JP5561922B2 - パワー半導体装置 - Google Patents
パワー半導体装置 Download PDFInfo
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- JP5561922B2 JP5561922B2 JP2008239098A JP2008239098A JP5561922B2 JP 5561922 B2 JP5561922 B2 JP 5561922B2 JP 2008239098 A JP2008239098 A JP 2008239098A JP 2008239098 A JP2008239098 A JP 2008239098A JP 5561922 B2 JP5561922 B2 JP 5561922B2
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Description
(実施の形態1)
図1は本発明の実施の形態1におけるパワー半導体装置としてのモジュールの模式的な構成を示す概略平面図である。また図2は図1におけるパワー半導体装置の等価回路を示す図である。図1および図2を参照して、このモジュール100はパワーモジュールであり、パワーデバイス20と、還流ダイオード30と、抵抗素子40とを主に有している。
図5は図3および図4に示すパワーデバイスが形成されたチップのセル領域の構成を概略的に示す一部破断斜視図である。また図6は図5のVI−VI線に沿う概略断面図である。図5および図6を参照して、セル領域においては、たとえばシリコンよりなる半導体基板1に、縦型パワーデバイスの複数のユニットセルが形成されている。この縦型パワーデバイスはたとえば縦型IGBTである。
外周部PRの付近には能動領域ではないガードリング領域があることから、外周部PRのセル構造は熱放散がよく、熱抵抗が小さい。これに対して、中央部CRではセル構造の周囲に能動領域である他のセル構造が配置されているため、これらのセル構造間で相互に熱干渉が生じる。
図10は、本発明の実施の形態2におけるパワー半導体装置の構成を概略的に示す部分断面図であり、図3のX−X線に沿う断面に対応する図である。本実施の形態では、実施の形態1の構成と比較して、通電能力を異ならせる対象において相違している。つまり、図10を参照して、本実施の形態においては、エミッタワイヤ21の接合部の直下に位置するセル構造が、エミッタワイヤ21の接合部の直下以外に位置する他のセル構造の通電能力よりも低い通電能力を有するように構成されている。
IGBTチップのエミッタパッド11とエミッタワイヤ21との接合部には電流が集中する。これにより、エミッタワイヤ21の接合部では温度が他の領域よりも高くなる。またIGBTのユニットセルの温度が高くなると、そのユニットセルのしきい値電圧などが低下して通電能力が上がることで、エミッタワイヤ21の接合部の温度はさらに高くなる。これにより、ΔTjが大きくなり、パワーサイクル寿命を低下させることがあった。
図11は、本発明の実施の形態3におけるパワー半導体装置の構成を概略的に示す部分断面図である。本実施の形態では、実施の形態1の構成と比較して、通電能力を異ならせる対象において相違している。つまり、図11を参照して、本実施の形態においては、一のエミッタワイヤ21の接合部の直下に位置するセル構造が、他のエミッタワイヤ21の接合部の直下に位置するセル構造の通電能力とは異なる通電能力を有するように構成されている。
IGBTチップに複数のエミッタワイヤ21を接続し、エミッタワイヤ21の各々の配線長が異なる場合において、配線長の長いエミッタワイヤ21に大きな電流が流れると、エミッタワイヤ21自身が発熱する。このエミッタワイヤ21の発熱が、エミッタパッド11とエミッタワイヤ21との接合部の温度Tjに影響を与え、これによりΔTjが大きくなり、パワーサイクル寿命を低下させることがあった。
また上記の実施の形態1〜3においては、縦型のパワーデバイスとして平面(プレーナ)ゲート型のIGBTについて説明したが、本発明は、これに限定されず、図12に示すようなトレンチゲート型のIGBT、図13に示すような平面ゲート型のパワーMISFET(Metal Insulator Semiconductor Field Effect Transistor)、図14に示すようなトレンチゲート型のパワーMISFET、ダイオードなどに適用され得る。
Claims (5)
- 主表面を有する半導体基板と、
前記半導体基板に形成された縦型パワーデバイスの複数のセル構造とを備え、
前記主表面には、一のワイヤ接合部および他のワイヤ接合部を少なくとも含む複数のワイヤ接合部があり、
前記複数のセル構造のうち前記一のワイヤ接合部の直下に位置する一のセル構造は、前記複数のセル構造のうち前記他のワイヤ接合部の直下に位置する他のセル構造の通電能力とは異なる通電能力を有するように構成されており、
前記一のワイヤ接合部に接合される一のワイヤが、前記他のワイヤ接合部に接合される他のワイヤとは異なる配線長を有している、パワー半導体装置。 - 前記一のセル構造および前記他のセル構造の各々は、絶縁ゲート型電界効果トランジスタ部を有し、
前記一のセル構造は、前記他のセル構造のしきい値電圧よりも大きいしきい値電圧を有するように構成されている、請求項1に記載のパワー半導体装置。 - 前記一のセル構造および前記他のセル構造の各々は、絶縁ゲート型電界効果トランジスタ部を有し、
前記一のセル構造は、前記他のセル構造のチャネル幅よりも小さいチャネル幅を有するように構成されている、請求項1に記載のパワー半導体装置。 - 前記一のセル構造および前記他のセル構造の各々は、絶縁ゲート型電界効果トランジスタ部を有し、
前記一のセル構造は、前記他のセル構造のチャネル長よりも大きいチャネル長を有するように構成されている、請求項1に記載のパワー半導体装置。 - 前記一のセル構造および前記他のセル構造の各々はエミッタ領域を有するIGBTであり、
