JP5447504B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5447504B2 JP5447504B2 JP2011505707A JP2011505707A JP5447504B2 JP 5447504 B2 JP5447504 B2 JP 5447504B2 JP 2011505707 A JP2011505707 A JP 2011505707A JP 2011505707 A JP2011505707 A JP 2011505707A JP 5447504 B2 JP5447504 B2 JP 5447504B2
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- 239000004065 semiconductor Substances 0.000 title claims description 73
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- 238000009413 insulation Methods 0.000 claims 1
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
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- 230000007935 neutral effect Effects 0.000 description 1
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- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
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- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/063—Reduced surface field [RESURF] pn-junction structures
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
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- H01L29/0692—Surface layout
- H01L29/0696—Surface layout of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/66348—Vertical insulated gate bipolar transistors with a recessed gate
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
(特徴1)第1導電型としてP型、第2導電型としてN型の半導体を用いている。
(特徴2)主セル領域とセンスセル領域を含む半導体素子の周囲には周辺耐圧構造部が設置されている。
まず、図9に示すように、半導体装置100のN−型のドリフト領域13となるN−型の半導体基板513上にマスク材561を形成し、半導体基板513の上面側からホウ素等のイオン注入および熱拡散処理を行うことによってP+層520〜522を形成し、マスク材561を除去する。マスク材としては、例えば、レジストや、シリコン等の酸化膜を用いることができる。P+層520〜522は半導体装置100の拡散領域20〜22となる。尚、図9に示す工程においてFLRに設けられるP+型の拡散領域も同時に形成することができる。
Claims (1)
- トレンチゲート型の素子領域からなる主セル領域と、プレーナゲート型の素子領域を含むセンスセル領域とを備えており、
トレンチゲート型の素子領域では、
第1導電型のコレクタ領域と、
そのコレクタ領域上に積層されている第2導電型のドリフト領域と、
そのドリフト領域上に積層されている第1導電型のボディ領域と、
そのボディ領域の表面に形成されている第2導電型のエミッタ領域と、
エミッタ領域とボディ領域を貫通して伸びるトレンチゲート型の絶縁ゲートと、が設けられており、
プレーナゲート型の素子領域では、
第1導電型のコレクタ領域と、
そのコレクタ領域上に積層されている第2導電型のドリフト領域と、
そのドリフト領域の表面に形成されている第2導電型のエミッタ領域と、
そのエミッタ領域をドリフト領域から隔離している第1導電型のボディ領域と、
エミッタ領域とドリフト領域を隔離している範囲のボディ領域、その範囲のボディ領域と隣接するエミッタ領域の一部及びその範囲のボディ領域と隣接するドリフト領域の一部と対向するプレーナゲート型の絶縁ゲートと、が設けられており、
前記センスセル領域のプレーナゲート型の素子領域にのみ、第2導電型のキャリア蓄積領域が形成されており、
前記キャリア蓄積領域は、前記ドリフト領域のうち、前記プレーナゲート型の絶縁ゲートと対向する位置であって、前記プレーナゲート型の絶縁ゲートと前記コレクタ領域との間の深さの位置に、形成されていることを特徴とするバイポーラ型の半導体装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2009/055827 WO2010109596A1 (ja) | 2009-03-24 | 2009-03-24 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010109596A1 JPWO2010109596A1 (ja) | 2012-09-20 |
JP5447504B2 true JP5447504B2 (ja) | 2014-03-19 |
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Application Number | Title | Priority Date | Filing Date |
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JP2011505707A Expired - Fee Related JP5447504B2 (ja) | 2009-03-24 | 2009-03-24 | 半導体装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8604514B2 (ja) |
JP (1) | JP5447504B2 (ja) |
DE (1) | DE112009004595B4 (ja) |
