DE69022104D1 - Säulenförmige Lötverbindung. - Google Patents
Säulenförmige Lötverbindung.Info
- Publication number
- DE69022104D1 DE69022104D1 DE69022104T DE69022104T DE69022104D1 DE 69022104 D1 DE69022104 D1 DE 69022104D1 DE 69022104 T DE69022104 T DE 69022104T DE 69022104 T DE69022104 T DE 69022104T DE 69022104 D1 DE69022104 D1 DE 69022104D1
- Authority
- DE
- Germany
- Prior art keywords
- column
- solder connection
- shaped solder
- shaped
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0379—Stacked conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0557—Non-printed masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/347,305 US4914814A (en) | 1989-05-04 | 1989-05-04 | Process of fabricating a circuit package |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69022104D1 true DE69022104D1 (de) | 1995-10-12 |
DE69022104T2 DE69022104T2 (de) | 1996-05-02 |
Family
ID=23363171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69022104T Expired - Lifetime DE69022104T2 (de) | 1989-05-04 | 1990-03-27 | Säulenförmige Lötverbindung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4914814A (de) |
EP (1) | EP0396484B1 (de) |
JP (2) | JPH0738432B2 (de) |
DE (1) | DE69022104T2 (de) |
Families Citing this family (88)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5476211A (en) * | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
AU637874B2 (en) * | 1990-01-23 | 1993-06-10 | Sumitomo Electric Industries, Ltd. | Substrate for packaging a semiconductor device |
US5056216A (en) * | 1990-01-26 | 1991-10-15 | Sri International | Method of forming a plurality of solder connections |
US5233504A (en) * | 1990-12-06 | 1993-08-03 | Motorola, Inc. | Noncollapsing multisolder interconnection |
US5154341A (en) * | 1990-12-06 | 1992-10-13 | Motorola Inc. | Noncollapsing multisolder interconnection |
US5133495A (en) * | 1991-08-12 | 1992-07-28 | International Business Machines Corporation | Method of bonding flexible circuit to circuitized substrate to provide electrical connection therebetween |
US5203075A (en) * | 1991-08-12 | 1993-04-20 | Inernational Business Machines | Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders |
US5186383A (en) * | 1991-10-02 | 1993-02-16 | Motorola, Inc. | Method for forming solder bump interconnections to a solder-plated circuit trace |
US5372295A (en) * | 1991-10-04 | 1994-12-13 | Ryoden Semiconductor System Engineering Corporation | Solder material, junctioning method, junction material, and semiconductor device |
US5177863A (en) * | 1992-03-27 | 1993-01-12 | Atmel Corporation | Method of forming integrated leadouts for a chip carrier |
US5269453A (en) * | 1992-04-02 | 1993-12-14 | Motorola, Inc. | Low temperature method for forming solder bump interconnections to a plated circuit trace |
US5324892A (en) * | 1992-08-07 | 1994-06-28 | International Business Machines Corporation | Method of fabricating an electronic interconnection |
US5282565A (en) * | 1992-12-29 | 1994-02-01 | Motorola, Inc. | Solder bump interconnection formed using spaced solder deposit and consumable path |
US5324569A (en) * | 1993-02-26 | 1994-06-28 | Hewlett-Packard Company | Composite transversely plastic interconnect for microchip carrier |
JPH06296080A (ja) * | 1993-04-08 | 1994-10-21 | Sony Corp | 電子部品実装基板及び電子部品実装方法 |
US5570032A (en) * | 1993-08-17 | 1996-10-29 | Micron Technology, Inc. | Wafer scale burn-in apparatus and process |
US5442852A (en) * | 1993-10-26 | 1995-08-22 | Pacific Microelectronics Corporation | Method of fabricating solder ball array |
US5591941A (en) * | 1993-10-28 | 1997-01-07 | International Business Machines Corporation | Solder ball interconnected assembly |
US7084656B1 (en) | 1993-11-16 | 2006-08-01 | Formfactor, Inc. | Probe for semiconductor devices |
US5820014A (en) | 1993-11-16 | 1998-10-13 | Form Factor, Inc. | Solder preforms |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US7200930B2 (en) * | 1994-11-15 | 2007-04-10 | Formfactor, Inc. | Probe for semiconductor devices |
