KR880701066A - 도체회로판의 제조방법. - Google Patents

도체회로판의 제조방법.

Info

Publication number
KR880701066A
KR880701066A KR870700863A KR870700863A KR880701066A KR 880701066 A KR880701066 A KR 880701066A KR 870700863 A KR870700863 A KR 870700863A KR 870700863 A KR870700863 A KR 870700863A KR 880701066 A KR880701066 A KR 880701066A
Authority
KR
South Korea
Prior art keywords
conductor circuit
manufacturing
circuit board
mentioned
metal layer
Prior art date
Application number
KR870700863A
Other languages
English (en)
Other versions
KR910007473B1 (ko
Inventor
다쓰오 와다
게이조오 야마시다
다스구 도오야마
데루아끼 야마모도
Original Assignee
나야 유이찌로오
메이꼬 덴시 고오교오 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나야 유이찌로오, 메이꼬 덴시 고오교오 가부시기가이샤 filed Critical 나야 유이찌로오
Publication of KR880701066A publication Critical patent/KR880701066A/ko
Application granted granted Critical
Publication of KR910007473B1 publication Critical patent/KR910007473B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Laminated Bodies (AREA)

Abstract

내용 없음

Description

도체회로판의 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는, 본 발명에 관한 도체회로판의 제조방법의 제조수순을 표시한 공정순서도.

Claims (8)

  1. 표면조도 0.08∼0.23㎛의 평면상태의 도전기재를 음극로하고, 이 음극과 평판상태의 양극을 전극간의 거리 3∼30㎜만 이간시켜, 이들의 전극에 대한 전해액의 접액속도가 2.6∼20.0m/sec로 되게 전해액을 강제적으로 공급하고 전류밀도 0.15∼4.0A/㎠의 조건으로 전해도금을 가해서 전술한 도전기재에 1∼5㎛의 박막금속층을 형성하는 공정과 형성한 박막금속층의 도체회로를 형성하는 부분을 제외한 표면에 레지스트 마스크를 형성하는 공정, 또 레지스트 마스크를 형성한 박막금속층표면에, 구리이온을 함유하는 전해액을 사용해서 전술한 전해도금 조건과 같은 조건으로 전해도금을 가해서 도체회로를 형성하는 공정 또 형성한 도체회로 표면에 조면화 처리를 가하는 공정 또 이와 같이 형성된 도체회로를 끼고 전술한 도전기재에 절연기재를 적층해서 일체로 가열압착하는 공정, 또 전술한 도전기재만을 벗겨져 떨어지게 하는 공정, 또 전술한 박막금속층을 전해적 또는 화학적작용에서 제거하는 공정 등에서 이루어지는 것을 특징으로 하는 도체회로판의 제조방법.
  2. 제 1 항에 있어서, 전술한 도체회로 표면에 구리이온과 초산이온을 함유하는 산성전해액을 사용하여, 전류밀도 0.25∼0.85A/㎠, 전술한 전극에 대한 전술하니 산성전해액의 접액속도 0.1∼0.8m/sec, 전극간 거리 26∼50㎜의 조건으로 퇴적말의 두께가 2∼5㎛로 될때까지 조면화 처리를 가하는 것을 특징으로 하는 도체회로판의 제조방법.
  3. 제 2 항에 있어서, 전술한 조면화 처리를 가한 후 더한층 전술한 도체회로 표면에 크롬산염용액 처리를 가하는 것을 특징으로 하는 도체회로판의 제조방법.
  4. 제 1 항 기재에 있어서, 전술한 음극 및 양극을 함께 고정해서, 이들의 전극간에 전술한 전해액을 강제적으로 공급하는 것을 특징으로 하는 도체회로판의 제조방법.
  5. 제 1 항 기재에 있어서, 전술한 음극을, 전술한 전해액의 접액속도가 이루어지게 회전시키는 것을 특징으로 하는 도체회로판의 제조방법.
  6. 제 1 항 기재에 있어서, 전술한 박막금속층의 전해적 또는 화학적작용에서 제거한 후, 전술한 도체회로를 오우버레이로 적측피복하는 것을 특징으로 하는 도체회로판의 제조방법.
  7. 제 1 항 내지 제 6 항의 어느 한 항에 있어서, 전술한 절연기재의 가열압착전에 전술한 레지스트 마스크를 제거하고, 전술한 도체회로 박막금속층 및 도전기재를 일체로 전술한 절연기재에 가열압착하는 것을 특징으로 하는 도체회로판의 제조방법.
  8. 제 1 항 내지 제 6 항의 어느 한 항에 있어서, 전술한 도체회로,레지스트 마스크, 박막금속층 및 도전기재를 일체로 전술한 절연기재로 가열압착하는 것을 특징으로 하는 도체회로판의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870700863A 1986-02-21 1987-02-21 도체회로판의 제조방법 KR910007473B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP3671286 1986-02-21
JP36712 1986-02-21
JP86-36712 1986-02-21
PCT/JP1987/000111 WO1987005182A1 (en) 1986-02-21 1987-02-21 Method of producing conductor circuit boards

Publications (2)

Publication Number Publication Date
KR880701066A true KR880701066A (ko) 1988-04-22
KR910007473B1 KR910007473B1 (ko) 1991-09-26

Family

ID=12477371

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870700863A KR910007473B1 (ko) 1986-02-21 1987-02-21 도체회로판의 제조방법

Country Status (6)

Country Link
US (1) US4790902A (ko)
EP (1) EP0258451B1 (ko)
JP (2) JPS62276894A (ko)
KR (1) KR910007473B1 (ko)
DE (1) DE3787779T2 (ko)
WO (1) WO1987005182A1 (ko)

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Also Published As

Publication number Publication date
KR910007473B1 (ko) 1991-09-26
JPH0466399B2 (ko) 1992-10-23
EP0258451A1 (en) 1988-03-09
DE3787779T2 (de) 1994-05-05
WO1987005182A1 (en) 1987-08-27
JPS62276893A (ja) 1987-12-01
JPH06101616B2 (ja) 1994-12-12
DE3787779D1 (de) 1993-11-18
JPS62276894A (ja) 1987-12-01
EP0258451B1 (en) 1993-10-13
EP0258451A4 (en) 1989-01-19
US4790902A (en) 1988-12-13

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