JP6769165B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6769165B2 JP6769165B2 JP2016157940A JP2016157940A JP6769165B2 JP 6769165 B2 JP6769165 B2 JP 6769165B2 JP 2016157940 A JP2016157940 A JP 2016157940A JP 2016157940 A JP2016157940 A JP 2016157940A JP 6769165 B2 JP6769165 B2 JP 6769165B2
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- 239000004065 semiconductor Substances 0.000 title claims description 158
- 238000001514 detection method Methods 0.000 claims description 196
- 239000000758 substrate Substances 0.000 claims description 99
- 210000000746 body region Anatomy 0.000 claims description 82
- 230000006870 function Effects 0.000 claims description 16
- 230000003915 cell function Effects 0.000 claims 5
- 239000012535 impurity Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 14
- 239000011229 interlayer Substances 0.000 description 13
- 238000009751 slip forming Methods 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- CVRPVRHBAOPDIG-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;2-(2-methylprop-2-enoyloxy)ethyl 1,3-dioxo-2-benzofuran-5-carboxylate Chemical compound COC(=O)C(C)=C.CC(=C)C(=O)OCCOC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 CVRPVRHBAOPDIG-UHFFFAOYSA-N 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Description
特許文献1 特開2010−219258号公報
図2は、図1におけるA−A'断面の第1実施形態を示す図である。図2に示す各構成は、図2の紙面と垂直な方向に延伸して形成されてよい。図2においては、一例として、半導体装置100の下面側においては、n+型の不純物がドープされたドレイン領域33が形成され、ドレイン領域33の下面側にドレイン電極14が形成されている。なお、その他の例としては、p+若しくはp−型の不純物がドープされたコレクタ領域が形成され、コレクタ領域の下面側にコレクタ電極が形成されてもよい。また、半導体装置100の下面側にn型の不純物がドープされたn型領域を形成し、さらにn型領域の下面側にp型の不純物がドープされたp型領域が形成されたコレクタ領域が形成され、コレクタ領域の下面側にコレクタ電極が形成されてもよい。また、逆導通型の絶縁ゲートバイポーラトランジスタ(Reverse Conducting Insulated Gate Bipolar Transistor)のような半導体装置100の下面側にp型の不純物がドープされたp型領域と、n型の不純物がドープされたn型領域の両方を備えたコレクタ領域を形成し、コレクタ領域の下面側にコレクタ電極が形成されてもよい。
図10は、図1におけるA−A'断面の第2実施形態を示す図である。本実施形態の半導体装置100は、図1から図9に示したいずれかの構造から、追加電極50を削除した構造を有する。図10では、図4に示した構造から、追加電極50を削除した構造を示している。
