JP5552748B2 - 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置 - Google Patents

硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置 Download PDF

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JP5552748B2
JP5552748B2 JP2009079948A JP2009079948A JP5552748B2 JP 5552748 B2 JP5552748 B2 JP 5552748B2 JP 2009079948 A JP2009079948 A JP 2009079948A JP 2009079948 A JP2009079948 A JP 2009079948A JP 5552748 B2 JP5552748 B2 JP 5552748B2
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light
phosphor
light emitting
group
emitting device
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JP2009256670A (ja
JP2009256670A5 (enExample
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健一 滝沢
禎昭 古屋敷
博 小林
正人 新原
波奈子 加藤
麻理 阿部
正典 山崎
寛 森
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Mitsubishi Chemical Corp
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Mitsubishi Chemical Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
  • Silicon Polymers (AREA)
JP2009079948A 2008-03-28 2009-03-27 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置 Expired - Fee Related JP5552748B2 (ja)

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JP2009079948A JP5552748B2 (ja) 2008-03-28 2009-03-27 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置

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JP2008088316 2008-03-28
JP2008088316 2008-03-28
JP2009079948A JP5552748B2 (ja) 2008-03-28 2009-03-27 硬化性ポリシロキサン組成物、並びに、それを用いたポリシロキサン硬化物、光学部材、航空宇宙産業用部材、半導体発光装置、照明装置、及び画像表示装置

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JP2009256670A JP2009256670A (ja) 2009-11-05
JP2009256670A5 JP2009256670A5 (enExample) 2012-05-17
JP5552748B2 true JP5552748B2 (ja) 2014-07-16

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US (1) US8629222B2 (enExample)
EP (1) EP2270100A4 (enExample)
JP (1) JP5552748B2 (enExample)
WO (1) WO2009119841A1 (enExample)

