JP5421240B2 - ヒドロシリル化硬化性組成物 - Google Patents
ヒドロシリル化硬化性組成物 Download PDFInfo
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- JP5421240B2 JP5421240B2 JP2010503464A JP2010503464A JP5421240B2 JP 5421240 B2 JP5421240 B2 JP 5421240B2 JP 2010503464 A JP2010503464 A JP 2010503464A JP 2010503464 A JP2010503464 A JP 2010503464A JP 5421240 B2 JP5421240 B2 JP 5421240B2
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- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-M bromate Inorganic materials [O-]Br(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-M 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
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- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
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- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- 125000001309 chloro group Chemical group Cl* 0.000 description 1
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- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
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- 238000007336 electrophilic substitution reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
- C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
- C08L43/04—Homopolymers or copolymers of monomers containing silicon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
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- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Sealing Material Composition (AREA)
- Silicon Polymers (AREA)
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| GB0707176.4 | 2007-04-16 | ||
| GB0707176A GB0707176D0 (en) | 2007-04-16 | 2007-04-16 | Hydrosilylation curable compositions |
| PCT/EP2008/054268 WO2008125561A2 (en) | 2007-04-16 | 2008-04-09 | Hydrosilylation curable compositions |
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| JP2010526160A5 JP2010526160A5 (enExample) | 2011-05-12 |
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| GB0707278D0 (en) * | 2007-04-16 | 2007-05-23 | Dow Corning | Condensation curable compositions having improved self adhesion to substrates |
| GB0707176D0 (en) | 2007-04-16 | 2007-05-23 | Dow Corning | Hydrosilylation curable compositions |
| JP2013231113A (ja) * | 2012-04-27 | 2013-11-14 | Henkel Japan Ltd | 接着シート |
| JP6055609B2 (ja) | 2012-04-27 | 2016-12-27 | ヘンケルジャパン株式会社 | 電力機器用ホットメルト接着剤 |
| EP2673786B1 (en) * | 2012-06-05 | 2015-08-19 | Dow Corning Corporation | Soft tacky gel for use in power converters |
| KR20150038060A (ko) * | 2012-07-19 | 2015-04-08 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 작용화된 아이소부틸렌-아이소프렌 공중합체 조성물 |
| CN103360422B (zh) * | 2013-07-11 | 2015-10-28 | 华南理工大学 | 改性含氢环四硅氧烷粘接促进剂及其制备方法和应用 |
| EP3077578A4 (en) | 2013-12-05 | 2017-07-26 | Honeywell International Inc. | Stannous methansulfonate solution with adjusted ph |
| PL3166999T3 (pl) | 2014-07-07 | 2023-07-03 | Honeywell International Inc. | Materiał termoprzewodzący ze zmiataczem jonów |
| CN112080258A (zh) | 2014-12-05 | 2020-12-15 | 霍尼韦尔国际公司 | 具有低热阻的高性能热界面材料 |
| US20180085993A1 (en) | 2015-05-22 | 2018-03-29 | Luxexcel Holding B.V. | Method for printing a three-dimensional structure and a system for printing a three-dimensional structure |
| US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
| WO2017152353A1 (en) | 2016-03-08 | 2017-09-14 | Honeywell International Inc. | Phase change material |
| JP2017186229A (ja) * | 2016-04-01 | 2017-10-12 | 旭硝子株式会社 | 車両用合わせガラス |
| US10532636B2 (en) * | 2016-04-01 | 2020-01-14 | AGC Inc. | Laminated glass for vehicle |
| US10865297B2 (en) * | 2016-07-14 | 2020-12-15 | Threebond Co., Ltd. | Curable resin composition, cured product, fuel cell, and sealing method |