US5385291A (en) * | 1994-01-10 | 1995-01-31 | Micron Custom Manufacturing Services, Inc. | Method employing an elevating of atmospheric pressure during the heating and/or cooling phases of ball grid array (BGA) soldering of an IC device to a PCB |
US5813115A (en) * | 1994-08-03 | 1998-09-29 | Matsushita Electric Industrial Co., Ltd. | Method of mounting a semiconductor chip on a wiring substrate |
US6852814B2 (en) * | 1994-09-02 | 2005-02-08 | Henkel Corporation | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
US5789757A (en) * | 1996-09-10 | 1998-08-04 | The Dexter Corporation | Malemide containing formulations and uses therefor |
US7645899B1 (en) | 1994-09-02 | 2010-01-12 | Henkel Corporation | Vinyl compounds |
US6960636B2 (en) | 1994-09-02 | 2005-11-01 | Henkel Corporation | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
CA2135508C (en) * | 1994-11-09 | 1998-11-03 | Robert J. Lyn | Method for forming solder balls on a semiconductor substrate |
US5514838A (en) * | 1994-09-27 | 1996-05-07 | Hughes Aircraft Company | Circuit structure with non-migrating silver contacts |
AU4160096A (en) * | 1994-11-15 | 1996-06-06 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US5623127A (en) * | 1994-12-02 | 1997-04-22 | Motorola, Inc. | Single alloy solder clad substrate |
GB9425986D0 (en) * | 1994-12-22 | 1995-02-22 | Pilkington Glass Ltd | Electrically heated window |
US5861663A (en) * | 1994-12-27 | 1999-01-19 | International Business Machines Corporation | Column grid array or ball grid array pad on via |
JPH0997791A (ja) * | 1995-09-27 | 1997-04-08 | Internatl Business Mach Corp <Ibm> | バンプ構造、バンプの形成方法、実装接続体 |
US5872051A (en) * | 1995-08-02 | 1999-02-16 | International Business Machines Corporation | Process for transferring material to semiconductor chip conductive pads using a transfer substrate |
US5718361A (en) * | 1995-11-21 | 1998-02-17 | International Business Machines Corporation | Apparatus and method for forming mold for metallic material |
US5994152A (en) | 1996-02-21 | 1999-11-30 | Formfactor, Inc. | Fabricating interconnects and tips using sacrificial substrates |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
JP3116273B2 (ja) * | 1996-04-26 | 2000-12-11 | 日本特殊陶業株式会社 | 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体 |
JP3145331B2 (ja) * | 1996-04-26 | 2001-03-12 | 日本特殊陶業株式会社 | 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体および中継基板と取付基板の接続体の製造方法 |
US6395991B1 (en) | 1996-07-29 | 2002-05-28 | International Business Machines Corporation | Column grid array substrate attachment with heat sink stress relief |
US20030055121A1 (en) * | 1996-09-10 | 2003-03-20 | Dershem Stephen M. | Thermosetting resin compositions containing maleimide and/or vinyl compounds |
US5918516A (en) * | 1997-02-07 | 1999-07-06 | Unisys Corporation | Method of forming I/O columns with open ends that are free of crater-like voids |
JP3173410B2 (ja) * | 1997-03-14 | 2001-06-04 | 松下電器産業株式会社 | パッケージ基板およびその製造方法 |
US7654432B2 (en) | 1997-05-27 | 2010-02-02 | Wstp, Llc | Forming solder balls on substrates |
US7819301B2 (en) * | 1997-05-27 | 2010-10-26 | Wstp, Llc | Bumping electronic components using transfer substrates |
US7288471B2 (en) * | 1997-05-27 | 2007-10-30 | Mackay John | Bumping electronic components using transfer substrates |
US6293456B1 (en) | 1997-05-27 | 2001-09-25 | Spheretek, Llc | Methods for forming solder balls on substrates |
US7007833B2 (en) | 1997-05-27 | 2006-03-07 | Mackay John | Forming solder balls on substrates |
US7842599B2 (en) * | 1997-05-27 | 2010-11-30 | Wstp, Llc | Bumping electronic components using transfer substrates |
US6609652B2 (en) | 1997-05-27 | 2003-08-26 | Spheretek, Llc | Ball bumping substrates, particuarly wafers |
US6162661A (en) * | 1997-05-30 | 2000-12-19 | Tessera, Inc. | Spacer plate solder ball placement fixture and methods therefor |
