CN105969296A - 导电胶 - Google Patents

导电胶 Download PDF

Info

Publication number
CN105969296A
CN105969296A CN201610473929.5A CN201610473929A CN105969296A CN 105969296 A CN105969296 A CN 105969296A CN 201610473929 A CN201610473929 A CN 201610473929A CN 105969296 A CN105969296 A CN 105969296A
Authority
CN
China
Prior art keywords
parts
conducting resinl
powder
conductive adhesive
accelerator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610473929.5A
Other languages
English (en)
Inventor
闫森源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Strong New Genuine (suzhou) Environmental Mstar Technology Ltd
Original Assignee
Strong New Genuine (suzhou) Environmental Mstar Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Strong New Genuine (suzhou) Environmental Mstar Technology Ltd filed Critical Strong New Genuine (suzhou) Environmental Mstar Technology Ltd
Priority to CN201610473929.5A priority Critical patent/CN105969296A/zh
Publication of CN105969296A publication Critical patent/CN105969296A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

本发明公开了一种导电胶，原料组成为：甲基氢基聚硅氧烷100份，导电填料80‑100份，稀释剂10‑20份，促进剂5‑10份，醇类延迟剂1‑5份，硅氧烷偶联剂1‑5份，份数均为质量份数。本发明提供的导电胶中，采用甲基乙烯基聚硅氧烷混合物作为主料，通过设计特殊成分稳定剂和导电填料为镍粉、银粉、铜粉、铝粉，使得产品具有优质的性能，形成导电通路，使导电胶具有导电性，胶层中粒子间的稳定接触是由于导电胶固化或干燥造成的。

Description

导电胶
技术领域
本发明涉及一种导电胶，属于LED硅胶技术领域。
背景技术
导电胶是一种固化或干燥后具有一定导电性能的胶黏剂，它通常以基体树脂和导电填料即导电粒子为主要组成成分， 通过基体树脂的粘接作用把导电粒子结合在一起， 形成导电通路， 实现被粘材料的导电连接。由于导电胶的基体树脂是一种胶黏剂， 可以选择适宜的固化温度进行粘接， 同时， 由于电子元件的小型化、微型化及印刷电路板的高密度化和高度集成化的迅速发展， 而导电胶可以制成浆料， 实现很高的线分辨率。而且导电胶工艺简单， 易于操作， 可提高生产效率，所以导电胶是替代铅锡焊接， 实现导电连接的理想选择。
发明内容
目的：为解决现有技术的不足，本发明提供一种导电胶。
技术方案：为解决上述技术问题，本发明采用的技术方案为：
一种导电胶，其原料组成为：甲基氢基聚硅氧烷100份，导电填料 80-100份，稀释剂10-20份，促进剂5-10份，醇类延迟剂1-5份，硅氧烷偶联剂1-5份，份数均为质量份数。
作为优选方案，所述的导电胶，其特征在于，其原料组成为：甲基氢基聚硅氧烷100份，导电填料 90份，稀释剂15份，促进剂8份，醇类延迟剂3份，硅氧烷偶联剂3份，份数均为质量份数。
作为优选方案，所述的导电胶，其特征在于：所述促进剂为改性胺类或改性咪唑类促进剂。
作为优选方案，所述的导电胶，其特征在于：所述醇类延迟剂选用1-乙烯基环己醇。
作为优选方案，所述的导电胶的使用方法，其特征在于：所述导电填料为镍粉、银粉、铜粉、铝粉中的一种或几种。
有益效果：本发明提供的导电胶中，采用甲基乙烯基聚硅氧烷混合物作为主料，通过设计特殊成分稳定剂和导电填料为镍粉、银粉、铜粉、铝粉，使得产品具有优质的性能，形成导电通路，使导电胶具有导电性，胶层中粒子间的稳定接触是由于导电胶固化或干燥造成的。导电胶在固化或干燥前，导电粒子在胶粘剂中是分离存在的，相互间没有连续接触，因而处于绝缘状态。导电胶固化或干燥后，由于溶剂的挥发和胶粘剂的固化而引起胶粘剂体积的收缩，使导电粒子相互间呈稳定的连续状态，因而表现出导电性。具有良好的导电性，其寿命比一般的双面贴纸长，常温下可工作最低5年。可广泛应用于电子电器，LED照明，五金行业，印刷行业等其他制造行业。
具体实施方式
下面结合实例对本发明做具体说明：
实施例1：一种导电胶，组成如下：
甲基氢基聚硅氧烷100份，导电填料 80份，稀释剂10份，促进剂5-10份，醇类延迟剂1份，硅氧烷偶联剂1份，份数均为质量份数。
实施例2：一种导电胶，组成如下：
甲基氢基聚硅氧烷100份，导电填料 90份，稀释剂15份，促进剂8份，醇类延迟剂3份，硅氧烷偶联剂3份，份数均为质量份数。
实施例3：一种导电胶，组成如下：
甲基氢基聚硅氧烷100份，导电填料 100份，稀释剂20份，促进剂10份，醇类延迟剂5份，硅氧烷偶联剂5份，份数均为质量份数。
以上实施例得到的产品，经过实验测试：本发明提供的导电胶中，采用甲基乙烯基聚硅氧烷混合物作为主料，通过设计特殊成分稳定剂和导电填料为镍粉、银粉、铜粉、铝粉，使得产品具有优质的性能，形成导电通路，使导电胶具有导电性，胶层中粒子间的稳定接触是由于导电胶固化或干燥造成的。导电胶在固化或干燥前，导电粒子在胶粘剂中是分离存在的，相互间没有连续接触，因而处于绝缘状态。导电胶固化或干燥后，由于溶剂的挥发和胶粘剂的固化而引起胶粘剂体积的收缩，使导电粒子相互间呈稳定的连续状态，因而表现出导电性。具有良好的导电性，其寿命比一般的双面贴纸长，常温下可工作最低5年。可广泛应用于电子电器，LED照明，五金行业，印刷行业等其他制造行业。
以上已以较佳实施例公开了本发明，然其并非用以限制本发明，凡采用等同替换或者等效变换方式所获得的技术方案，均落在本发明的保护范围之内。

