GB1209963A - Method of manufacturing printed circuits having metallised holes - Google Patents

Method of manufacturing printed circuits having metallised holes

Info

Publication number
GB1209963A
GB1209963A GB255968A GB255968A GB1209963A GB 1209963 A GB1209963 A GB 1209963A GB 255968 A GB255968 A GB 255968A GB 255968 A GB255968 A GB 255968A GB 1209963 A GB1209963 A GB 1209963A
Authority
GB
United Kingdom
Prior art keywords
litre
holes
solution
copper
strippable film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB255968A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR91976A external-priority patent/FR1515251A/en
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1209963A publication Critical patent/GB1209963A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1388—Temporary protective conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1415—Applying catalyst after applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1,209,963. Printed circuits. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 17 Jan., 1968 [20 Jan., 1967], No. 2559/68. Heading H1R. [Also in Division C7] In the manufacture of a printed circuit having metallized through holes the printed circuit substrate and conductor forming foil are covered by a protective hydrophobic strippable film prior to the piercing and metallizing of the holes. Example I. (a) A laminated glass fibre reinforced epoxy resin covered on both surfaces with copper foils is coated with a photosensitive lacquer and then developed after exposure to light so that the conductors of the printed circuit pattern to be obtained are not protected. (b) The protected part of the sheet and the positions of the holes to be formed are covered by a plating resist of polymerized lacquer which is coloured so that the places of the holes become visible. (c) A strippable film obtained from a solution of 150 gs./litre nitrocellulose and 30 gs./litre of camphor is coated over the sheet and after drying is dipped in an aluminium stearate solution in toluene of a concentration of 3 gs./litre. (d) After drying the holes are pierced. (e) The walls of the holes are seeded by dipping in a first solution of 0À1 g. of PdCl 2 3mls. of HCl (36%) completed to 1 litre by water and then a second solution of 5À1 gs. of SnCl 2 3À2 mls. of HCl (36%) completed to 1 litre by water. (f) Electroless deposition of copper is then provided by dipping in a solution of 38 gs. of Na-K-tartrate 8À3 gs. of NaOH 5À8 gs. of CuSO 4 .5H 2 O 125 gs. of ethylene diamine tetra acetic acid 34 mls. of formaldehyde (40% solution) completed to 1 litre by water. (g) The strippable film which has no copper coating is pealed off. (h) Copper is electrolytically deposited on the walls of the holes and exposed portions of the copper foil which are to form the conductors and a layer of gold from an acidic gold solution is electrolytically deposited on the copper. (i) The plating resist is removed by dissolution and the copper not coated with gold is dissolved in a solution containing 150 gs./litre of chromic acid 100 gs./litre of sulphuric acid in water. Example II (a) A laminated panel consisting of copper foils and phenol resin impregnated paper is provided on either face with a plating resist as in (a), (b) of Example I. (b) The panel is immersed in a solution of 150 gs./litre of nitrocellulose 30 gs./litre of camphor 1g./litre of aluminium stearate to form a strippable film. (c) The holes are pierced and coated with copper as in (d) (e) (f) of Example I. (d) The strippable film is removed by dissolving. (e) The conductors are formed by operations (h) (i) as in Example I.
GB255968A 1967-01-20 1968-01-17 Method of manufacturing printed circuits having metallised holes Expired GB1209963A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR91976A FR1515251A (en) 1967-01-20 1967-01-20 Method of manufacturing metalized hole printed circuit boards
FR91975A FR1534709A (en) 1967-01-20 1967-01-20 Method of manufacturing printed circuits with metallized holes

Publications (1)

Publication Number Publication Date
GB1209963A true GB1209963A (en) 1970-10-28

Family

ID=26174562

Family Applications (2)

Application Number Title Priority Date Filing Date
GB255968A Expired GB1209963A (en) 1967-01-20 1968-01-17 Method of manufacturing printed circuits having metallised holes
GB256068A Expired GB1207444A (en) 1967-01-20 1968-01-17 Method of manufacturing printed circuits having metallised holes

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB256068A Expired GB1207444A (en) 1967-01-20 1968-01-17 Method of manufacturing printed circuits having metallised holes

Country Status (8)

Country Link
AT (1) AT281169B (en)
BE (2) BE709580A (en)
CH (2) CH471524A (en)
DE (2) DE1665276A1 (en)
ES (2) ES349469A1 (en)
FR (1) FR1534709A (en)
GB (2) GB1209963A (en)
NL (2) NL6800575A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4085285A (en) * 1973-11-29 1978-04-18 U.S. Philips Corporation Method of manufacturing printed circuit boards
US4619887A (en) * 1985-09-13 1986-10-28 Texas Instruments Incorporated Method of plating an interconnect metal onto a metal in VLSI devices
CN110201864A (en) * 2019-06-20 2019-09-06 四川轻化工大学 Copper-containing antibacterial self-cleaning coating, preparation method and application thereof

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932915B2 (en) * 1981-07-25 1984-08-11 「弐」夫 甲斐 Method for manufacturing wiring board with through holes
GB2118369B (en) * 1982-04-06 1986-05-21 Kanto Kasei Company Limited Making printed circuit boards
GB2141879B (en) * 1983-06-01 1988-03-09 Ferranti Plc Manufacture of printed circuit boards
DE102005032019A1 (en) * 2005-07-01 2007-01-04 Siemens Ag A method of depositing a material into a hole in an electrically conductive workpiece

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4085285A (en) * 1973-11-29 1978-04-18 U.S. Philips Corporation Method of manufacturing printed circuit boards
US4619887A (en) * 1985-09-13 1986-10-28 Texas Instruments Incorporated Method of plating an interconnect metal onto a metal in VLSI devices
CN110201864A (en) * 2019-06-20 2019-09-06 四川轻化工大学 Copper-containing antibacterial self-cleaning coating, preparation method and application thereof
CN110201864B (en) * 2019-06-20 2022-05-20 四川轻化工大学 Copper-containing antibacterial self-cleaning coating, preparation method and application thereof

Also Published As

Publication number Publication date
CH471524A (en) 1969-04-15
NL6800576A (en) 1968-07-22
FR1534709A (en) 1968-08-02
ES349471A1 (en) 1969-05-01
AT281169B (en) 1970-05-11
BE709580A (en) 1968-07-18
NL6800575A (en) 1968-07-22
GB1207444A (en) 1970-09-30
BE709579A (en) 1968-07-18
ES349469A1 (en) 1969-04-01
CH471523A (en) 1969-05-30
DE1665277A1 (en) 1971-03-11
DE1665276A1 (en) 1971-01-28

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees