidbare Photoresistzusammensetzung
JPH04146687A (ja) * 1990-10-08 1992-05-20 Nippon Paint Co Ltd ソルダーマスクされた回路基板の製法
US5223116A (en) * 1992-05-11 1993-06-29 Siemens Aktiengesellschaft Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces
CN101144967B (zh) * 2007-06-28 2011-04-06 武汉立胜超滤科技发展有限公司 正性电泳涂料在印制板的图形转移上的电泳涂装方法及成套设备
CN108811359B (zh) * 2018-07-03 2019-11-08 刘平 一种双面和多层印制电路板的生产方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3586263D1 (de) * 1984-03-07 1992-08-06 Ciba Geigy Ag Verfahren zur herstellung von abbildungen.
US4592816A (en) * 1984-09-26 1986-06-03 Rohm And Haas Company Electrophoretic deposition process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100465613B1 (ko) * 2002-11-01 2005-01-13 태창엔지니어링 주식회사 전착 레지스트 코팅장치

Also Published As

Publication number Publication date
JPS6317592A (ja) 1988-01-25
DE3628340A1 (de) 1988-01-21
KR900001798B1 (ko) 1990-03-24
GB8620789D0 (en) 1986-10-08
CN86105392A (zh) 1988-01-27
GB2193727A (en) 1988-02-17

Similar Documents

Publication Publication Date Title
US4705592A (en) Process for producing printed circuits
US4770900A (en) Process and laminate for the manufacture of through-hole plated electric printed-circuit boards
DE69418746T2 (de) Methode zur Herstellung eines Verbundstoffes mit einer Metallschicht auf einer leitfähigen Polymerschicht
KR880701066A (ko) 도체회로판의 제조방법.
KR850001658A (ko) 인쇄 배선판
MY128039A (en) Printed circuit boards and method of producing the same
US3702284A (en) Process of producing plated through-hole printed circuit boards
KR840001047A (ko) 복합 금속 박편을 이용한 인쇄 회로판 제조용 제품 및 그 제조방법
KR860003753A (ko) 동스로우호올프린트 배선판의 제조방법
KR880002413A (ko) 프린트배선판의 제조방법
KR830008634A (ko) 후막파인패턴(thick film fine pattern) 도전체(導電體)의 제조방법
GB1101299A (en) Method of manufacturing an electric circuit unit
GB932210A (en) Improvements in and relating to printed circuits
US3488429A (en) Multilayer printed circuits
EP0402811A3 (en) Method of manufacturing printed circuit boards
GB1134632A (en) Improvements in or relating to the production of printed circuits
GB1209963A (en) Method of manufacturing printed circuits having metallised holes
GB2017416A (en) Circuit board manufacturing method
KR830005811A (ko) 인쇄 회로용 구리박판 및 그의 제조방법
KR890000221B1 (ko) 프린트기판용 프린트잉크와 프린트기판의 제조방법
GB1321010A (en) Method of manufacturing metal core printed circuit board
GB1145771A (en) Electrical circuit boards
JPH02105596A (ja) 印刷配線板の製造方法
KR920011299A (ko) 프린트 기판의 제조방법
JPS6447097A (en) Manufacture of printed wiring board

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19990312

Year of fee payment: 10

LAPS Lapse due to unpaid annual fee