JP5489387B2 - 能動領域の欠陥が低減されユニークな接触スキームを有する半導体デバイス - Google Patents

能動領域の欠陥が低減されユニークな接触スキームを有する半導体デバイス Download PDF

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JP5489387B2
JP5489387B2 JP2005508542A JP2005508542A JP5489387B2 JP 5489387 B2 JP5489387 B2 JP 5489387B2 JP 2005508542 A JP2005508542 A JP 2005508542A JP 2005508542 A JP2005508542 A JP 2005508542A JP 5489387 B2 JP5489387 B2 JP 5489387B2
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ブード,ジェフリー,デヴン
キャロル,マルコルム
キング,クリフォード,アラン
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ノーブル ピーク ヴィジョン コーポレーション
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/12Active materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02636Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639Preparation of substrate for selective deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184Infrared image sensors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Light Receiving Elements (AREA)
  • Recrystallisation Techniques (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
JP2005508542A 2002-12-18 2003-11-26 能動領域の欠陥が低減されユニークな接触スキームを有する半導体デバイス Expired - Fee Related JP5489387B2 (ja)

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Application Number Priority Date Filing Date Title
US43435902P 2002-12-18 2002-12-18
US60/434,359 2002-12-18
US10/453,037 2003-06-03
US10/453,037 US7012314B2 (en) 2002-12-18 2003-06-03 Semiconductor devices with reduced active region defects and unique contacting schemes
PCT/US2003/037786 WO2004061911A2 (en) 2002-12-18 2003-11-26 Semiconductor devices with reduced active region defects and unique contacting schemes

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JP2011138418A Division JP2011238942A (ja) 2002-12-18 2011-06-22 能動領域の欠陥が低減されユニークな接触スキームを有する半導体デバイス

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JP2006513584A JP2006513584A (ja) 2006-04-20
JP2006513584A5 JP2006513584A5 (enExample) 2006-11-24
JP5489387B2 true JP5489387B2 (ja) 2014-05-14

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JP2011138418A Pending JP2011238942A (ja) 2002-12-18 2011-06-22 能動領域の欠陥が低減されユニークな接触スキームを有する半導体デバイス