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9443903B2 (en) 2006-06-30 2016-09-13 Cree, Inc. Low temperature high strength metal stack for die attachment
US8698184B2 (en) 2011-01-21 2014-04-15 Cree, Inc. Light emitting diodes with low junction temperature and solid state backlight components including light emitting diodes with low junction temperature
CN102020851B (zh) * 2009-09-16 2013-10-16 大连路明发光科技股份有限公司 一种光转换柔性高分子材料及其用途
WO2011065322A1 (ja) * 2009-11-30 2011-06-03 コニカミノルタオプト株式会社 発光ダイオードユニットの製造方法
WO2011065321A1 (ja) * 2009-11-30 2011-06-03 コニカミノルタオプト株式会社 発光ダイオードユニットの製造方法
JP5545246B2 (ja) * 2010-03-30 2014-07-09 信越化学工業株式会社 樹脂組成物及び発光半導体素子用リフレクター、及び発光半導体装置
KR101342287B1 (ko) * 2010-04-28 2013-12-16 미쓰비시 가가꾸 가부시키가이샤 반도체 발광 장치용 패키지 및 발광 장치
JP2011238811A (ja) * 2010-05-12 2011-11-24 Konica Minolta Opto Inc 波長変換素子および発光装置
JP2012021131A (ja) * 2010-06-18 2012-02-02 Mitsubishi Chemicals Corp 半導体発光デバイス部材用２液型硬化性ポリオルガノシロキサン組成物、該組成物を硬化させてなるポリオルガノシロキサン硬化物及びその製造方法
CN102339925B (zh) * 2010-07-22 2015-11-18 赛恩倍吉科技顾问（深圳）有限公司 发光元件封装方法
US8835199B2 (en) * 2010-07-28 2014-09-16 GE Lighting Solutions, LLC Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration
JP5682257B2 (ja) * 2010-07-30 2015-03-11 三菱化学株式会社 半導体発光装置用樹脂組成物
US8835192B2 (en) 2010-08-17 2014-09-16 Konica Minolta, Inc. Method of manufacturing light-emitting device
JP2012089750A (ja) * 2010-10-21 2012-05-10 Hitachi Chem Co Ltd 半導体封止充てん用熱硬化性樹脂組成物及び半導体装置
JP2013541623A (ja) * 2010-11-02 2013-11-14 ヘンケル・チャイナ・カンパニー・リミテッド ヒドロシリコーン樹脂およびその製造方法
KR101719636B1 (ko) 2011-01-28 2017-04-05 삼성전자 주식회사 반도체 장치 및 그 제조 방법
US8754440B2 (en) * 2011-03-22 2014-06-17 Tsmc Solid State Lighting Ltd. Light-emitting diode (LED) package systems and methods of making the same
US8604684B2 (en) * 2011-05-16 2013-12-10 Cree, Inc. UV stable optical element and LED lamp using same
KR101738602B1 (ko) * 2011-10-17 2017-06-08 신에쓰 가가꾸 고교 가부시끼가이샤 축합반응 경화형 실리콘 박리 코팅 조성물
WO2013070227A1 (en) 2011-11-10 2013-05-16 Momentive Performance Materials Inc. Moisture curable composition of a polymer having silyl groups
CN104066509B (zh) 2011-11-10 2016-12-21 莫门蒂夫性能材料股份有限公司 可湿气固化的有机聚硅氧烷组合物
US9663657B2 (en) 2011-12-15 2017-05-30 Momentive Performance Materials Inc. Moisture curable organopolysiloxane compositions
CA2859356A1 (en) 2011-12-15 2013-06-20 Momentive Performance Materials, Inc. Moisture curable organopolysiloxane compositions
CA2861659A1 (en) 2011-12-29 2013-07-04 Momentive Performance Materials, Inc. Moisture curable organopolysiloxane composition
CN104470983A (zh) * 2011-12-29 2015-03-25 3M创新有限公司 可固化聚硅氧烷组合物
WO2013101742A1 (en) * 2011-12-29 2013-07-04 3M Innovative Properties Company Curable-on-demand polysiloxane coating composition
EP2810307A1 (en) * 2012-01-30 2014-12-10 Cree, Inc. Low temperature high strength metal stack for die attachment
JP5583710B2 (ja) 2012-03-22 2014-09-03 信越化学工業株式会社 新規オルガノポリシロキサン、これを含む化粧料及びオルガノポリシロキサンの製造方法
KR20130109759A (ko) * 2012-03-28 2013-10-08 삼성전자주식회사 발광소자 패키지
KR101570753B1 (ko) * 2012-06-05 2015-11-20 다우 코닝 (차이나) 홀딩 코포레이션., 엘티디. 전력 컨버터에서 사용하기 위한 연성 점착성 겔
