JP5338626B2 - シリコーン粘着剤組成物及び粘着フィルム - Google Patents

シリコーン粘着剤組成物及び粘着フィルム Download PDF

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Publication number
JP5338626B2
JP5338626B2 JP2009256728A JP2009256728A JP5338626B2 JP 5338626 B2 JP5338626 B2 JP 5338626B2 JP 2009256728 A JP2009256728 A JP 2009256728A JP 2009256728 A JP2009256728 A JP 2009256728A JP 5338626 B2 JP5338626 B2 JP 5338626B2
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Prior art keywords
film
parts
sio
group
sensitive adhesive
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JP2009256728A
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Japanese (ja)
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JP2011102336A5 (enExample
JP2011102336A (ja
Inventor
泰嘉 黒田
俊司 青木
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2009256728A priority Critical patent/JP5338626B2/ja
Priority to US12/911,262 priority patent/US20110111217A1/en
Priority to EP10251902.2A priority patent/EP2322584B1/en
Priority to TW099138504A priority patent/TWI481691B/zh
Priority to KR1020100110792A priority patent/KR101669681B1/ko
Priority to CN201010539299.XA priority patent/CN102051153B/zh
Publication of JP2011102336A publication Critical patent/JP2011102336A/ja
Publication of JP2011102336A5 publication Critical patent/JP2011102336A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
JP2009256728A 2009-11-10 2009-11-10 シリコーン粘着剤組成物及び粘着フィルム Active JP5338626B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009256728A JP5338626B2 (ja) 2009-11-10 2009-11-10 シリコーン粘着剤組成物及び粘着フィルム
US12/911,262 US20110111217A1 (en) 2009-11-10 2010-10-25 Silicone base pressure-sensitive adhesive composition and film
EP10251902.2A EP2322584B1 (en) 2009-11-10 2010-11-04 Silicone base pressure-sensitive adhesive compositions and film
KR1020100110792A KR101669681B1 (ko) 2009-11-10 2010-11-09 실리콘 점착제 조성물 및 점착 필름
TW099138504A TWI481691B (zh) 2009-11-10 2010-11-09 Silicone adhesive composition and adhesive film
CN201010539299.XA CN102051153B (zh) 2009-11-10 2010-11-10 硅氧烷基压敏粘合剂组合物和膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009256728A JP5338626B2 (ja) 2009-11-10 2009-11-10 シリコーン粘着剤組成物及び粘着フィルム

Publications (3)

Publication Number Publication Date
JP2011102336A JP2011102336A (ja) 2011-05-26
JP2011102336A5 JP2011102336A5 (enExample) 2011-12-22
JP5338626B2 true JP5338626B2 (ja) 2013-11-13

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JP2009256728A Active JP5338626B2 (ja) 2009-11-10 2009-11-10 シリコーン粘着剤組成物及び粘着フィルム

Country Status (6)