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US (2) US7012314B2 (enExample)
EP (1) EP1573790B1 (enExample)
JP (2) JP5489387B2 (enExample)
KR (1) KR20050093785A (enExample)
AU (1) AU2003303492A1 (enExample)
DE (1) DE60310762T2 (enExample)
TW (1) TWI232544B (enExample)
WO (1) WO2004061911A2 (enExample)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6649480B2 (en) * 2000-12-04 2003-11-18 Amberwave Systems Corporation Method of fabricating CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETs
US6703688B1 (en) * 2001-03-02 2004-03-09 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6830976B2 (en) * 2001-03-02 2004-12-14 Amberwave Systems Corproation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6995430B2 (en) 2002-06-07 2006-02-07 Amberwave Systems Corporation Strained-semiconductor-on-insulator device structures
US6946371B2 (en) * 2002-06-10 2005-09-20 Amberwave Systems Corporation Methods of fabricating semiconductor structures having epitaxially grown source and drain elements
US6982474B2 (en) * 2002-06-25 2006-01-03 Amberwave Systems Corporation Reacted conductive gate electrodes
US7643755B2 (en) * 2003-10-13 2010-01-05 Noble Peak Vision Corp. Optical receiver comprising a receiver photodetector integrated with an imaging array
US7453129B2 (en) 2002-12-18 2008-11-18 Noble Peak Vision Corp. Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry
US7589380B2 (en) * 2002-12-18 2009-09-15 Noble Peak Vision Corp. Method for forming integrated circuit utilizing dual semiconductors
US20060055800A1 (en) * 2002-12-18 2006-03-16 Noble Device Technologies Corp. Adaptive solid state image sensor
US6960781B2 (en) 2003-03-07 2005-11-01 Amberwave Systems Corporation Shallow trench isolation process
US7122392B2 (en) * 2003-06-30 2006-10-17 Intel Corporation Methods of forming a high germanium concentration silicon germanium alloy by epitaxial lateral overgrowth and structures formed thereby
US7503706B2 (en) * 2003-09-05 2009-03-17 Sae Magnetics (Hong Kong) Limited MSM photodetector assembly
US7579263B2 (en) 2003-09-09 2009-08-25 Stc.Unm Threading-dislocation-free nanoheteroepitaxy of Ge on Si using self-directed touch-down of Ge through a thin SiO2 layer
US6919258B2 (en) * 2003-10-02 2005-07-19 Freescale Semiconductor, Inc. Semiconductor device incorporating a defect controlled strained channel structure and method of making the same
EP1685701B1 (en) 2003-10-13 2008-09-17 Noble Peak Vision Corp. Image sensor comprising isolated germanium photodetectors integrated with a silicon substrate and silicon circuitry
US7198970B2 (en) * 2004-01-23 2007-04-03 The United States Of America As Represented By The Secretary Of The Navy Technique for perfecting the active regions of wide bandgap semiconductor nitride devices
US7186622B2 (en) * 2004-07-15 2007-03-06 Infineon Technologies Ag Formation of active area using semiconductor growth process without STI integration
US20060073681A1 (en) * 2004-09-08 2006-04-06 Han Sang M Nanoheteroepitaxy of Ge on Si as a foundation for group III-V and II-VI integration
US7439542B2 (en) * 2004-10-05 2008-10-21 International Business Machines Corporation Hybrid orientation CMOS with partial insulation process
KR100641068B1 (ko) * 2005-01-21 2006-11-06 삼성전자주식회사 듀얼 다마신 채널 구조물과 그 제조 방법
US7298009B2 (en) 2005-02-01 2007-11-20 Infineon Technologies Ag Semiconductor method and device with mixed orientation substrate
US8324660B2 (en) 2005-05-17 2012-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
EP2595175B1 (en) * 2005-05-17 2019-04-17 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating a lattice-mismatched semiconductor structure with reduced dislocation defect densities
US20070267722A1 (en) * 2006-05-17 2007-11-22 Amberwave Systems Corporation Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US9153645B2 (en) 2005-05-17 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US7626246B2 (en) * 2005-07-26 2009-12-01 Amberwave Systems Corporation Solutions for integrated circuit integration of alternative active area materials
US7459367B2 (en) 2005-07-27 2008-12-02 International Business Machines Corporation Method of forming a vertical P-N junction device
US7638842B2 (en) * 2005-09-07 2009-12-29 Amberwave Systems Corporation Lattice-mismatched semiconductor structures on insulators
US20070054467A1 (en) * 2005-09-07 2007-03-08 Amberwave Systems Corporation Methods for integrating lattice-mismatched semiconductor structure on insulators
US7705370B2 (en) * 2005-11-01 2010-04-27 Massachusetts Institute Of Technology Monolithically integrated photodetectors