WO (1) | WO2010109596A1 (ja) |
Cited By (1)
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US8941888B2 (en) | 1996-10-15 | 2015-01-27 | Antopholi Software, Llc | Facsimile to E-mail communication system with local interface |
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JP5694505B2 (ja) | 2010-03-23 | 2015-04-01 | アーベーベー・テヒノロギー・アーゲー | 電力半導体デバイス |
JP5788678B2 (ja) * | 2011-01-05 | 2015-10-07 | ローム株式会社 | 半導体装置およびその製造方法 |
JP5985624B2 (ja) | 2011-07-07 | 2016-09-06 | アーベーベー・テヒノロギー・アーゲー | 絶縁ゲート型トランジスタおよびその製造方法 |
ITTO20120742A1 (it) * | 2012-08-24 | 2014-02-25 | St Microelectronics Srl | Dispositivo a semiconduttore con modalita' operative lineare e a commutazione migliorate, metodo di fabbricazione del dispositivo a semiconduttore, e metodo di polarizzazione del dispositivo a semiconduttore |
JP6077252B2 (ja) * | 2012-09-28 | 2017-02-08 | エスアイアイ・セミコンダクタ株式会社 | 半導体集積回路装置 |
US8878238B2 (en) * | 2012-10-01 | 2014-11-04 | Pakal Technologies Llc | MCT device with base-width-determined latching and non-latching states |
WO2014091545A1 (ja) * | 2012-12-10 | 2014-06-19 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
EP3075011B1 (en) * | 2013-11-29 | 2018-02-28 | ABB Schweiz AG | Insulated gate bipolar transistor |
JP2016115698A (ja) * | 2014-12-11 | 2016-06-23 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
JP6746978B2 (ja) | 2016-03-15 | 2020-08-26 | 富士電機株式会社 | 半導体装置 |
USD820046S1 (en) | 2016-05-06 | 2018-06-12 | Yeti Coolers, Llc | Container |
JP6805620B2 (ja) | 2016-08-10 | 2020-12-23 | 富士電機株式会社 | 半導体装置 |
JP6769165B2 (ja) | 2016-08-10 | 2020-10-14 | 富士電機株式会社 | 半導体装置 |
JP6693438B2 (ja) * | 2017-02-15 | 2020-05-13 | 株式会社デンソー | 半導体装置 |
JP6391863B2 (ja) * | 2018-01-16 | 2018-09-19 | 富士電機株式会社 | トレンチmos型半導体装置 |
CN109801911A (zh) * | 2019-01-29 | 2019-05-24 | 上海擎茂微电子科技有限公司 | 一种混合元胞型集成igbt器件 |
JP7118033B2 (ja) * | 2019-06-07 | 2022-08-15 | 三菱電機株式会社 | 半導体装置 |
US11728422B2 (en) * | 2019-11-14 | 2023-08-15 | Stmicroelectronics S.R.L. | Power MOSFET device having improved safe-operating area and on resistance, manufacturing process thereof and operating method thereof |
JP2021141179A (ja) | 2020-03-04 | 2021-09-16 | 富士電機株式会社 | 半導体装置 |
CN111640717B (zh) * | 2020-05-29 | 2022-09-30 | 上海擎茂微电子科技有限公司 | 一种导通均匀性高的半导体功率器件 |
IT202000015076A1 (it) | 2020-06-23 | 2021-12-23 | St Microelectronics Srl | Dispositivo elettronico in 4h-sic con prestazioni di corto circuito migliorate, e relativo metodo di fabbricazione |
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2009
- 2009-03-24 WO PCT/JP2009/055827 patent/WO2010109596A1/ja active Application Filing
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JPWO2010109596A1 (ja) | 2012-09-20 |
US8604514B2 (en) | 2013-12-10 |
DE112009004595B4 (de) | 2015-04-09 |
US20120007139A1 (en) | 2012-01-12 |
DE112009004595T5 (de) | 2012-08-23 |
WO2010109596A1 (ja) | 2010-09-30 |
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