JP5859421B2 (ja) * 2012-06-05 2016-02-10 信越化学工業株式会社 光半導体封止用硬化性組成物及びこれを用いた光半導体装置
US8822593B2 (en) * 2012-06-22 2014-09-02 Shin-Etsu Chemical Co., Ltd. Curable resin composition, hardened material thereof, and optical semiconductor apparatus
JP6003402B2 (ja) * 2012-08-28 2016-10-05 住友大阪セメント株式会社 光半導体発光装置、照明器具、及び表示装置
TWI460265B (zh) * 2012-11-12 2014-11-11 錸鑽科技股份有限公司 導熱複合材料及其衍生之發光二極體
US9570661B2 (en) 2013-01-10 2017-02-14 Cree, Inc. Protective coating for LED lamp
TW201434882A (zh) 2013-03-13 2014-09-16 Momentive Performance Mat Inc 可濕氣固化之有機聚矽氧烷組成物
US9657922B2 (en) 2013-03-15 2017-05-23 Cree, Inc. Electrically insulative coatings for LED lamp and elements
US9773953B2 (en) 2013-04-01 2017-09-26 Rensselaer Polytechnic Institute Organic phosphor-functionalized nanoparticles and compositions comprising the same
EP2994501A2 (en) 2013-05-10 2016-03-16 Momentive Performance Materials Inc. Non-metal catalyzed room temperature moisture curable organopolysiloxane compositions
WO2015008243A1 (en) * 2013-07-19 2015-01-22 Koninklijke Philips N.V. Pc led with optical element and without substrate carrier
JP6735668B2 (ja) 2013-11-26 2020-08-05 モメンティブ パフォーマンス マテリアルズ インコーポレイテッドＭｏｍｅｎｔｉｖｅ Ｐｅｒｆｏｒｍａｎｃｅ Ｍａｔｅｒｉａｌｓ Ｉｎｃ． 金属−アレーン錯体を有する湿気硬化型組成物
JP2017509730A (ja) 2013-12-31 2017-04-06 スリーエム イノベイティブ プロパティズ カンパニー 硬化性オルガノシロキサンオリゴマー組成物
EP3118277B1 (en) 2014-03-10 2019-10-23 Kyoto University Method for producing surface-modified substrate, method for producing conjugate, novel hydrosilane compound, surface treatment agent, surface treatment agent kit, and surface-modified substrate
CN106661425B (zh) * 2014-07-28 2018-12-21 住友化学株式会社 硅酮系密封材料组合物及半导体发光装置
US9856361B2 (en) * 2014-10-16 2018-01-02 Sumitomo Osaka Cement Co., Ltd. Surface-modified metal oxide particle dispersion liquid, method for producing same, surface-modified metal oxide particle-silicone resin composite composition, surface-modified metal oxide particle-silicone resin composite body, optical member and light emitting device
WO2016120953A1 (ja) 2015-01-26 2016-08-04 セントラル硝子株式会社 半導体封止用硬化性樹脂組成物およびその硬化物、並びにこれらを用いた半導体装置
WO2016137881A1 (en) 2015-02-23 2016-09-01 King Industries Curable coating compositions of silane functional polymers
KR102411541B1 (ko) * 2015-08-07 2022-06-22 삼성디스플레이 주식회사 고분자 필름 형성용 조성물, 이로부터 제조된 고분자 필름 및 상기 고분자 필름을 포함한 전자 소자
FI129889B (en) 2015-10-09 2022-10-31 Inkron Ltd Dielectric siloxane particle films and devices having the same
TWI552412B (zh) * 2015-12-28 2016-10-01 財團法人工業技術研究院 有機發光裝置
WO2017182390A1 (de) * 2016-04-18 2017-10-26 Osram Opto Semiconductors Gmbh Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement
JP6672991B2 (ja) * 2016-04-25 2020-03-25 信越化学工業株式会社 縮合硬化性樹脂組成物及び半導体装置
DE102016115907A1 (de) * 2016-08-26 2018-03-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
CN109690367A (zh) * 2016-09-07 2019-04-26 住友化学株式会社 波长转换片材、层叠体及发光装置、以及波长转换片材的制造方法
JP6873654B2 (ja) * 2016-10-19 2021-05-19 Ｍｃｐｐイノベーション合同会社 硬化性ポリシロキサン組成物、該硬化性ポリシロキサン組成物を含む半導体発光装置用封止材及び、該封止材の硬化物を備えた半導体発光装置