US20070252223A1 (en) * 2005-12-05 2007-11-01 Massachusetts Institute Of Technology Insulated gate devices and method of making same
US8530355B2 (en) * 2005-12-23 2013-09-10 Infineon Technologies Ag Mixed orientation semiconductor device and method
US7629661B2 (en) * 2006-02-10 2009-12-08 Noble Peak Vision Corp. Semiconductor devices with photoresponsive components and metal silicide light blocking structures
US7901968B2 (en) * 2006-03-23 2011-03-08 Asm America, Inc. Heteroepitaxial deposition over an oxidized surface
US7777250B2 (en) * 2006-03-24 2010-08-17 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures and related methods for device fabrication
US7485524B2 (en) * 2006-06-21 2009-02-03 International Business Machines Corporation MOSFETs comprising source/drain regions with slanted upper surfaces, and method for fabricating the same
US8063397B2 (en) * 2006-06-28 2011-11-22 Massachusetts Institute Of Technology Semiconductor light-emitting structure and graded-composition substrate providing yellow-green light emission
EP2062290B1 (en) 2006-09-07 2019-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Defect reduction using aspect ratio trapping
WO2008036256A1 (en) * 2006-09-18 2008-03-27 Amberwave Systems Corporation Aspect ratio trapping for mixed signal applications
WO2008039495A1 (en) * 2006-09-27 2008-04-03 Amberwave Systems Corporation Tri-gate field-effect transistors formed by aspect ratio trapping
WO2008039534A2 (en) 2006-09-27 2008-04-03 Amberwave Systems Corporation Quantum tunneling devices and circuits with lattice- mismatched semiconductor structures
US8502263B2 (en) * 2006-10-19 2013-08-06 Taiwan Semiconductor Manufacturing Company, Ltd. Light-emitter-based devices with lattice-mismatched semiconductor structures
US9508890B2 (en) 2007-04-09 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Photovoltaics on silicon
US8304805B2 (en) 2009-01-09 2012-11-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor diodes fabricated by aspect ratio trapping with coalesced films
US8237151B2 (en) * 2009-01-09 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Diode-based devices and methods for making the same
US7825328B2 (en) 2007-04-09 2010-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Nitride-based multi-junction solar cell modules and methods for making the same
US8329541B2 (en) * 2007-06-15 2012-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. InP-based transistor fabrication
JP2010538495A (ja) 2007-09-07 2010-12-09 アンバーウェーブ・システムズ・コーポレーション 多接合太陽電池
US8871554B2 (en) * 2007-10-30 2014-10-28 Bae Systems Information And Electronic Systems Integration Inc. Method for fabricating butt-coupled electro-absorptive modulators
US7723206B2 (en) * 2007-12-05 2010-05-25 Fujifilm Corporation Photodiode
JP5669359B2 (ja) * 2008-03-01 2015-02-12 住友化学株式会社 半導体基板、半導体基板の製造方法および電子デバイス
US8766318B2 (en) * 2008-03-01 2014-07-01 Sumitomo Chemical Company, Limited Semiconductor wafer, method of manufacturing a semiconductor wafer, and electronic device
US8183667B2 (en) 2008-06-03 2012-05-22 Taiwan Semiconductor Manufacturing Co., Ltd. Epitaxial growth of crystalline material
US8274097B2 (en) 2008-07-01 2012-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. Reduction of edge effects from aspect ratio trapping
US8981427B2 (en) 2008-07-15 2015-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing of small composite semiconductor materials
US8084739B2 (en) 2008-07-16 2011-12-27 Infrared Newco., Inc. Imaging apparatus and methods
US8686365B2 (en) * 2008-07-28 2014-04-01 Infrared Newco, Inc. Imaging apparatus and methods
EP2528087B1 (en) 2008-09-19 2016-06-29 Taiwan Semiconductor Manufacturing Company, Ltd. Formation of devices by epitaxial layer overgrowth
US20100072515A1 (en) 2008-09-19 2010-03-25 Amberwave Systems Corporation Fabrication and structures of crystalline material
US8253211B2 (en) 2008-09-24 2012-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor sensor structures with reduced dislocation defect densities
TWI471910B (zh) * 2008-10-02 2015-02-01 Sumitomo Chemical Co 半導體晶圓、電子裝置及半導體晶圓之製造方法
WO2010114956A1 (en) 2009-04-02 2010-10-07 Taiwan Semiconductor Manufacturing Company, Ltd. Devices formed from a non-polar plane of a crystalline material and method of making the same
KR20120022872A (ko) * 2009-05-22 2012-03-12 스미또모 가가꾸 가부시키가이샤 반도체 기판, 전자 디바이스, 반도체 기판의 제조 방법 및 전자 디바이스의 제조 방법
KR101671552B1 (ko) * 2009-06-05 2016-11-01 내셔날 인스티튜트 오브 어드밴스드 인더스트리얼 사이언스 앤드 테크놀로지 센서, 반도체 기판 및 반도체 기판의 제조 방법
JP5414415B2 (ja) * 2009-08-06 2014-02-12 株式会社日立製作所 半導体受光素子及びその製造方法