CA2210063A1 (en) * | 1997-07-08 | 1999-01-08 | Ibm Canada Limited-Ibm Canada Limitee | Method of manufacturing wire segments of homogeneous composition |
US6121358A (en) * | 1997-09-22 | 2000-09-19 | The Dexter Corporation | Hydrophobic vinyl monomers, formulations containing same, and uses therefor |
US6016947A (en) * | 1997-10-21 | 2000-01-25 | International Business Machines Corporation | Non-destructive low melt test for off-composition solder |
US6053394A (en) * | 1998-01-13 | 2000-04-25 | International Business Machines Corporation | Column grid array substrate attachment with heat sink stress relief |
US6105852A (en) | 1998-02-05 | 2000-08-22 | International Business Machines Corporation | Etched glass solder bump transfer for flip chip integrated circuit devices |
US6105851A (en) * | 1998-08-07 | 2000-08-22 | Unisys Corp | Method of casting I/O columns on an electronic component with a high yield |
US6595408B1 (en) * | 1998-10-07 | 2003-07-22 | Micron Technology, Inc. | Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement |
US6268275B1 (en) | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
US6281452B1 (en) | 1998-12-03 | 2001-08-28 | International Business Machines Corporation | Multi-level thin-film electronic packaging structure and related method |
US6657313B1 (en) * | 1999-01-19 | 2003-12-02 | International Business Machines Corporation | Dielectric interposer for chip to substrate soldering |
US6531664B1 (en) * | 1999-04-05 | 2003-03-11 | Delphi Technologies, Inc. | Surface mount devices with solder |
US6583354B2 (en) | 1999-04-27 | 2003-06-24 | International Business Machines Corporation | Method of reforming reformable members of an electronic package and the resultant electronic package |
US6303991B1 (en) * | 1999-05-27 | 2001-10-16 | Fci Americas Technology, Inc. | Electronic package and contact therefor |
JP3288654B2 (ja) | 1999-07-23 | 2002-06-04 | ヒロセ電機株式会社 | 電気コネクタの製造方法 |
US6450397B1 (en) * | 1999-09-01 | 2002-09-17 | Texas Instruments Incorporated | Method of making ball grid array columns |
JP3403677B2 (ja) * | 1999-09-06 | 2003-05-06 | マイクロ・テック株式会社 | 半田ボール形成方法 |
US20010018800A1 (en) * | 1999-09-17 | 2001-09-06 | George Tzanavaras | Method for forming interconnects |
US6090633A (en) * | 1999-09-22 | 2000-07-18 | International Business Machines Corporation | Multiple-plane pair thin-film structure and process of manufacture |
US6429388B1 (en) * | 2000-05-03 | 2002-08-06 | International Business Machines Corporation | High density column grid array connections and method thereof |
US6651322B1 (en) * | 2000-12-28 | 2003-11-25 | Unisys Corporation | Method of reworking a multilayer printed circuit board assembly |
US6770184B1 (en) | 2001-02-13 | 2004-08-03 | Advanced Micro Devices, Inc. | Integrated de-ionized water pressure monitoring system for solder plating machines |
US6425518B1 (en) | 2001-07-25 | 2002-07-30 | International Business Machines Corporation | Method and apparatus for applying solder to an element on a substrate |
US6550666B2 (en) * | 2001-08-21 | 2003-04-22 | Advanpack Solutions Pte Ltd | Method for forming a flip chip on leadframe semiconductor package |
TW526571B (en) * | 2002-02-27 | 2003-04-01 | Advanced Semiconductor Eng | Metal pillar bonding structure in between substrates |
US7523852B2 (en) * | 2004-12-05 | 2009-04-28 | International Business Machines Corporation | Solder interconnect structure and method using injection molded solder |
WO2006112384A1 (ja) * | 2005-04-15 | 2006-10-26 | Matsushita Electric Industrial Co., Ltd. | 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法 |
US7700884B2 (en) * | 2005-12-02 | 2010-04-20 | Honeywell International Inc. | Column grid array using compliant core |
US20070152023A1 (en) * | 2005-12-30 | 2007-07-05 | Semx Corporation | Solder deposit method on electronic packages for post-connection process |
US7946470B2 (en) * | 2005-12-30 | 2011-05-24 | Semx Corporation | Method for depositing solder material on an electronic component part using separators |
