CN102339925B - 发光元件封装方法 - Google Patents

发光元件封装方法 Download PDF

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CN102339925B
CN102339925B CN201010230810.8A CN201010230810A CN102339925B CN 102339925 B CN102339925 B CN 102339925B CN 201010230810 A CN201010230810 A CN 201010230810A CN 102339925 B CN102339925 B CN 102339925B
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CN102339925A (zh
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林升柏
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Scienbizip Consulting Shenzhen Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector involving a temporary auxiliary member not forming part of the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Abstract

一种发光元件封装方法，步骤包括：提供一封装基板；形成一壳体于封装基板上，其中该壳体上设有若干孔洞；将定量的固晶胶分别形成于壳体的孔洞内；将具有若干发光元件的蓝膜固定于壳体上，其中所述发光元件对应所述孔洞的位置，且所述发光元件被孔洞内的固晶胶固定；将蓝膜与发光元件分离并将蓝膜从壳体上移除；及将壳体从封装基板上移除。与现有技术相比，本发明利用壳体协助定位固晶胶及发光元件的位置，使发光元件的位置具有一致性，从而提升工艺良率。同时可一次形成固晶胶及一次定位发光元件，能简化工艺流程，提升工艺效率。

Description

发光元件封装方法
技术领域
本发明涉及一种半导体发光元件的封装方法。
背景技术
一般的发光元件例如发光二极管都需要经封装后形成单个颗粒，再应用到各个领域，例如显示、照明等。
发光二极管的封装通常都包括固晶、打线、灌胶、烘烤、切割等工艺流程。在固晶阶段，通常利用机具将固晶胶逐个形成于封装载板的表面，再将发光二极管晶粒逐个固著于上述形成的固晶胶上，批量封装发光二极管时，必须重复上述步骤再接着进行后续其他封装工艺流程。
然而，上述固晶工艺存在很多缺陷，不能满足产业上快速、优良地大批量封装发光二极管的需求。首先，无法使发光二极管晶粒与固晶胶的位置精准定位，且固晶胶的胶量不一致，造成发光二极管晶粒容易脱落或者发光二极管晶粒的位置不一致，从而影响良率。另外，需要重复实施形成固晶胶及固定发光二极管晶粒的步骤，造成固晶工艺的时间冗长而降低效率。因此，如何提供一种更加高效的发光二极管封装方法仍是业界需要解决的一个课题。
发明内容
有鉴于此，有必要提供一种更加高效的发光元件封装方法。
一种发光元件封装方法，其步骤包括：
第一步骤，提供一封装基板；
第二步骤，形成一壳体于封装基板上，其中该壳体上设有若干孔洞；
第三步骤，将定量的固晶胶分别形成于壳体的孔洞内；
第四步骤，将具有若干发光元件的蓝膜固定于壳体上，其中所述发光元件对应所述孔洞的位置，且所述发光元件被孔洞内的固晶胶固定；
第五步骤，将蓝膜与发光元件分离并将蓝膜从壳体上移除；及
第六步骤，将壳体从封装基板上移除。
与现有技术相比，本发明利用壳体协助定位固晶胶及发光元件的位置，使发光元件的位置具有一致性，从而提升工艺良率。同时可一次形成定量的固晶胶及一次定位发光元件，能简化工艺流程，提升工艺效率。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1为本发明一实施例的发光元件封装方法的工艺流程图。
图2至图7为本发明一实施例的发光元件封装方法的各步骤示意图。
主要元件符号说明
封装基板10
壳体20
孔洞22
固晶胶30
蓝膜40
发光元件42
具体实施方式
图1示出了本发明一实施例的发光元件封装方法的流程。该发光元件封装方法大致包括如下流程：
第一步骤，提供一封装基板10；
第二步骤，形成一壳体20于封装基板10上，该壳体20上设有若干孔洞22；
第三步骤，将定量的固晶胶30分别形成于壳体20的孔洞22内；
第四步骤，将具有若干发光元件42的蓝膜40固定于壳体20上，所述发光元件42对应壳体20上的孔洞22的位置，且所述发光元件42被孔洞22内的固晶胶30固定；
第五步骤，将蓝膜40与发光元件42分离并将蓝膜40从壳体20上移除；及
第六步骤，将壳体20从封装基板10上移除。
下面结合其他图示对该流程作详细说明。请同时参考图2，首先，提供一封装基板10。在一些实施例中，该封装基板10上可形成电路结构(图未示)，用于与发光元件42形成电连接。接着，将一图案化的壳体20形成在封装基板10上，该壳体20上还形成若干图案化的孔洞22。
请参考图3，利用机具将固晶胶30形成于上述孔洞22中。将固晶胶30形成于孔洞22中的方式可以有多种，例如可以是印刷涂布的方式。本发明采用上述方式可以将固晶胶30一次成型于封装基板10上，相对于传统技术中的多次形成固晶胶来说，固晶工艺的效率大有提升。
请再参考图4-5，一蓝膜40上粘接有若干发光元件42，该发光元件42可以是发光二极管晶粒、有机发光二极管晶粒等发光器件，本实施例中为发光二极管晶粒。将该蓝膜40固定在壳体20上，并使发光元件42朝向壳体20上的孔洞22。通过固压该蓝膜40，使发光元件42被固晶胶30固定在封装基板10上。
然后，采用例如是紫外光照射等手段消除蓝膜40的粘性，使发光元件42与蓝膜40分离。请再参考图6，接着将消除粘性后的蓝膜40从壳体20上移除。最后，如图7所示，将壳体20从封装基板10上移除，如此发光元件42便被固定在封装基板10上。本发明利用图案化的壳体20协助定位固晶胶30的位置及其用量，以及协助定位发光元件42的位置，使发光元件42的位置具有一致性，从而提升工艺良率。同时可一次形成一致胶量的固晶胶30及一次定位发光元件42，能简化工艺流程，提升工艺效率。
其中，将发光元件42与封装基板10上的电路结构形成电连接可采用多种方式。例如，可以采用导电的固晶胶30，并在第四步骤时，将发光元件42以晶片倒装(flip-chip)的形式固定在封装基板10上，并借由导电的固晶胶30与电路结构形成电连接。当然，也可采用其他方式，例如，可以在第六步骤后，采用打线(wirebonding)的方式将发光元件42与封装基板10上的电路结构形成电连接。
在第六步骤之后，还形成一封装层(图未示)覆盖发光元件42。还可形成一荧光层于封装层的表面，该荧光层包含石榴石基荧光粉、硅酸盐基荧光粉、原硅酸盐基荧光粉、硫化物基荧光粉、硫代镓酸盐基荧光粉、氮氧化物基荧光粉和氮化物基荧光粉中的一种或多种。在一些实施例中，也可于封装层内添加荧光粉，所述荧光粉可以是石榴石基荧光粉、硅酸盐基荧光粉、原硅酸盐基荧光粉、硫化物基荧光粉、硫代镓酸盐基荧光粉、氮氧化物基荧光粉和氮化物基荧光粉中的一种或多种。

