CN86105392A - 印刷线路板的制造方法 - Google Patents

印刷线路板的制造方法 Download PDF

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Publication number
CN86105392A
CN86105392A CN198686105392A CN86105392A CN86105392A CN 86105392 A CN86105392 A CN 86105392A CN 198686105392 A CN198686105392 A CN 198686105392A CN 86105392 A CN86105392 A CN 86105392A CN 86105392 A CN86105392 A CN 86105392A
Authority
CN
China
Prior art keywords
resin
printed substrate
laminated board
lining copper
diaphragm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN198686105392A
Other languages
English (en)
Chinese (zh)
Inventor
伊藤喜代之
星野昌弘
小栋功
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kansai Paint Co Ltd
Mitsubishi Electric Corp
Original Assignee
Kansai Paint Co Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kansai Paint Co Ltd, Mitsubishi Electric Corp filed Critical Kansai Paint Co Ltd
Publication of CN86105392A publication Critical patent/CN86105392A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/164—Coating processes; Apparatus therefor using electric, electrostatic or magnetic means; powder coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/135—Electrophoretic deposition of insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN198686105392A 1986-07-09 1986-08-26 印刷线路板的制造方法 Pending CN86105392A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61161422A JPS6317592A (ja) 1986-07-09 1986-07-09 プリント配線板の製造方法
JP161422/86 1986-07-09

Publications (1)

Publication Number Publication Date
CN86105392A true CN86105392A (zh) 1988-01-27

Family

ID=15734800

Family Applications (1)

Application Number Title Priority Date Filing Date
CN198686105392A Pending CN86105392A (zh) 1986-07-09 1986-08-26 印刷线路板的制造方法

Country Status (5)

Country Link
JP (1) JPS6317592A (ko)
KR (1) KR900001798B1 (ko)
CN (1) CN86105392A (ko)
DE (1) DE3628340A1 (ko)
GB (1) GB2193727A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101144967B (zh) * 2007-06-28 2011-04-06 武汉立胜超滤科技发展有限公司 正性电泳涂料在印制板的图形转移上的电泳涂装方法及成套设备
CN108811359B (zh) * 2018-07-03 2019-11-08 刘平 一种双面和多层印制电路板的生产方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4943346A (en) * 1988-09-29 1990-07-24 Siemens Aktiengesellschaft Method for manufacturing printed circuit boards
EP0370133A1 (de) * 1988-11-24 1990-05-30 Siemens Aktiengesellschaft Verfahren zur Herstellung von Leiterplatten
ES2126558T3 (es) * 1990-08-02 1999-04-01 Ppg Industries Inc Composicion fotosensible electrodepositable que forman materia para fotoreserva.
US5268256A (en) * 1990-08-02 1993-12-07 Ppg Industries, Inc. Photoimageable electrodepositable photoresist composition for producing non-tacky films
JPH04146687A (ja) * 1990-10-08 1992-05-20 Nippon Paint Co Ltd ソルダーマスクされた回路基板の製法
US5223116A (en) * 1992-05-11 1993-06-29 Siemens Aktiengesellschaft Apparatus for electrophoretic application of a lacquer onto plate-shaped work pieces
KR100465613B1 (ko) * 2002-11-01 2005-01-13 태창엔지니어링 주식회사 전착 레지스트 코팅장치

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3586263D1 (de) * 1984-03-07 1992-08-06 Ciba Geigy Ag Verfahren zur herstellung von abbildungen.
US4592816A (en) * 1984-09-26 1986-06-03 Rohm And Haas Company Electrophoretic deposition process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101144967B (zh) * 2007-06-28 2011-04-06 武汉立胜超滤科技发展有限公司 正性电泳涂料在印制板的图形转移上的电泳涂装方法及成套设备
CN108811359B (zh) * 2018-07-03 2019-11-08 刘平 一种双面和多层印制电路板的生产方法

Also Published As

Publication number Publication date
DE3628340A1 (de) 1988-01-21
KR880002413A (ko) 1988-04-30
GB8620789D0 (en) 1986-10-08
GB2193727A (en) 1988-02-17
JPS6317592A (ja) 1988-01-25
KR900001798B1 (ko) 1990-03-24

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