EP2078578A1 (de) * | 2008-01-10 | 2009-07-15 | Siemens Aktiengesellschaft | Belotung von Löchern, Verfahren zum Beschichten und Lotgutstäbchen |
US20090279275A1 (en) * | 2008-05-09 | 2009-11-12 | Stephen Peter Ayotte | Method of attaching an integrated circuit chip to a module |
US20100031501A1 (en) * | 2008-08-08 | 2010-02-11 | Napra Co., Ltd. | Method for filling through hole or non-through hole formed on board with filler |
JP6623508B2 (ja) * | 2014-09-30 | 2019-12-25 | 日亜化学工業株式会社 | 光源及びその製造方法、実装方法 |
US10157821B1 (en) * | 2017-05-30 | 2018-12-18 | Advanced Semiconductor Engineering, Inc. | Semiconductor packages |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4332341A (en) * | 1979-12-26 | 1982-06-01 | Bell Telephone Laboratories, Incorporated | Fabrication of circuit packages using solid phase solder bonding |
US4371912A (en) * | 1980-10-01 | 1983-02-01 | Motorola, Inc. | Method of mounting interrelated components |
US4412642A (en) * | 1982-03-15 | 1983-11-01 | Western Electric Co., Inc. | Cast solder leads for leadless semiconductor circuits |
JPS6146365A (ja) * | 1984-08-08 | 1986-03-06 | Mazda Motor Corp | 射出成形機のガス抜き装置 |
US4581680A (en) * | 1984-12-31 | 1986-04-08 | Gte Communication Systems Corporation | Chip carrier mounting arrangement |
JPS61296729A (ja) * | 1985-06-26 | 1986-12-27 | Fujitsu Ltd | 集積回路接続部の形成方法 |
WO1987000686A1 (en) * | 1985-07-16 | 1987-01-29 | Nippon Telegraph And Telephone Corporation | Connection terminals between substrates and method of producing the same |
JPS62296495A (ja) * | 1986-05-12 | 1987-12-23 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 部品を制御回路上の表面のはんだパツドに取付ける方法 |
US4763829A (en) * | 1986-06-04 | 1988-08-16 | American Telephone And Telegraph Company, At&T Bell Laboratories | Soldering of electronic components |
-
1989
- 1989-05-04 US US07/347,305 patent/US4914814A/en not_active Expired - Lifetime
-
1990
- 1990-03-27 EP EP90480051A patent/EP0396484B1/de not_active Expired - Lifetime
- 1990-03-27 DE DE69022104T patent/DE69022104T2/de not_active Expired - Lifetime
- 1990-05-02 JP JP2115377A patent/JPH0738432B2/ja not_active Expired - Fee Related
-
1996
- 1996-06-03 JP JP8139979A patent/JPH09129807A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH09129807A (ja) | 1997-05-16 |
EP0396484A2 (de) | 1990-11-07 |
JPH02306655A (ja) | 1990-12-20 |
DE69022104T2 (de) | 1996-05-02 |
EP0396484A3 (de) | 1992-01-08 |
JPH0738432B2 (ja) | 1995-04-26 |
US4914814A (en) | 1990-04-10 |
EP0396484B1 (de) | 1995-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69022104D1 (de) | Säulenförmige Lötverbindung. | |
FI906314A0 (fi) | Elektroniskt artikeloevervakningssystem innehaollande en extra givare. | |
FI901303A0 (fi) | Foerfarande foer att bombera glasskivor. | |
DE69020982D1 (de) | Vulkanisierungsform. | |
FI920855A0 (fi) | Anordning foer att foergasa flyktiga vaetskor. | |
DE59003933D1 (de) | Bauelement. | |
DE58900451D1 (de) | Loetverbindung. | |
DE69017601D1 (de) | Schaltungsanordnung. | |
DE69008464D1 (de) | Schaltungsanordnung. | |
FI914207A0 (fi) | Anordning foer att ansluta material- banor. | |
DE58904251D1 (de) | Loetkolben. | |
FI920182A0 (fi) | Anordning foer att maeta gasers fukthalt. | |
DE69023725D1 (de) | Verstärkerschaltung. | |
DE69023704D1 (de) | Verstärkerschaltung. | |
FI890299A (fi) | Form. | |
FI902357A0 (fi) | Diazepinherbicider. | |
DE3780699D1 (de) | Loetverfahren. | |
DE69023612D1 (de) | Integrierte Schaltung. | |
FI914230A0 (fi) | Kopplingsanordning. | |
FI902040A0 (fi) | Foerfarande foer att framstaella tunnfilmresistansskikt. | |
FI890300A (fi) | Form. | |
FI891881A (fi) | Foerfarande foer att skydda datatrafikfoerbindelser. | |
DE69019015D1 (de) | Verstärkerschaltung. | |
FI901851A0 (fi) | Extra stroemkaella foer foerprocessor. | |
FI906031A (fi) | Hydrerade kvaeveheterocykler. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8330 | Complete disclaimer |