SG169922A1 (en) * 2009-09-24 2011-04-29 Taiwan Semiconductor Mfg Improved semiconductor sensor structures with reduced dislocation defect densities and related methods for the same
JP5969811B2 (ja) * 2011-05-09 2016-08-17 アイメックImec シリコン・フォトニクスプラットフォーム上でのフォトニックデバイスの共集積化方法
US8546250B2 (en) 2011-08-18 2013-10-01 Wafertech Llc Method of fabricating vertical integrated semiconductor device with multiple continuous single crystal silicon layers vertically separated from one another
US9127345B2 (en) 2012-03-06 2015-09-08 Asm America, Inc. Methods for depositing an epitaxial silicon germanium layer having a germanium to silicon ratio greater than 1:1 using silylgermane and a diluent
US9709740B2 (en) * 2012-06-04 2017-07-18 Micron Technology, Inc. Method and structure providing optical isolation of a waveguide on a silicon-on-insulator substrate
US9142400B1 (en) 2012-07-17 2015-09-22 Stc.Unm Method of making a heteroepitaxial layer on a seed area
US9171715B2 (en) 2012-09-05 2015-10-27 Asm Ip Holding B.V. Atomic layer deposition of GeO2
US9213137B2 (en) * 2013-07-12 2015-12-15 Globalfoundries Singapore Pte. Ltd. Semiconductor devices including photodetectors integrated on waveguides and methods for fabricating the same
CN105378937B (zh) * 2013-08-02 2017-08-08 英特尔公司 低电压光电检测器
US10096474B2 (en) 2013-09-04 2018-10-09 Intel Corporation Methods and structures to prevent sidewall defects during selective epitaxy
KR102245485B1 (ko) * 2013-09-04 2021-04-29 인텔 코포레이션 선택적 에피택시 동안 측벽 결함을 방지하는 방법 및 구조
US9218963B2 (en) 2013-12-19 2015-12-22 Asm Ip Holding B.V. Cyclical deposition of germanium
US9799689B2 (en) 2014-11-13 2017-10-24 Artilux Inc. Light absorption apparatus
US9748307B2 (en) 2014-11-13 2017-08-29 Artilux Inc. Light absorption apparatus
KR102284657B1 (ko) 2015-01-05 2021-08-02 삼성전자 주식회사 포토 다이오드 및 이를 포함하는 광통신 시스템
KR102279162B1 (ko) * 2015-03-03 2021-07-20 한국전자통신연구원 게르마늄 온 인슐레이터 기판 및 그의 형성방법
CN108352393B (zh) 2015-07-23 2022-09-16 光程研创股份有限公司 高效宽光谱传感器
US9917189B2 (en) * 2015-07-31 2018-03-13 Taiwan Semiconductor Manufacturing Company, Ltd. Method for detecting presence and location of defects in a substrate
US10707260B2 (en) 2015-08-04 2020-07-07 Artilux, Inc. Circuit for operating a multi-gate VIS/IR photodiode
US10861888B2 (en) 2015-08-04 2020-12-08 Artilux, Inc. Silicon germanium imager with photodiode in trench
EP3370258B1 (en) 2015-08-04 2020-03-25 Artilux Inc. Germanium-silicon light sensing apparatus
US10761599B2 (en) 2015-08-04 2020-09-01 Artilux, Inc. Eye gesture tracking
CN115824395B (zh) 2015-08-27 2023-08-15 光程研创股份有限公司 宽频谱光学传感器
US10418407B2 (en) 2015-11-06 2019-09-17 Artilux, Inc. High-speed light sensing apparatus III
US10886309B2 (en) 2015-11-06 2021-01-05 Artilux, Inc. High-speed light sensing apparatus II
US10741598B2 (en) 2015-11-06 2020-08-11 Atrilux, Inc. High-speed light sensing apparatus II
US10254389B2 (en) 2015-11-06 2019-04-09 Artilux Corporation High-speed light sensing apparatus
US10739443B2 (en) 2015-11-06 2020-08-11 Artilux, Inc. High-speed light sensing apparatus II
IL242952B (en) 2015-12-06 2021-02-28 Semi Conductor Devices An Elbit Systems Rafael Partnership Photodetector-arrays and methods of fabrication thereof
US20170350752A1 (en) * 2016-06-01 2017-12-07 Ventsislav Metodiev Lavchiev Light emitting structures and systems on the basis of group iv material(s) for the ultraviolet and visible spectral ranges
GB2549951B (en) * 2016-05-03 2019-11-20 Metodiev Lavchiev Ventsislav Light emitting structures and systems on the basis of group-IV material(s) for the ultra violet and visible spectral range
WO2018011373A1 (en) * 2016-07-13 2018-01-18 Rockley Photonics Limited Integrated structure and manufacturing method thereof
CN111868929B (zh) 2018-02-23 2021-08-03 奥特逻科公司 光检测装置及其光检测方法
US11105928B2 (en) 2018-02-23 2021-08-31 Artilux, Inc. Light-sensing apparatus and light-sensing method thereof
JP7212062B2 (ja) 2018-04-08 2023-01-24 アーティラックス・インコーポレイテッド 光検出装置
TWI795562B (zh) 2018-05-07 2023-03-11 美商光程研創股份有限公司 雪崩式之光電晶體
US10969877B2 (en) 2018-05-08 2021-04-06 Artilux, Inc. Display apparatus
JP6836547B2 (ja) * 2018-05-21 2021-03-03 日本電信電話株式会社 光検出器
US10861896B2 (en) 2018-07-27 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. Capping structure to reduce dark current in image sensors
WO2023059548A1 (en) * 2021-10-06 2023-04-13 Analog Devices Inc. Monolithic multi-wavelength optical devcies
EP4167269A1 (en) * 2021-10-15 2023-04-19 Infineon Technologies AG Heteroepitaxial semiconductor device and method for fabricating a heteroepitaxial semiconductor device