Country Link
US (1) US20110111217A1 (enExample)
EP (1) EP2322584B1 (enExample)
JP (1) JP5338626B2 (enExample)
KR (1) KR101669681B1 (enExample)
CN (1) CN102051153B (enExample)
TW (1) TWI481691B (enExample)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
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CN103946328A (zh) * 2011-11-22 2014-07-23 日东电工株式会社 表面保护膜
JP2013107997A (ja) * 2011-11-22 2013-06-06 Nitto Denko Corp 表面保護フィルム
JP2013107998A (ja) * 2011-11-22 2013-06-06 Nitto Denko Corp 表面保護フィルム
JP2014047310A (ja) * 2012-09-03 2014-03-17 Shin Etsu Chem Co Ltd 粘着性フィルムとその製造方法
WO2014038626A1 (ja) * 2012-09-05 2014-03-13 信越ポリマー株式会社 帯電防止性剥離剤及び帯電防止性剥離フィルム
CN104955899B (zh) * 2013-01-23 2017-05-24 信越聚合物株式会社 防带电性剥离剂用组合物及防带电性剥离膜
US20140272290A1 (en) * 2013-03-15 2014-09-18 Intermolecular Inc. Polymer Anti-glare Coatings and Methods for Forming the Same
CN104109489B (zh) * 2013-04-22 2018-05-04 株式会社有泽制作所 覆盖膜及使用其的覆铜层压板
JP6245435B2 (ja) * 2013-12-20 2017-12-13 フジコピアン株式会社 吸着フィルム
KR20150078583A (ko) * 2013-12-31 2015-07-08 코오롱인더스트리 주식회사 수지 조성물 및 이를 이용한 플렉서블 디스플레이 기판
JP2015140375A (ja) * 2014-01-28 2015-08-03 フジコピアン株式会社 吸着フィルム
JP2015140373A (ja) * 2014-01-28 2015-08-03 フジコピアン株式会社 吸着フィルム
JP6168002B2 (ja) * 2014-02-27 2017-07-26 信越化学工業株式会社 基材密着性に優れるシリコーン粘着剤組成物及び粘着性物品
JP6364660B2 (ja) * 2014-03-27 2018-08-01 フジコピアン株式会社 吸着フィルム
JP6348434B2 (ja) * 2014-03-28 2018-06-27 信越化学工業株式会社 シリコーン粘着剤組成物、その製造法及び粘着フィルム
KR20150112851A (ko) * 2014-03-28 2015-10-07 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 점착제 조성물, 그의 제조 방법 및 점착 필름
JP6249862B2 (ja) * 2014-03-31 2017-12-20 リンテック株式会社 キャリアシート及び積層体
JP6251111B2 (ja) * 2014-04-10 2017-12-20 フジコピアン株式会社 両面粘着フィルム及びそれを用いた情報表示画面用の保護部材
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JP6427777B2 (ja) * 2014-12-22 2018-11-28 フジコピアン株式会社 両面粘着フィルム及びそれを用いた情報表示画面用の保護部材
CN104531055A (zh) * 2014-12-29 2015-04-22 宁波大榭开发区综研化学有限公司 一种硅酮粘合剂组合物
CN104762057B (zh) * 2015-04-03 2017-03-15 肇庆皓明有机硅材料有限公司 一种有机硅电子封装材料及其制备方法
JPWO2017065131A1 (ja) * 2015-10-14 2018-08-09 信越化学工業株式会社 衝撃吸収性画面保護フィルム
JP6936152B2 (ja) * 2015-11-30 2021-09-15 バンドー化学株式会社 表面保護フィルム
CN105969296A (zh) * 2016-06-27 2016-09-28 强新正品（苏州）环保材料科技有限公司 导电胶
CN106010344A (zh) * 2016-07-14 2016-10-12 强新正品（苏州）环保材料科技有限公司 一种导热双面胶
CN106190010A (zh) * 2016-08-08 2016-12-07 强新正品（苏州）环保材料科技有限公司 导电胶粘剂
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JP7037281B2 (ja) * 2017-03-31 2022-03-16 リンテック株式会社 帯電防止性シリコーン粘着剤組成物および保護シート
US20200354615A1 (en) * 2017-04-03 2020-11-12 Dow Toray Co., Ltd. Curing-reactive organopolysiloxane resin, pressure-sensitive adhesive composition using same, and use thereof
JP6797075B2 (ja) * 2017-05-18 2020-12-09 信越化学工業株式会社 熱伝導性シリコーンゴム複合シート
US11306230B2 (en) * 2017-07-05 2022-04-19 Shin-Etsu Chemical Co., Ltd. Ultraviolet curable silicone adhesive composition and silicone adhesive film
EP3645651B1 (en) 2017-10-19 2023-09-06 Dow Silicones Corporation A method for fabricating a flexible organic light emitting diode using a pressure sensitive adhesive composition
TWI802631B (zh) 2018-01-16 2023-05-21 日商信越化學工業股份有限公司 聚矽氧黏著劑組成物、硬化物、黏著膜及黏著帶
WO2019167479A1 (ja) 2018-02-28 2019-09-06 東レ・ダウコーニング株式会社 粘着フィルム
US11578172B2 (en) 2018-06-29 2023-02-14 Dow Silicones Corportation Anchorage additive and methods for its preparation and use
US20210246337A1 (en) 2018-06-29 2021-08-12 Dow Silicones Corporation Solventless silicone pressure sensitive adhesive and methods for making and using same
KR102539232B1 (ko) 2018-08-10 2023-06-08 다우 도레이 캄파니 리미티드 감압 접착층 형성성 오가노폴리실록산 조성물 및 이의 사용
EP3835388B1 (en) 2018-08-10 2023-08-30 Dow Toray Co., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
WO2020218879A1 (ko) * 2019-04-25 2020-10-29 삼성에스디아이 주식회사 실리콘계 점착성 보호 필름 및 이를 포함하는 광학 부재
KR102378700B1 (ko) * 2019-05-09 2022-03-24 삼성에스디아이 주식회사 실리콘계 점착성 보호 필름 및 이를 포함하는 광학 부재
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TW201134909A (en) 2011-10-16
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