FR1534709A - Method of manufacturing printed circuits with metallized holes - Google Patents

Method of manufacturing printed circuits with metallized holes

Info

Publication number
FR1534709A
FR1534709A FR91975A FR91975A FR1534709A FR 1534709 A FR1534709 A FR 1534709A FR 91975 A FR91975 A FR 91975A FR 91975 A FR91975 A FR 91975A FR 1534709 A FR1534709 A FR 1534709A
Authority
FR
France
Prior art keywords
printed circuits
manufacturing printed
metallized holes
metallized
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR91975A
Other languages
French (fr)
Inventor
Cornelis Jouwersma
Bernard Lacruche
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Eclairage et Radio SA
Original Assignee
Philips Eclairage et Radio SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Eclairage et Radio SA filed Critical Philips Eclairage et Radio SA
Priority claimed from FR91976A external-priority patent/FR1515251A/en
Priority to FR91975A priority Critical patent/FR1534709A/en
Priority to NL6800576A priority patent/NL6800576A/xx
Priority to NL6800575A priority patent/NL6800575A/xx
Priority to DE19681665276 priority patent/DE1665276A1/en
Priority to CH68968A priority patent/CH471524A/en
Priority to CH68868A priority patent/CH471523A/en
Priority to GB256068A priority patent/GB1207444A/en
Priority to AT47968A priority patent/AT281169B/en
Priority to GB255968A priority patent/GB1209963A/en
Priority to BE709579D priority patent/BE709579A/xx
Priority to ES349469A priority patent/ES349469A1/en
Priority to ES349471A priority patent/ES349471A1/en
Priority to DE19681665277 priority patent/DE1665277A1/en
Priority to BE709580D priority patent/BE709580A/xx
Publication of FR1534709A publication Critical patent/FR1534709A/en
Application granted granted Critical
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1383—Temporary protective insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1388—Temporary protective conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1415—Applying catalyst after applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR91975A 1967-01-20 1967-01-20 Method of manufacturing printed circuits with metallized holes Expired FR1534709A (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
FR91975A FR1534709A (en) 1967-01-20 1967-01-20 Method of manufacturing printed circuits with metallized holes
NL6800576A NL6800576A (en) 1967-01-20 1968-01-13
NL6800575A NL6800575A (en) 1967-01-20 1968-01-13
DE19681665276 DE1665276A1 (en) 1967-01-20 1968-01-16 Process for the production of planar wiring with metallized holes
GB256068A GB1207444A (en) 1967-01-20 1968-01-17 Method of manufacturing printed circuits having metallised holes
CH68868A CH471523A (en) 1967-01-20 1968-01-17 Process for the production of printed circuit boards with metallized holes
CH68968A CH471524A (en) 1967-01-20 1968-01-17 Process for the production of printed circuit boards with metallized holes
AT47968A AT281169B (en) 1967-01-20 1968-01-17 Process for the production of extensive wiring with metallized holes
GB255968A GB1209963A (en) 1967-01-20 1968-01-17 Method of manufacturing printed circuits having metallised holes
BE709579D BE709579A (en) 1967-01-20 1968-01-18
ES349469A ES349469A1 (en) 1967-01-20 1968-01-18 Method of manufacturing printed circuits having metallised holes
ES349471A ES349471A1 (en) 1967-01-20 1968-01-18 Method of manufacturing printed circuits having metallised holes
DE19681665277 DE1665277A1 (en) 1967-01-20 1968-01-18 Process for the production of planar wiring with metallized holes
BE709580D BE709580A (en) 1967-01-20 1968-01-18

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR91976A FR1515251A (en) 1967-01-20 1967-01-20 Method of manufacturing metalized hole printed circuit boards
FR91975A FR1534709A (en) 1967-01-20 1967-01-20 Method of manufacturing printed circuits with metallized holes

Publications (1)

Publication Number Publication Date
FR1534709A true FR1534709A (en) 1968-08-02

Family

ID=26174562

Family Applications (1)

Application Number Title Priority Date Filing Date
FR91975A Expired FR1534709A (en) 1967-01-20 1967-01-20 Method of manufacturing printed circuits with metallized holes

Country Status (8)

Country Link
AT (1) AT281169B (en)
BE (2) BE709579A (en)
CH (2) CH471523A (en)
DE (2) DE1665276A1 (en)
ES (2) ES349471A1 (en)
FR (1) FR1534709A (en)
GB (2) GB1209963A (en)
NL (2) NL6800576A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0071375A2 (en) * 1981-07-25 1983-02-09 Kazuo Kay Method for manufacturing a circuit board with a through hole

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4085285A (en) * 1973-11-29 1978-04-18 U.S. Philips Corporation Method of manufacturing printed circuit boards
GB2118369B (en) * 1982-04-06 1986-05-21 Kanto Kasei Company Limited Making printed circuit boards
GB2141879B (en) * 1983-06-01 1988-03-09 Ferranti Plc Manufacture of printed circuit boards
US4619887A (en) * 1985-09-13 1986-10-28 Texas Instruments Incorporated Method of plating an interconnect metal onto a metal in VLSI devices
DE102005032019A1 (en) * 2005-07-01 2007-01-04 Siemens Ag A method of depositing a material into a hole in an electrically conductive workpiece
CN110201864B (en) * 2019-06-20 2022-05-20 四川轻化工大学 Copper-containing antibacterial self-cleaning coating, preparation method and application thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0071375A2 (en) * 1981-07-25 1983-02-09 Kazuo Kay Method for manufacturing a circuit board with a through hole
EP0071375A3 (en) * 1981-07-25 1983-08-03 Kazuo Kay Method for manufacturing a circuit board with a through hole

Also Published As

Publication number Publication date
BE709580A (en) 1968-07-18
CH471523A (en) 1969-05-30
DE1665277A1 (en) 1971-03-11
BE709579A (en) 1968-07-18
CH471524A (en) 1969-04-15
GB1207444A (en) 1970-09-30
NL6800575A (en) 1968-07-22
DE1665276A1 (en) 1971-01-28
NL6800576A (en) 1968-07-22
ES349471A1 (en) 1969-05-01
AT281169B (en) 1970-05-11
ES349469A1 (en) 1969-04-01
GB1209963A (en) 1970-10-28

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