図17は、図1に示す半導体装置100の上面における、電流検出用電極12の角部の近傍B部を拡大した模式図である。図17は、図16と同様に図2に示した構造に対応している。図17は、トレンチ部40、ベース領域34、ソース領域38、p+領域36、追加電極50、ソース電極11および電流検出用電極12を示しており、他の構造を省略している。図17は、中間領域24にp+領域36を形成している点が図16と異なる。図17の例も図16の例と同様な効果を得ることができる。
Claims (13)
- 半導体基板と、
前記半導体基板の内部に形成された1以上の動作用セルを含む本体領域と、
前記半導体基板の内部に形成された1以上の電流検出用セルを含む電流検出領域と、
前記本体領域と前記電流検出領域との間において、前記半導体基板の内部に形成された中間領域と、
前記本体領域の少なくとも一部の領域の上方に形成された上面側電極と、
前記電流検出領域の少なくとも一部の領域の上方に形成され、前記上面側電極と分離している電流検出用電極と、
前記中間領域の少なくとも一部の領域の上方、および前記本体領域の少なくとも一部の領域または前記電流検出領域の少なくとも一部の領域の上方に形成され、前記上面側電極および前記電流検出用電極の一方に接続された追加電極と
を備える半導体装置。 - 前記動作用セルおよび前記電流検出用セルは、前記半導体基板の深さ方向に電流を流すトランジスタとして機能し、
前記中間領域は、前記半導体基板の深さ方向に電流を流すダイオードとして機能する中間セルを含む
請求項1に記載の半導体装置。 - 前記追加電極は、前記上面側電極および前記電流検出用電極よりも薄く形成された
請求項2に記載の半導体装置。 - 半導体基板と、
前記半導体基板の内部に形成された1以上の動作用セルを含む本体領域と、
前記半導体基板の内部に形成された1以上の電流検出用セルを含む電流検出領域と、
前記本体領域と前記電流検出領域との間において、前記半導体基板の内部に形成された中間領域と、
前記本体領域の少なくとも一部の領域の上方に形成された上面側電極と、
前記電流検出領域の少なくとも一部の領域の上方に形成され、前記上面側電極と分離している電流検出用電極と、
前記中間領域の少なくとも一部の領域の上方に形成され、前記上面側電極および前記電流検出用電極の一方に接続された追加電極と
を備え、
前記動作用セルおよび前記電流検出用セルは、前記半導体基板の深さ方向に電流を流すトランジスタとして機能し、
前記中間領域は、前記半導体基板の深さ方向に電流を流すダイオードとして機能する中間セルを含み、
前記動作用セル、前記電流検出用セルおよび前記中間セルが同一の間隔で形成された半導体装置。 - 半導体基板と、
前記半導体基板の内部に形成された1以上の動作用セルを含む本体領域と、
前記半導体基板の内部に形成された1以上の電流検出用セルを含む電流検出領域と、
前記本体領域と前記電流検出領域との間において、前記半導体基板の内部に形成された中間領域と、
前記本体領域の少なくとも一部の領域の上方に形成された上面側電極と、
前記電流検出領域の少なくとも一部の領域の上方に形成され、前記上面側電極と分離している電流検出用電極と、
前記中間領域の少なくとも一部の領域の上方に形成され、前記上面側電極および前記電流検出用電極の一方に接続された追加電極と
を備え、
前記動作用セルおよび前記電流検出用セルは、前記半導体基板の深さ方向に電流を流すトランジスタとして機能し、
前記中間領域は、前記半導体基板の深さ方向に電流を流すダイオードとして機能する中間セルを含み、
前記半導体基板の内部には、
第1導電型のベース領域と、
前記ベース領域の下方に形成された第2導電型のドリフト領域と、
前記半導体基板の上面から前記ベース領域の下側まで延伸して形成され、同一の間隔で配置された複数のトレンチ部と
が形成され、
それぞれのトレンチ部の間の領域が、前記動作用セル、前記電流検出用セルおよび前記中間セルのいずれかとして機能し、
前記動作用セルおよび前記電流検出用セルには、前記ベース領域の上方に第2導電型の高濃度領域が形成され、
前記中間セルには、前記ベース領域の上方に前記高濃度領域が形成されていない半導体装置。 - 前記電流検出用電極が、一部の前記中間セルの上方にも形成されている
請求項2から5のいずれか一項に記載の半導体装置。 - 前記上面側電極が、一部の前記中間セルの上方にも形成されている
請求項2から6のいずれか一項に記載の半導体装置。 - 半導体基板と、
前記半導体基板の内部に形成された1以上の動作用セルを含む本体領域と、
前記半導体基板の内部に形成された1以上の電流検出用セルを含む電流検出領域と、