| US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| EP3645617A4 (en) * | 2017-06-29 | 2021-02-17 | Dow Global Technologies Llc | COMPOSITION OF POLYOLEFIN |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
| JP6801638B2 (ja) * | 2017-12-12 | 2020-12-16 | 信越化学工業株式会社 | 熱硬化性フルオロポリエーテル系接着剤組成物及び電気・電子部品 |
| US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| US20200139687A1 (en) * | 2018-10-31 | 2020-05-07 | Saint-Gobain Performance Plastics Corporation | Multilayer curable articles |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| WO2021132349A1 (ja) * | 2019-12-26 | 2021-07-01 | ダウ・東レ株式会社 | 硬化性オルガノポリシロキサン組成物及びその硬化物、保護剤又は接着剤、並びに電気・電子機器 |
| CN111500222B (zh) * | 2020-03-12 | 2021-07-20 | 郝建强 | 光开关固化型聚异丁烯胶粘剂组成物及其施胶工艺 |
| BR112022026555A2 (pt) | 2020-06-24 | 2023-01-17 | Dow Global Technologies Llc | Processo para formar uma composição reticulada, composição, composição reticulada, e, artigo |
| KR20230152093A (ko) * | 2021-03-03 | 2023-11-02 | 다우 글로벌 테크놀로지스 엘엘씨 | 경화성 폴리올레핀 조성물 및 경화된 조성물 |
| WO2022204935A1 (en) | 2021-03-30 | 2022-10-06 | Dow Global Technologies Llc | Curable polyolefin composition and cured product |
| CN113956826B (zh) * | 2021-10-29 | 2023-04-07 | 浙江洁美电子科技股份有限公司 | 一种粘结组合物、保护膜及其应用 |
| CN114335591A (zh) * | 2021-12-28 | 2022-04-12 | 郝建强 | 氢燃料电池用低硬度热固化聚异丁烯密封胶 |
| WO2024054422A1 (en) * | 2022-09-09 | 2024-03-14 | Dow Silicones Corporation | ELASTOMER WITH C-O-Si LINKAGES BETWEEN POLYESTER BACKBONE AND CROSSLINKER |
| CN117903342A (zh) * | 2024-01-18 | 2024-04-19 | 中国科学院上海有机化学研究所 | 一类具有高频低介电常数的可热交联聚合物及其制备方法和应用 |
| CN119432186A (zh) * | 2025-01-06 | 2025-02-14 | 山东孚日宣威新材料科技有限公司 | 一种在高温表面施工的隔热涂料及其制备方法 |
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| US3923705A (en) * | 1974-10-30 | 1975-12-02 | Dow Corning | Method of preparing fire retardant siloxane foams and foams prepared therefrom |
| US3989667A (en) * | 1974-12-02 | 1976-11-02 | Dow Corning Corporation | Olefinic siloxanes as platinum inhibitors |
| US3989668A (en) * | 1975-07-14 | 1976-11-02 | Dow Corning Corporation | Method of making a silicone elastomer and the elastomer prepared thereby |
| DE2635601C3 (de) * | 1976-08-07 | 1985-06-05 | Chemische Werke Hüls AG, 4370 Marl | Polymere Haftvermittler für vulkanisierbare Mischungen aus Kautschuken und mineralischen Füllstoffen |
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| CA1274647C (en) * | 1986-06-25 | 1990-09-25 | CURING ISOBUTYLENE POLYMER | |
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| GB0707278D0 (en) * | 2007-04-16 | 2007-05-23 | Dow Corning | Condensation curable compositions having improved self adhesion to substrates |
-
2007
- 2007-04-16 GB GB0707176A patent/GB0707176D0/en not_active Ceased
-
2008
- 2008-04-09 US US12/595,889 patent/US8865800B2/en not_active Expired - Fee Related
- 2008-04-09 KR KR1020097021567A patent/KR20100015618A/ko not_active Abandoned
- 2008-04-09 CN CN2008800122482A patent/CN101675115B/zh not_active Expired - Fee Related
- 2008-04-09 JP JP2010503464A patent/JP5421240B2/ja not_active Expired - Fee Related
- 2008-04-09 EP EP20080735994 patent/EP2142604A2/en not_active Withdrawn
- 2008-04-09 WO PCT/EP2008/054268 patent/WO2008125561A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008125561A3 (en) | 2009-10-29 |
| GB0707176D0 (en) | 2007-05-23 |
| US20100206477A1 (en) | 2010-08-19 |
| EP2142604A2 (en) | 2010-01-13 |
| JP2010526160A (ja) | 2010-07-29 |
| KR20100015618A (ko) | 2010-02-12 |
| CN101675115B (zh) | 2012-07-18 |
| CN101675115A (zh) | 2010-03-17 |
| US8865800B2 (en) | 2014-10-21 |
| WO2008125561A2 (en) | 2008-10-23 |
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