Claims (5)

1.一种导电胶，其原料组成为：甲基氢基聚硅氧烷100份，导电填料 80-100份，稀释剂10-20份，促进剂5-10份，醇类延迟剂1-5份，硅氧烷偶联剂1-5份，份数均为质量份数。
2.根据权利要求1所述的导电胶，其特征在于，其原料组成为：甲基氢基聚硅氧烷100份，导电填料 90份，稀释剂15份，促进剂8份，醇类延迟剂3份，硅氧烷偶联剂3份，份数均为质量份数。
3.根据权利要求1所述的导电胶，其特征在于：所述促进剂为改性胺类或改性咪唑类促进剂。
4.根据权利要求1所述的导电胶，其特征在于：所述醇类延迟剂选用1-乙烯基环己醇。
5.根据权利要求1-4任一项所述的导电胶的使用方法，其特征在于：所述导电填料为镍粉、银粉、铜粉、铝粉中的一种或几种。
CN201610473929.5A 2016-06-27 2016-06-27 导电胶 Pending CN105969296A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610473929.5A CN105969296A (zh) 2016-06-27 2016-06-27 导电胶

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610473929.5A CN105969296A (zh) 2016-06-27 2016-06-27 导电胶

Publications (1)

Publication Number Publication Date
CN105969296A true CN105969296A (zh) 2016-09-28

Family

ID=57020120

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610473929.5A Pending CN105969296A (zh) 2016-06-27 2016-06-27 导电胶

Country Status (1)

Country Link
CN (1) CN105969296A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107216850A (zh) * 2017-06-20 2017-09-29 东莞市联洲知识产权运营管理有限公司 一种高导热高导电有机硅胶粘剂及其制备方法
CN111961436A (zh) * 2020-08-11 2020-11-20 上海锐朗光电材料有限公司 一种光伏叠瓦组件有机硅导电胶及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101918505A (zh) * 2008-01-17 2010-12-15 E.I.内穆尔杜邦公司 导电粘合剂
CN102051153A (zh) * 2009-11-10 2011-05-11 信越化学工业株式会社 硅氧烷基压敏粘合剂组合物和膜

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101918505A (zh) * 2008-01-17 2010-12-15 E.I.内穆尔杜邦公司 导电粘合剂
CN102051153A (zh) * 2009-11-10 2011-05-11 信越化学工业株式会社 硅氧烷基压敏粘合剂组合物和膜

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107216850A (zh) * 2017-06-20 2017-09-29 东莞市联洲知识产权运营管理有限公司 一种高导热高导电有机硅胶粘剂及其制备方法
CN111961436A (zh) * 2020-08-11 2020-11-20 上海锐朗光电材料有限公司 一种光伏叠瓦组件有机硅导电胶及其制备方法

Similar Documents

Publication Publication Date Title
CN102876270B (zh) 一种高粘接强度的环氧树脂导电胶
CN102516718A (zh) 一种树脂组合物以及该树脂组合物作为导热绝缘层的金属基覆铜板
CN103980854B (zh) 一种新型导电胶及其制备方法
KR20170100008A (ko) 무할로겐 무인 실리콘 수지 조성물 및 이를 사용한 프리프레그, 적층판, 동박 적층판 및 인쇄회로기판
TWI664223B (zh) 電極形成用樹脂組合物及晶片型電子零件以及其製造方法
JPWO2018173945A1 (ja) 回路基板用樹脂組成物とそれを用いた金属ベース回路基板
CN105504830A (zh) 单组份加成型导热有机硅橡胶及其制备方法
CN105960709B (zh) 导热片和半导体装置
CN105969296A (zh) 导电胶
CN107735477A (zh) 导电性粘接剂、导电性结构体以及电子部件
CN107142029B (zh) 一种各向异性导电胶膜及其制备方法和应用
CN105062006A (zh) 一种铝基覆铜箔板高导热绝缘介质胶膜的生产方法
CN103214796B (zh) 环氧树脂组合物、其制备方法以及其所制备的覆铜板
CN103170757A (zh) 锡膏及其制备方法
CN105062358B (zh) 一种高导热绝缘铝基板
CN106047229A (zh) 导电胶的制备方法
CN103192577A (zh) 一种高导热覆铜板制作方法
CN101781544A (zh) 粘合剂的组合物及其应用
CN105860882A (zh) 一种导电胶
JP2009246026A (ja) ペースト状接着剤及びこの接着剤を用いた電子部品内蔵基板の製造方法
CN109624441B (zh) 一种高导热的覆铜板及其制备方法
CN106281100A (zh) 导电胶片
CN106634775A (zh) 一种耐高温导电银胶
CN116367997A (zh) 树脂组合物、带树脂的金属箔、固化物、金属基底基板和电子部件
CN105925221A (zh) 一种高附着性的导热胶及其制备方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20160928

RJ01 Rejection of invention patent application after publication