TWI232544B - Semiconductor devices with reduced active region defects and unique contacting schemes - Google Patents

Semiconductor devices with reduced active region defects and unique contacting schemes Download PDF

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Publication number
TWI232544B
TWI232544B TW092128288A TW92128288A TWI232544B TW I232544 B TWI232544 B TW I232544B TW 092128288 A TW092128288 A TW 092128288A TW 92128288 A TW92128288 A TW 92128288A TW I232544 B TWI232544 B TW I232544B
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Taiwan
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area
region
opening
cladding
pixel
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TW092128288A
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Chinese (zh)
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TW200419721A (en
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Jeffrey Devin Bude
Malcolm Carroll
Clifford Alan King
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Agere Systems Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/10—Semiconductor bodies
    • H10F77/12—Active materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639—Preparation of substrate for selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184—Infrared image sensors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Light Receiving Elements (AREA)
  • Recrystallisation Techniques (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW092128288A 2002-12-18 2003-10-13 Semiconductor devices with reduced active region defects and unique contacting schemes TWI232544B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43435902P 2002-12-18 2002-12-18
US10/453,037 US7012314B2 (en) 2002-12-18 2003-06-03 Semiconductor devices with reduced active region defects and unique contacting schemes

Publications (2)

Publication Number Publication Date
TW200419721A TW200419721A (en) 2004-10-01
TWI232544B true TWI232544B (en) 2005-05-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW092128288A TWI232544B (en) 2002-12-18 2003-10-13 Semiconductor devices with reduced active region defects and unique contacting schemes

Country Status (8)

Country Link
US (2) US7012314B2 (enExample)
EP (1) EP1573790B1 (enExample)
JP (2) JP5489387B2 (enExample)
KR (1) KR20050093785A (enExample)
AU (1) AU2003303492A1 (enExample)
DE (1) DE60310762T2 (enExample)
TW (1) TWI232544B (enExample)
WO (1) WO2004061911A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI736892B (zh) * 2018-07-27 2021-08-21 台灣積體電路製造股份有限公司 用以降低影像感測器中暗電流的覆蓋結構及其形成方法

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DE60310762D1 (de) 2007-02-08
US7012314B2 (en) 2006-03-14
US20060057825A1 (en) 2006-03-16
AU2003303492A8 (en) 2004-07-29
WO2004061911A8 (en) 2005-08-25
AU2003303492A1 (en) 2004-07-29
EP1573790B1 (en) 2006-12-27
US7297569B2 (en) 2007-11-20
JP2006513584A (ja) 2006-04-20
WO2004061911A3 (en) 2004-09-16
WO2004061911A2 (en) 2004-07-22
KR20050093785A (ko) 2005-09-23
JP5489387B2 (ja) 2014-05-14
TW200419721A (en) 2004-10-01
EP1573790A2 (en) 2005-09-14
DE60310762T2 (de) 2007-10-11

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