JP6775429B2 (ja) * 2017-01-16 2020-10-28 日本特殊陶業株式会社 波長変換部材の製造方法
JP6378379B2 (ja) * 2017-02-24 2018-08-22 ダウ シリコーンズ コーポレーション 電力変換装置で使用するための軟質粘着性ゲル
KR20250036969A (ko) 2017-04-26 2025-03-14 오티아이 루미오닉스 인크. 표면의 코팅을 패턴화하는 방법 및 패턴화된 코팅을 포함하는 장치
US10731036B2 (en) * 2017-07-17 2020-08-04 Northrop Grumman Innovation Systems, Inc. Preceramic resin formulations, ceramic materials comprising the preceramic resin formulations,and related articles and methods
US10875813B2 (en) 2017-07-17 2020-12-29 Northrop Grumman Innovation Systems, Inc. Preceramic resin formulations, impregnated fibers comprising the preceramic resin formulations, and related methods
JP2019176023A (ja) * 2018-03-28 2019-10-10 京セラ株式会社 半導体封止用樹脂組成物及び半導体装置
KR102710429B1 (ko) * 2018-04-16 2024-09-26 신에쓰 가가꾸 고교 가부시끼가이샤 유기 el용 투명 건조제 및 그 사용 방법
US10662310B2 (en) * 2018-04-24 2020-05-26 Osram Opto Semiconductors Gmbh Optoelectronic component having a conversation element with a high refractive index
US10870757B2 (en) 2018-07-25 2020-12-22 Northrop Grumman Innovation Systems, Inc. Insulation, insulation precursors, and rocket motors, and related methods
US11472750B2 (en) 2018-08-27 2022-10-18 Northrop Grumman Systems Corporation Barrier coating resin formulations, and related methods
EP3924419A4 (en) 2019-02-13 2022-10-12 Dow Global Technologies LLC MOISTURE CURING POLYOLEFIN FORMULATION
US11840587B2 (en) 2019-02-13 2023-12-12 Dow Global Technologies Llc Moisture-curable polyolefin formulation
WO2020225778A1 (en) 2019-05-08 2020-11-12 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
JP7667733B2 (ja) 2019-05-31 2025-04-23 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、及びその硬化物からなる光学部材
WO2020241369A1 (ja) 2019-05-31 2020-12-03 ダウ・東レ株式会社 硬化性オルガノポリシロキサン組成物、及びその硬化物からなる光学部材
KR102952089B1 (ko) 2019-06-04 2026-04-14 다우 실리콘즈 코포레이션 실릴 수소화물과 알파-베타 불포화 에스테르 사이의 열적으로 개시되는 산 촉매 반응
EP3980430B1 (en) 2019-06-04 2023-04-12 Dow Silicones Corporation Bridged frustrated lewis pairs as thermal trigger for reactions between si-h and alpha-beta unsaturated esters
EP3980432B1 (en) 2019-06-04 2023-04-26 Dow Silicones Corporation Bridged frustrated lewis pairs as thermal trigger for reactions between si-h and epoxide
CN113993933B (zh) 2019-06-04 2023-07-14 美国陶氏有机硅公司 作为用于Si-H和Si-OR之间的反应的热触发剂的桥联受阻路易斯对
EP3980426B1 (en) * 2019-06-04 2023-04-19 Dow Silicones Corporation Bridged frustrated lewis pairs as thermal trigger for reactions between si-h and si-o-si
JP7560488B2 (ja) 2019-06-04 2024-10-02 ダウ シリコーンズ コーポレーション シリルヒドリドとシロキサンとの熱開始酸触媒反応
CN113924330B (zh) 2019-06-04 2023-01-24 美国陶氏有机硅公司 甲硅烷基氢化物与甲硅烷基醚和/或硅烷醇之间的热引发的酸催化反应
WO2021247210A1 (en) 2020-06-04 2021-12-09 Dow Silicones Corporation Epoxy-curable silicone release coating composition and methods for its preparation and use
US12672476B2 (en) 2020-10-29 2026-06-30 Oti Lumionics Inc. Opto-electronic device with nanoparticle deposited layers
KR20250139404A (ko) 2020-12-07 2025-09-23 오티아이 루미오닉스 인크. 핵 생성 억제 코팅 및 하부 금속 코팅을 사용한 전도성 증착 층의 패턴화
TWI815191B (zh) 2021-09-30 2023-09-11 新應材股份有限公司 樹脂組成物以及硬化膜

