JP5286706B2 - 電力用半導体装置とその製造方法 - Google Patents
電力用半導体装置とその製造方法 Download PDFInfo
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- JP5286706B2 JP5286706B2 JP2007180931A JP2007180931A JP5286706B2 JP 5286706 B2 JP5286706 B2 JP 5286706B2 JP 2007180931 A JP2007180931 A JP 2007180931A JP 2007180931 A JP2007180931 A JP 2007180931A JP 5286706 B2 JP5286706 B2 JP 5286706B2
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- 239000004065 semiconductor Substances 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title description 11
- 230000005684 electric field Effects 0.000 claims description 51
- 230000015556 catabolic process Effects 0.000 claims description 44
- 239000000969 carrier Substances 0.000 claims description 5
- 230000000052 comparative effect Effects 0.000 description 25
- 238000000034 method Methods 0.000 description 21
- 238000005224 laser annealing Methods 0.000 description 12
- 230000003071 parasitic effect Effects 0.000 description 11
- 150000002500 ions Chemical class 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 238000005468 ion implantation Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910018125 Al-Si Inorganic materials 0.000 description 2
- 229910018520 Al—Si Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0821—Collector regions of bipolar transistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
- H01L29/0834—Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
Description
図1は本実施形態の電力用半導体装置であるIGBTチップの正面図である。そして、図2は図1のIGBTの平面図である。本実施形態のIGBTはn型で比抵抗が250〜300Ω/cmのシリコン基板16を備える。シリコン基板16の厚みは本実施形態のIGBTが耐圧特性を維持するために必要な厚み以上でなければならない。例えば、3300V用IGBTの場合シリコン基板の厚みは400μm程度である。図1でシリコン基板16の表面側には後述するMOS領域を含む能動領域12が形成される。能動領域12とはIGBTのキャリアの輸送が行われる領域である。
本実施形態はバッファ領域の活性化率の制御を行う事によりIGBTの特性を最適化できる電力用半導体装置とその製造方法に関する。本実施形態の構成については、図3で表される実施の形態1の構成との相違点のみ説明する。
28 耐圧維持領域
34 コレクタ不活性領域
38 コレクタ活性領域
92 エミッタ領域
96 ベース領域
Claims (1)
- 第一導電型のエミッタ領域と、
前記エミッタ領域と接する第二導電型のベース領域と、
前記ベース領域と接する第一導電型の耐圧維持領域と、
能動領域と電界緩和領域において前記耐圧維持領域の下に形成された第二導電型であるコレクタ領域と、
前記耐圧維持領域と前記コレクタ領域の中間に配置される、第一導電型であり、かつ前
記耐圧維持領域よりは第一導電型のキャリアのキャリア密度が高いバッファ領域と、
前記コレクタ領域と接して配置される電極であるコレクタ電極とを備え、
前記能動領域における前記バッファ領域には、前記電界緩和領域における前記バッファ領域よりも第一導電型のキャリア密度が低い領域が複数配置された事を特徴とする電力用半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007180931A JP5286706B2 (ja) | 2007-07-10 | 2007-07-10 | 電力用半導体装置とその製造方法 |
US11/937,725 US8742474B2 (en) | 2007-07-10 | 2007-11-09 | Power semiconductor device having an active region and an electric field reduction region |
KR1020080008409A KR100962524B1 (ko) | 2007-07-10 | 2008-01-28 | 전력용 반도체장치와 그 제조 방법 |
DE102008008152.3A DE102008008152B4 (de) | 2007-07-10 | 2008-02-08 | Leistungshalbleitervorrichtung |
CN200810074210XA CN101345255B (zh) | 2007-07-10 | 2008-02-13 | 功率用半导体装置及其制造方法 |
Applications Claiming Priority (1)
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JP2007180931A JP5286706B2 (ja) | 2007-07-10 | 2007-07-10 | 電力用半導体装置とその製造方法 |
Publications (2)
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JP2009021285A JP2009021285A (ja) | 2009-01-29 |
JP5286706B2 true JP5286706B2 (ja) | 2013-09-11 |
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JP2007180931A Active JP5286706B2 (ja) | 2007-07-10 | 2007-07-10 | 電力用半導体装置とその製造方法 |