前記一のセル構造の前記エミッタ領域は、前記他のセル構造の前記エミッタ領域の拡散抵抗よりも大きい拡散抵抗を有するように構成されている、請求項1に記載のパワー半導体装置。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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JP2008239098A JP5561922B2 (ja) | 2008-05-20 | 2008-09-18 | パワー半導体装置 |
US12/395,946 US8258601B2 (en) | 2008-05-20 | 2009-03-02 | Power semiconductor device |
EP20100176985 EP2284900A1 (en) | 2008-05-20 | 2009-03-06 | Power semiconductor device |
EP09003307.7A EP2124257B1 (en) | 2008-05-20 | 2009-03-06 | Power semiconductor device |
CN2009101410799A CN101587893B (zh) | 2008-05-20 | 2009-05-20 | 功率半导体装置 |
KR1020090043856A KR101044308B1 (ko) | 2008-05-20 | 2009-05-20 | 파워 반도체장치 |
US13/273,068 US8274137B2 (en) | 2008-05-20 | 2011-10-13 | Power semiconductor device |
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JP2008132151 | 2008-05-20 | ||
JP2008132151 | 2008-05-20 | ||
JP2008239098A JP5561922B2 (ja) | 2008-05-20 | 2008-09-18 | パワー半導体装置 |
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JP2010004003A JP2010004003A (ja) | 2010-01-07 |
JP5561922B2 true JP5561922B2 (ja) | 2014-07-30 |
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US (2) | US8258601B2 (ja) |
EP (2) | EP2124257B1 (ja) |
JP (1) | JP5561922B2 (ja) |
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JP5174085B2 (ja) | 2010-05-20 | 2013-04-03 | 三菱電機株式会社 | 半導体装置 |
DE112011102014T5 (de) * | 2010-06-17 | 2013-07-11 | Abb Technology Ag | Leistungshalbleitervorrichtung |
JP5361808B2 (ja) | 2010-06-23 | 2013-12-04 | 三菱電機株式会社 | 電力用半導体装置 |
JP2012089565A (ja) * | 2010-10-15 | 2012-05-10 | Honda Motor Co Ltd | 半導体装置 |
JP2012099601A (ja) | 2010-11-01 | 2012-05-24 | Sumitomo Electric Ind Ltd | 半導体装置およびその製造方法 |
US9029945B2 (en) | 2011-05-06 | 2015-05-12 | Cree, Inc. | Field effect transistor devices with low source resistance |
US9142662B2 (en) | 2011-05-06 | 2015-09-22 | Cree, Inc. | Field effect transistor devices with low source resistance |
JP2014531752A (ja) * | 2011-09-11 | 2014-11-27 | クリー インコーポレイテッドCree Inc. | 改善したレイアウトを有するトランジスタを備える高電流密度電力モジュール |
US9640617B2 (en) | 2011-09-11 | 2017-05-02 | Cree, Inc. | High performance power module |
US9373617B2 (en) | 2011-09-11 | 2016-06-21 | Cree, Inc. | High current, low switching loss SiC power module |
WO2013124989A1 (ja) * | 2012-02-22 | 2013-08-29 | 三菱電機株式会社 | 半導体装置 |
JP2013258333A (ja) * | 2012-06-13 | 2013-12-26 | Toshiba Corp | 電力用半導体装置 |
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JP4248953B2 (ja) | 2003-06-30 | 2009-04-02 | 株式会社ルネサステクノロジ | 半導体装置およびその製造方法 |
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CN101587893B (zh) | 2012-05-16 |
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EP2124257B1 (en) | 2017-09-27 |
KR20090121239A (ko) | 2009-11-25 |
EP2284900A1 (en) | 2011-02-16 |
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