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3923705A (en) * 1974-10-30 1975-12-02 Dow Corning Method of preparing fire retardant siloxane foams and foams prepared therefrom
GB2065661B (en) * 1979-12-17 1984-02-15 Gen Electric Silicone foam compositions with burn resistant properties
JP2884702B2 (ja) 1989-12-26 1999-04-19 化成オプトニクス株式会社 螢光体及びその製造方法
JP3117485B2 (ja) 1991-07-22 2000-12-11 積水化学工業株式会社 表面が改質されたプラスチック微粒子及びその製造方法
JP2549956B2 (ja) * 1991-08-09 1996-10-30 信越化学工業株式会社 表面特性を改良したシール
JPH0586188A (ja) * 1991-09-30 1993-04-06 Kanegafuchi Chem Ind Co Ltd ケイ素系ハイブリツド材料
JPH06200163A (ja) * 1992-12-28 1994-07-19 Toray Dow Corning Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物
JP3255501B2 (ja) * 1993-08-06 2002-02-12 ジーイー東芝シリコーン株式会社 表面処理用組成物及びゴムの表面処理方法
JPH0764944A (ja) 1993-08-30 1995-03-10 Fuji Xerox Co Ltd ニューラルネットワークの学習方法
JP3104545B2 (ja) 1993-09-10 2000-10-30 信越化学工業株式会社 オルガノポリシロキサン組成物及びゴム部品
US5506302A (en) 1993-09-10 1996-04-09 Shin-Etsu Chemical Co., Inc. Organopolysiloxane composition and rubber substrate having a coating thereof
JP3104567B2 (ja) * 1995-03-24 2000-10-30 信越化学工業株式会社 オルガノポリシロキサン組成物及びゴム部品
JP3277749B2 (ja) * 1995-04-03 2002-04-22 信越化学工業株式会社 シリコーンゲル組成物及びポッティング材
JP3201940B2 (ja) * 1995-09-12 2001-08-27 信越化学工業株式会社 硬化性シリコーンエラストマー組成物及びその製造方法
US6140446A (en) 1997-11-18 2000-10-31 Shin-Etsu Chemical Co., Ltd. Hydrosilylation catalysts and silicone compositions using the same
JPH11222524A (ja) * 1997-11-18 1999-08-17 Shin Etsu Chem Co Ltd ヒドロシリル化反応触媒及びこれを用いたシリコーン組成物
JP3476368B2 (ja) * 1998-07-10 2003-12-10 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP2000096045A (ja) 1998-09-18 2000-04-04 Kasei Optonix Co Ltd 電界放出型ディスプレイ用蛍光膜及びこれを用いた電界 放出型ディスプレイ装置
DE10051242A1 (de) 2000-10-17 2002-04-25 Philips Corp Intellectual Pty Lichtemittierende Vorrichtung mit beschichtetem Leuchtstoff
JP3910080B2 (ja) 2001-02-23 2007-04-25 株式会社カネカ 発光ダイオード
JP3909826B2 (ja) 2001-02-23 2007-04-25 株式会社カネカ 発光ダイオード
JP5127100B2 (ja) 2001-04-26 2013-01-23 東レ・ダウコーニング株式会社 硬化性シリコーン組成物の水性エマルジョンの製造方法、その製造装置および硬化シリコーン粒状物の懸濁液の製造方法
JP4040858B2 (ja) 2001-10-19 2008-01-30 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
AU2002256751A1 (en) * 2002-04-18 2003-10-27 Rhodia Chimie Silicone composition which is cross-linkable by dehydrogenization with condensation in the presence of a metallic catalyst
JP2004186168A (ja) 2002-11-29 2004-07-02 Shin Etsu Chem Co Ltd 発光ダイオード素子用シリコーン樹脂組成物
JP4071639B2 (ja) 2003-01-15 2008-04-02 信越化学工業株式会社 発光ダイオード素子用シリコーン樹脂組成物
JP2004300247A (ja) 2003-03-31 2004-10-28 Mitsubishi Chemicals Corp 蛍光体及びそれを用いた発光装置、並びに照明装置
FR2853321B1 (fr) * 2003-04-03 2005-05-06 Rhodia Chimie Sa Composition reticulable pour electrolyte de batterie
FR2856690B1 (fr) * 2003-06-30 2005-09-16 Rhodia Chimie Sa Composition silicone reticulable par desydrogenocondensation en presence d'un catalyseur metallique
JP4803339B2 (ja) * 2003-11-20 2011-10-26 信越化学工業株式会社 エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP4801320B2 (ja) * 2003-12-19 2011-10-26 東レ・ダウコーニング株式会社 付加反応硬化型オルガノポリシロキサン樹脂組成物
JP2006077234A (ja) 2004-08-10 2006-03-23 Shin Etsu Chem Co Ltd Ｌｅｄ素子封止用樹脂組成物および該組成物を硬化してなる硬化物
US20060035092A1 (en) * 2004-08-10 2006-02-16 Shin-Etsu Chemical Co., Ltd. Resin composition for sealing LED elements and cured product generated by curing the composition
KR100922488B1 (ko) 2005-02-23 2009-10-20 미쓰비시 가가꾸 가부시키가이샤 반도체 발광 디바이스용 부재 및 그 제조 방법, 그리고그것을 사용한 반도체 발광 디바이스
JP2006291018A (ja) 2005-04-08 2006-10-26 Shin Etsu Chem Co Ltd Ｌｅｄ素子封止用硬化性樹脂組成物
JP4876426B2 (ja) 2005-04-08 2012-02-15 日亜化学工業株式会社 耐熱性及び耐光性に優れる発光装置
JP5034301B2 (ja) 2005-04-15 2012-09-26 Ｊｓｒ株式会社 高屈折材料形成用組成物およびその硬化体、ならびに高屈折材料形成用組成物の製造方法
JP2006336010A (ja) 2005-05-02 2006-12-14 Jsr Corp シロキサン系縮合物およびその製造方法、ポリシロキサン組成物
JP2006348284A (ja) 2005-05-20 2006-12-28 Jsr Corp シロキサン系縮合物およびその製造方法
EP1820824B1 (en) * 2006-02-20 2008-08-13 Shin-Etsu Chemical Co., Ltd. Heat curable silicone composition
JP2008088316A (ja) 2006-10-03 2008-04-17 Kyoto Univ Ｔａ酸化物を主体とする蛍光体及びその製造方法

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