前記本体領域と前記電流検出領域との間において、前記半導体基板の内部に形成された中間領域と、
前記本体領域の少なくとも一部の領域の上方に形成された上面側電極と、
前記電流検出領域の少なくとも一部の領域の上方に形成され、前記上面側電極と分離している電流検出用電極と、
前記中間領域の少なくとも一部の領域の上方に形成され、前記上面側電極および前記電流検出用電極の一方に接続された追加電極と
を備え、
前記動作用セルおよび前記電流検出用セルは、前記半導体基板の深さ方向に電流を流すトランジスタとして機能し、
前記中間領域は、前記半導体基板の深さ方向に電流を流すダイオードとして機能する中間セルを含み、
前記上面側電極が、一部の前記中間セルの上方にも形成され、
前記電流検出用電極の下方に形成された前記中間セルの数が、前記上面側電極の下方に形成された前記中間セルの数以上である半導体装置。 - 半導体基板と、
前記半導体基板の内部に形成された1以上の動作用セルを含む本体領域と、
前記半導体基板の内部に形成された1以上の電流検出用セルを含む電流検出領域と、
前記本体領域と前記電流検出領域との間において、前記半導体基板の内部に形成された中間領域と、
前記本体領域の少なくとも一部の領域の上方に形成された上面側電極と、
前記電流検出領域の少なくとも一部の領域の上方に形成され、前記上面側電極と分離している電流検出用電極と、
前記中間領域の少なくとも一部の領域の上方に形成され、前記上面側電極および前記電流検出用電極の一方に接続された追加電極と
を備え、
前記追加電極は、前記電流検出用電極に接続されており、
前記追加電極は、前記電流検出用電極の全体の下方に形成される半導体装置。 - 前記追加電極は、前記上面側電極に接続されており、
前記追加電極は、前記上面側電極の一部の下方に形成される
請求項1から8のいずれか一項に記載の半導体装置。 - 半導体基板と、
前記半導体基板の内部に形成された1以上の動作用セルを含む本体領域と、
前記半導体基板の内部に形成された1以上の電流検出用セルを含む電流検出領域と、
前記本体領域と前記電流検出領域との間において、前記半導体基板の内部に形成された中間領域と、
前記本体領域の少なくとも一部の領域の上方に形成された上面側電極と、
前記電流検出領域の少なくとも一部の領域の上方に形成され、前記上面側電極と分離している電流検出用電極と、
前記中間領域の少なくとも一部の領域の上方に形成され、前記上面側電極および前記電流検出用電極の一方に接続された追加電極と
を備え、
前記追加電極は、開口部を有する半導体装置。 - 半導体基板と、
前記半導体基板の内部に形成された1以上の動作用セルを含む本体領域と、
前記半導体基板の内部に形成された1以上の電流検出用セルを含む電流検出領域と、
前記本体領域と前記電流検出領域との間において、前記半導体基板の内部に形成された中間領域と、
前記本体領域の少なくとも一部の領域の上方に形成された上面側電極と、
前記電流検出領域の少なくとも一部の領域の上方に形成され、前記上面側電極と分離している電流検出用電極と、
前記中間領域の少なくとも一部の領域の上方に形成され、前記上面側電極および前記電流検出用電極の一方に接続された追加電極と
を備え、
前記半導体基板の内部には、
第1導電型のベース領域と、
前記ベース領域の下方に形成された第2導電型のドリフト領域と、
前記半導体基板の上面から前記ベース領域の下側まで延伸して形成され、同一の間隔で配置された複数のトレンチ部と、
前記ドリフト領域内に交互に配置された第1導電型のカラムおよび第2導電型のカラムと
が形成されている半導体装置。 - 半導体基板と、
前記半導体基板の内部に形成された1以上の動作用セルを含む本体領域と、
前記半導体基板の内部に形成された1以上の電流検出用セルを含む電流検出領域と、
前記本体領域と前記電流検出領域との間において、前記半導体基板の内部に形成された1以上の中間セルを含む中間領域と、
前記本体領域の少なくとも一部の領域の上方に形成された上面側電極と、
前記電流検出領域の少なくとも一部の領域の上方に形成され、前記上面側電極と分離している電流検出用電極と
を備え、
前記動作用セル、前記電流検出用セルおよび前記中間セルは同一の間隔で配置され、
前記動作用セルおよび前記電流検出用セルは前記半導体基板の深さ方向に電流を流すトランジスタとして機能し、
前記中間セルは、前記半導体基板の深さ方向に電流を流すダイオードとして機能する
半導体装置。
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