JP5280032B2 - 配線基板 - Google Patents

配線基板 Download PDF

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Publication number
JP5280032B2
JP5280032B2 JP2007250806A JP2007250806A JP5280032B2 JP 5280032 B2 JP5280032 B2 JP 5280032B2 JP 2007250806 A JP2007250806 A JP 2007250806A JP 2007250806 A JP2007250806 A JP 2007250806A JP 5280032 B2 JP5280032 B2 JP 5280032B2
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Japan
Prior art keywords
wiring
wiring board
layer
wiring member
insulating layer
Prior art date
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JP2007250806A
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English (en)
Japanese (ja)
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JP2009081357A (ja
JP2009081357A5 (OSRAM
Inventor
章夫 堀内
泰志 横田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007250806A priority Critical patent/JP5280032B2/ja
Publication of JP2009081357A publication Critical patent/JP2009081357A/ja
Publication of JP2009081357A5 publication Critical patent/JP2009081357A5/ja
Application granted granted Critical
Publication of JP5280032B2 publication Critical patent/JP5280032B2/ja
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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2007250806A 2007-09-27 2007-09-27 配線基板 Active JP5280032B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007250806A JP5280032B2 (ja) 2007-09-27 2007-09-27 配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007250806A JP5280032B2 (ja) 2007-09-27 2007-09-27 配線基板

Publications (3)

Publication Number Publication Date
JP2009081357A JP2009081357A (ja) 2009-04-16
JP2009081357A5 JP2009081357A5 (OSRAM) 2010-05-13
JP5280032B2 true JP5280032B2 (ja) 2013-09-04

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ID=40655868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007250806A Active JP5280032B2 (ja) 2007-09-27 2007-09-27 配線基板

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JP (1) JP5280032B2 (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5289996B2 (ja) 2009-02-16 2013-09-11 日本特殊陶業株式会社 補強材付き配線基板
KR101044177B1 (ko) 2009-10-09 2011-06-24 삼성전기주식회사 기판 제조용 캐리어 부재 및 이를 이용한 기판의 제조방법
JP2011138868A (ja) 2009-12-28 2011-07-14 Ngk Spark Plug Co Ltd 多層配線基板
TWI400025B (zh) * 2009-12-29 2013-06-21 Subtron Technology Co Ltd 線路基板及其製作方法
CN102194703A (zh) * 2010-03-16 2011-09-21 旭德科技股份有限公司 线路基板及其制作方法
TWI571994B (zh) * 2015-06-30 2017-02-21 旭德科技股份有限公司 封裝基板及其製作方法
JP7173728B2 (ja) * 2017-10-26 2022-11-16 日東電工株式会社 撮像素子実装基板
KR102456322B1 (ko) * 2017-11-08 2022-10-19 삼성전기주식회사 기판 스트립 및 이를 포함하는 전자소자 패키지
CN114375097B (zh) * 2021-12-24 2023-08-22 江苏普诺威电子股份有限公司 传感器用封装基板的加工工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1050877A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージ
JP2924840B2 (ja) * 1997-02-13 1999-07-26 日本電気株式会社 Ｔａｐｅ−ＢＧＡタイプの半導体装置
JP3081168B2 (ja) * 1997-04-30 2000-08-28 イビデン株式会社 電子部品搭載用基板
JPH11345890A (ja) * 1998-06-03 1999-12-14 Fujitsu Ltd 半導体装置
JP4434163B2 (ja) * 2000-06-30 2010-03-17 日本電気株式会社 半導体パッケージ基板の製造方法及び半導体装置の製造方法
JP4553466B2 (ja) * 2000-09-05 2010-09-29 パナソニック株式会社 プリント回路基板

Also Published As

Publication number Publication date
JP2009081357A (ja) 2009-04-16

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