FI20045501A - Johdinkuvio, kytkentäalusta ja johdinkuvion ja kytkentäalustan valmistusmenetelmä - Google Patents

Johdinkuvio, kytkentäalusta ja johdinkuvion ja kytkentäalustan valmistusmenetelmä Download PDF

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Publication number
FI20045501A
FI20045501A FI20045501A FI20045501A FI20045501A FI 20045501 A FI20045501 A FI 20045501A FI 20045501 A FI20045501 A FI 20045501A FI 20045501 A FI20045501 A FI 20045501A FI 20045501 A FI20045501 A FI 20045501A
Authority
FI
Finland
Prior art keywords
wiring
patterns
making
harnesses
harness
Prior art date
Application number
FI20045501A
Other languages
English (en)
Swedish (sv)
Other versions
FI20045501A0 (fi
Inventor
Juha Hagberg
Seppo Ilmari Leppaevuori
Teija Kekonen
Janne Mettovaara
Original Assignee
Aspocomp Technology Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aspocomp Technology Oy filed Critical Aspocomp Technology Oy
Priority to FI20045501A priority Critical patent/FI20045501A/fi
Publication of FI20045501A0 publication Critical patent/FI20045501A0/fi
Priority to PCT/FI2005/050466 priority patent/WO2006067280A1/en
Publication of FI20045501A publication Critical patent/FI20045501A/fi

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
FI20045501A 2004-12-23 2004-12-23 Johdinkuvio, kytkentäalusta ja johdinkuvion ja kytkentäalustan valmistusmenetelmä FI20045501A (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20045501A FI20045501A (fi) 2004-12-23 2004-12-23 Johdinkuvio, kytkentäalusta ja johdinkuvion ja kytkentäalustan valmistusmenetelmä
PCT/FI2005/050466 WO2006067280A1 (en) 2004-12-23 2005-12-20 Conductive pattern, circuit board and their production method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20045501A FI20045501A (fi) 2004-12-23 2004-12-23 Johdinkuvio, kytkentäalusta ja johdinkuvion ja kytkentäalustan valmistusmenetelmä

Publications (2)

Publication Number Publication Date
FI20045501A0 FI20045501A0 (fi) 2004-12-23
FI20045501A true FI20045501A (fi) 2006-06-24

Family

ID=33548097

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20045501A FI20045501A (fi) 2004-12-23 2004-12-23 Johdinkuvio, kytkentäalusta ja johdinkuvion ja kytkentäalustan valmistusmenetelmä

Country Status (2)

Country Link
FI (1) FI20045501A (fi)
WO (1) WO2006067280A1 (fi)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101636041B (zh) * 2008-07-24 2011-05-11 富葵精密组件(深圳)有限公司 基板表面平坦化系统及基板表面平坦化方法
EP2240005A1 (en) 2009-04-09 2010-10-13 ATOTECH Deutschland GmbH A method of manufacturing a circuit carrier layer and a use of said method for manufacturing a circuit carrier
US8687369B2 (en) 2012-02-20 2014-04-01 Apple Inc. Apparatus for creating resistive pathways
KR101466759B1 (ko) * 2012-11-07 2014-11-28 주식회사 잉크테크 금속 인쇄회로기판의 제조방법
KR102035378B1 (ko) * 2015-06-08 2019-11-18 주식회사 엘지화학 금속배선층이 형성된 적층체 및 이를 제조하는 방법
CN107484334A (zh) * 2016-06-07 2017-12-15 鹏鼎控股(深圳)股份有限公司 电路板及电路板制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL108173C (fi) * 1954-06-25
US3024151A (en) * 1957-09-30 1962-03-06 Automated Circuits Inc Printed electrical circuits and method of making the same
US4606787A (en) * 1982-03-04 1986-08-19 Etd Technology, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
JPS60147192A (ja) * 1984-01-11 1985-08-03 株式会社日立製作所 プリント配線板の製造方法
JPH06101616B2 (ja) * 1986-02-21 1994-12-12 名幸電子工業株式会社 導体回路板の製造方法
JPH0964514A (ja) * 1995-08-29 1997-03-07 Matsushita Electric Works Ltd プリント配線板の製造方法
US6871396B2 (en) * 2000-02-09 2005-03-29 Matsushita Electric Industrial Co., Ltd. Transfer material for wiring substrate
JP2003347149A (ja) * 2002-05-23 2003-12-05 Nitto Denko Corp 金属転写シート、金属転写シートの製造方法およびセラミックコンデンサの製造方法
WO2004014114A1 (ja) * 2002-07-31 2004-02-12 Sony Corporation 素子内蔵基板の製造方法および素子内蔵基板、ならびに、プリント配線板の製造方法およびプリント配線板
US6898850B2 (en) * 2002-08-06 2005-05-31 Matsushita Electric Industrial Co., Ltd. Method of manufacturing circuit board and communication appliance

Also Published As

Publication number Publication date
FI20045501A0 (fi) 2004-12-23
WO2006067280A1 (en) 2006-06-29

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