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Country | Link |
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US (1) | US8742474B2 (ja) |
JP (1) | JP5286706B2 (ja) |
KR (1) | KR100962524B1 (ja) |
CN (1) | CN101345255B (ja) |
DE (1) | DE102008008152B4 (ja) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102007062305B3 (de) * | 2007-12-21 | 2009-05-28 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleiterbauelement mit grabenförmiger Feldringstruktur und Herstellungsverfahren hierzu |
CN102473723B (zh) * | 2009-07-15 | 2014-12-03 | 三菱电机株式会社 | 功率用半导体装置及其制造方法 |
JP2011204711A (ja) * | 2010-03-24 | 2011-10-13 | Toshiba Corp | 半導体装置およびその製造方法 |
CN102208436B (zh) * | 2010-03-31 | 2013-10-02 | 比亚迪股份有限公司 | 功率半导体器件的终端结构及功率半导体器件 |
JP5606240B2 (ja) * | 2010-09-22 | 2014-10-15 | 三菱電機株式会社 | 半導体装置 |
DE112011105411B4 (de) | 2011-07-05 | 2017-12-14 | Mitsubishi Electric Corp. | Halbleitervorrichtung |
CN103946984B (zh) * | 2011-11-22 | 2016-09-21 | 丰田自动车株式会社 | 半导体装置 |
JP5811829B2 (ja) * | 2011-12-22 | 2015-11-11 | 住友電気工業株式会社 | 半導体装置の製造方法 |
CN102543728A (zh) * | 2012-01-05 | 2012-07-04 | 深圳市鹏微科技有限公司 | 功率三极管芯片薄片制造方法 |
CN103681816A (zh) * | 2012-09-09 | 2014-03-26 | 苏州英能电子科技有限公司 | 一种具有浮置环结构的双极型晶体管 |
CN103681809B (zh) * | 2012-09-09 | 2016-08-17 | 苏州英能电子科技有限公司 | 具有复合结构的横向双极型晶体管 |
KR102045730B1 (ko) * | 2012-12-28 | 2019-12-03 | 엘지디스플레이 주식회사 | 인버터와 이를 이용한 구동회로 및 표시장치 |
CN104979283B (zh) * | 2014-04-03 | 2020-06-19 | 中国科学院微电子研究所 | Ti-igbt的制作方法 |
JP6624101B2 (ja) | 2017-02-03 | 2019-12-25 | 株式会社デンソー | 半導体装置 |
WO2019216085A1 (ja) * | 2018-05-10 | 2019-11-14 | 富士電機株式会社 | 半導体装置の製造方法 |
CN109671771B (zh) * | 2018-11-19 | 2022-04-01 | 全球能源互联网研究院有限公司 | Igbt芯片的背面结构、igbt芯片结构及制备方法 |
CN109860283A (zh) * | 2019-01-16 | 2019-06-07 | 全球能源互联网研究院有限公司 | 一种igbt、igbt背面的制作方法和装置 |
CN111682062A (zh) * | 2020-06-24 | 2020-09-18 | 全球能源互联网研究院有限公司 | 一种igbt器件的背面结构及其制备方法、igbt器件 |
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JPH0661495A (ja) * | 1992-08-07 | 1994-03-04 | Hitachi Ltd | 半導体装置及びその製法 |
JP3437863B2 (ja) * | 1993-01-18 | 2003-08-18 | 株式会社半導体エネルギー研究所 | Mis型半導体装置の作製方法 |
DE4313170A1 (de) | 1993-04-22 | 1994-10-27 | Abb Management Ag | Leistungshalbleiterbauelement |
JP3325752B2 (ja) | 1995-12-11 | 2002-09-17 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP3488772B2 (ja) * | 1996-01-16 | 2004-01-19 | 三菱電機株式会社 | 半導体装置 |
JP3372176B2 (ja) * | 1996-12-06 | 2003-01-27 | 株式会社東芝 | 半導体装置とその製造方法 |
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- 2007-07-10 JP JP2007180931A patent/JP5286706B2/ja active Active
- 2007-11-09 US US11/937,725 patent/US8742474B2/en active Active
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- 2008-01-28 KR KR1020080008409A patent/KR100962524B1/ko active IP Right Grant
- 2008-02-08 DE DE102008008152.3A patent/DE102008008152B4/de active Active
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CN101345255A (zh) | 2009-01-14 |
JP2009021285A (ja) | 2009-01-29 |
DE102008008152A1 (de) | 2009-01-15 |
US20090014753A1 (en) | 2009-01-15 |
KR100962524B1 (ko) | 2010-06-14 |
DE102008008152B4 (de) | 2014-11-20 |
CN101345255B (zh) | 2010-08-11 |
US8742474B2 (en) | 2014-06-03 |
KR20090005947A (ko) | 2009-01-14 |
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