JP5409673B2 - 半導体用ボンディングワイヤ - Google Patents
半導体用ボンディングワイヤ Download PDFInfo
- Publication number
- JP5409673B2 JP5409673B2 JP2011049537A JP2011049537A JP5409673B2 JP 5409673 B2 JP5409673 B2 JP 5409673B2 JP 2011049537 A JP2011049537 A JP 2011049537A JP 2011049537 A JP2011049537 A JP 2011049537A JP 5409673 B2 JP5409673 B2 JP 5409673B2
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- JP
- Japan
- Prior art keywords
- wire
- layer
- outer peripheral
- core wire
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/042—Manufacture of coated wire or bars
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0272—Rods, electrodes, wires with more than one layer of coating or sheathing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
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- C22C21/02—Alloys based on aluminium with silicon as the next major constituent
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Description
ここで、Eは弾性率、Iは断面2次モーメントである。ここで、芯線/中間層/外周部からなるワイヤでは、式(1)の弾性率と断面2次モーメントの積EIは、芯線(In)、中間層(Mid)、外周部(Out)それぞれの部材の弾性率EIn,EMid,EOut、および断面2次モーメントIIn,IMid,IOutを用いて、次式で近似できる。
また、芯線の内径d1、ワイヤ直径d2、中間層の厚さrを用いると、芯線、中間層、外周部それぞれの断面2次モーメントIIn,IMid,IOutは、
IIn=π・d1 4/64 ・・・・・(3)
IMid=π((d1+r)4−d1 4)/64 ・・・・・(4)
IOut=π(d2 4−(d1 +r)4)/64・ ・・・・(5)
で表すことができる。
この相互拡散係数Diについては、溶媒元素を主成分とする拡散層の場合は、その溶媒元素中での溶質元素の拡散速度に近い値であり、一方、芯線および外周部に含有される溶質元素を主体とする拡散層の場合は、
Di=(DIncIn+DOutcOut) ・・・・・(7)
で表される。ここで、芯線および外周部の溶媒金属の拡散係数DIn,DOutと、拡散層中のそれら溶媒金属の濃度cIn,cOut(cIn+cOut=1)を用いた。この相互拡散係数Diは拡散層の成長速度に相当するもので、上式から判るように、拡散層中の組成cIn,cOutも関与している。2元系の組み合わせでの拡散定数DIn,DOutは比較的多く報告されており、利用することが可能である。さらに、この相互拡散係数Dと加熱温度Tとの関係は、
D=f・exp(−Q/RT)・・・・・ (8)
で表される。ここで、Qは拡散の活性化エネルギーであり、Rは気体定数、fは定数である。fとQは元素の組み合わせにより固有の物性値であり、fとQが判明すれば相互拡散係数Diを知ることができ、式(6)より拡散層の厚さLを計算することができる。
C=a+blnx ・・・・・(9)
で表される。ここで、a,bは定数である。式(6)の拡散層厚さと、式(9)の濃度などを十分考慮して、熱処理条件を選定することが重要である。すなわち、目標とする拡散層厚さL、濃度分布Cを得るには、加熱温度Tが決まれば拡散時間tを求めることができ、一方、拡散時間tが先に決まっている場合には加熱温度Tを求めることができる。
d=k・t1/2 ・・・(10)
で表される。成長速度kは、化合物層成長の活性化エネルギーEを用いて、
k=ko・exp(−E/RT) ・・・(11)
で表される。ここで、ko,Eは、金属間化合物の種類によりほぼ決まるが、元素の組み合わせなども影響を及ぼす場合がある。安定して金属間化合物を成長させるには、活性化エネルギーEを超える熱量を与える必要があり、しかも活性化エネルギーEは相により異なる。従って、こうした金属間化合物の成長挙動を理解した上で、温度、加熱時間などを制御することにより、生成させたい金属間化合物を優先的に形成させることも可能となる。
0.3TmO<Td<0.9TmO ・・・・・(12)
を満足することが望ましい。この範囲で温度を設定し、さらに加熱時間を制御することにより、所定の中間層の厚みを得ることができる。
本実施例は、本発明の(1)〜(3)に記載のボンディングワイヤに関するものである。
2 外周部
3 拡散層
4 金属間化合物層
5 中間層(拡散層および金属間化合物層の総称)
6 分析ライン
7 最表面層
8 中層
d1 芯線の直径
d2 ワイヤ直径
r 中間層の厚さ
Claims (3)
- 導電性を有する第1の金属としてPd,Cu,Ni,Fe,から選ばれる1種または該第1の金属を主成分とする合金からなる芯線と、前記芯線の第1の金属とは異なる導電性を有する第2の金属としてAu,Pt,Pd,Ag,Alから選ばれる1種または該第2の金属を主成分とする合金からなる中層と、前記中層の第2の金属とは異なる導電性の金属またはその合金からなる外周部から構成され、さらに、その芯線と中層との間、および、中層と外周部との間には、厚さ0.05μm以上の拡散層または厚さ0.03μm以上の金属間化合物層の少なくとも1種以上を有することを特徴とする半導体用ボンディングワイヤ。
- 請求項1に記載の半導体用ボンディングワイヤにおいて、前記ボンディングワイヤの外周部のさらに外側に、外周部の主成分金属とは異なる導電性の金属またはその金属を主成分とする合金からなる最表面層を有することを特徴とする半導体用ボンディングワイヤ。
- 前記拡散層が、濃度勾配を有することを特徴とする請求項1又は2に記載の半導体用ボンディングワイヤ。
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-
2001
- 2001-09-18 US US10/380,749 patent/US7969021B2/en not_active Expired - Fee Related
- 2001-09-18 MY MYPI20014368A patent/MY137479A/en unknown
- 2001-09-18 WO PCT/JP2001/008110 patent/WO2002023618A1/ja not_active Application Discontinuation
- 2001-09-18 KR KR1020067007647A patent/KR100717667B1/ko active IP Right Review Request
- 2001-09-18 JP JP2002527565A patent/JP4868694B2/ja not_active Expired - Lifetime
- 2001-09-18 KR KR1020037003833A patent/KR100739378B1/ko active IP Right Grant
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2010
- 2010-03-23 JP JP2010066859A patent/JP5349382B2/ja not_active Expired - Lifetime
- 2010-03-23 JP JP2010066860A patent/JP5349383B2/ja not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
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JP5349383B2 (ja) | 2013-11-20 |
JP4868694B2 (ja) | 2012-02-01 |
JP2013080960A (ja) | 2013-05-02 |
KR20030033066A (ko) | 2003-04-26 |
JP2010166080A (ja) | 2010-07-29 |
KR20060041322A (ko) | 2006-05-11 |
JP5349382B2 (ja) | 2013-11-20 |
JPWO2002023618A1 (ja) | 2004-01-22 |
MY137479A (en) | 2009-01-30 |
US20040014266A1 (en) | 2004-01-22 |
JP2010166079A (ja) | 2010-07-29 |
JP5451908B2 (ja) | 2014-03-26 |
KR100717667B1 (ko) | 2007-05-11 |
KR100739378B1 (ko) | 2007-07-16 |
US7969021B2 (en) | 2011-06-28 |
JP5506959B2 (ja) | 2014-05-28 |
JP2013140986A (ja) | 2013-07-18 |
JP2011124611A (ja) | 2011-06-23 |
WO2002023618A1 (fr) | 2002-03-21 |
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