Claims (9)

1.一种发光元件封装方法，步骤包括：
第一步骤，提供一封装基板；
第二步骤，形成一壳体于封装基板上，其中该壳体上设有若干孔洞；
第三步骤，将定量的固晶胶分别形成于壳体的孔洞内；
第四步骤，将具有若干发光元件的蓝膜固定于壳体上，其中所述发光元件对应所述孔洞的位置，且所述发光元件被孔洞内的固晶胶固定；
第五步骤，将蓝膜与发光元件分离并将蓝膜从壳体上移除；及
第六步骤，将壳体从封装基板上移除。
2.如权利要求1所述的发光元件封装方法，其特征在于：所述封装基板上设有电路结构，且所述固晶胶为导电胶，所述发光元件在第四步骤时以倒装的方式与封装基板上的电路结构形成电连接。
3.如权利要求1所述的发光元件封装方法，其特征在于：所述封装基板上设有电路结构，所述发光元件在第六步骤后以打线的方式与封装基板上的电路结构形成电连接。
4.如权利要求1所述的发光元件封装方法，其特征在于：第五步骤中采用紫外光照射的方式使蓝膜与发光元件分离。
5.如权利要求1所述的发光元件封装方法，其特征在于：还包括在第六步骤之后，形成一覆盖所述发光元件的封装层的步骤。
6.如权利要求5所述的发光元件封装方法，其特征在于：还包括在所述封装层的表面上形成一荧光层的步骤。
7.如权利要求5所述的发光元件封装方法，其特征在于：所述封装层内包含荧光粉。
8.如权利要求1-7项中任意一项所述的发光元件封装方法，其特征在于：所述发光元件为发光二极管。
9.如权利要求6或7所述的发光元件封装方法，其特征在于：所述荧光层或荧光粉包含石榴石基荧光粉、硅酸盐基荧光粉、原硅酸盐基荧光粉、硫化物基荧光粉、硫代镓酸盐基荧光粉、氮氧化物基荧光粉和氮化物基荧光粉中的一种或多种。
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CN101162744A (zh) * 2006-10-09 2008-04-16 深圳市量子光电子有限公司 Led荧光粉涂布的工艺方法
CN101694860A (zh) * 2009-10-15 2010-04-14 苏州中泽光电科技有限公司 一种新型led固晶方法

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