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177742A (ja) * 1985-02-01 1986-08-09 Mitsubishi Electric Corp 半導体装置
JPS63216386A (ja) * 1987-03-05 1988-09-08 Fujitsu Ltd 半導体受光装置
JPH01184878A (ja) * 1988-01-13 1989-07-24 Mitsubishi Electric Corp 横型pinフオトダイオードの製造方法
JPH03125458A (ja) * 1989-10-11 1991-05-28 Canon Inc 単結晶領域の形成方法及びそれを用いた結晶物品
US5162891A (en) * 1991-07-03 1992-11-10 International Business Machines Corporation Group III-V heterostructure devices having self-aligned graded contact diffusion regions and method for fabricating same
KR100259063B1 (ko) 1992-06-12 2000-06-15 김영환 Ccd 영상소자
JP3930161B2 (ja) * 1997-08-29 2007-06-13 株式会社東芝 窒化物系半導体素子、発光素子及びその製造方法
US6057586A (en) * 1997-09-26 2000-05-02 Intel Corporation Method and apparatus for employing a light shield to modulate pixel color responsivity
JP3501265B2 (ja) * 1997-10-30 2004-03-02 富士通株式会社 半導体装置の製造方法
WO1999044224A1 (en) 1998-02-27 1999-09-02 North Carolina State University Methods of fabricating gallium nitride semiconductor layers by lateral overgrowth through masks, and gallium nitride semiconductor structures fabricated thereby
US6500257B1 (en) 1998-04-17 2002-12-31 Agilent Technologies, Inc. Epitaxial material grown laterally within a trench and method for producing same
JP4032538B2 (ja) 1998-11-26 2008-01-16 ソニー株式会社 半導体薄膜および半導体素子の製造方法
JP3824446B2 (ja) * 1999-05-28 2006-09-20 シャープ株式会社 固体撮像装置の製造方法
US6396046B1 (en) 1999-11-02 2002-05-28 General Electric Company Imager with reduced FET photoresponse and high integrity contact via
JP3455512B2 (ja) * 1999-11-17 2003-10-14 日本碍子株式会社 エピタキシャル成長用基板およびその製造方法
TW494574B (en) 1999-12-01 2002-07-11 Innotech Corp Solid state imaging device, method of manufacturing the same, and solid state imaging system
JP3827909B2 (ja) 2000-03-21 2006-09-27 シャープ株式会社 固体撮像装置およびその製造方法
GB0014961D0 (en) * 2000-06-20 2000-08-09 Koninkl Philips Electronics Nv Light-emitting matrix array display devices with light sensing elements
JP3912024B2 (ja) * 2001-04-09 2007-05-09 セイコーエプソン株式会社 Pin構造のラテラル型半導体受光素子
JP2002314116A (ja) * 2001-04-09 2002-10-25 Seiko Epson Corp Pin構造のラテラル型半導体受光素子
GB0111207D0 (en) 2001-05-08 2001-06-27 Btg Int Ltd A method to produce germanium layers
JP4375517B2 (ja) * 2001-07-23 2009-12-02 日本電気株式会社 液晶表示装置
US7248297B2 (en) * 2001-11-30 2007-07-24 The Board Of Trustees Of The Leland Stanford Junior University Integrated color pixel (ICP)
US6835954B2 (en) * 2001-12-29 2004-12-28 Lg.Philips Lcd Co., Ltd. Active matrix organic electroluminescent display device
US7098069B2 (en) * 2002-01-24 2006-08-29 Semiconductor Energy Laboratory Co., Ltd. Light emitting device, method of preparing the same and device for fabricating the same
TW546853B (en) * 2002-05-01 2003-08-11 Au Optronics Corp Active type OLED and the fabrication method thereof

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DE60310762D1 (de) 2007-02-08
US7012314B2 (en) 2006-03-14
US20060057825A1 (en) 2006-03-16
AU2003303492A8 (en) 2004-07-29
WO2004061911A8 (en) 2005-08-25
AU2003303492A1 (en) 2004-07-29
EP1573790B1 (en) 2006-12-27
US7297569B2 (en) 2007-11-20
JP2006513584A (ja) 2006-04-20
WO2004061911A3 (en) 2004-09-16
WO2004061911A2 (en) 2004-07-22
KR20050093785A (ko) 2005-09-23
TW200419721A (en) 2004-10-01
EP1573790A2 (en) 2005-09-14
TWI232544B (en) 2005-05-11
DE60310762T2 (de) 2007-10-11

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