JP5208922B2 - デバイス、及び、電気伝導性接続部の製造方法 - Google Patents

デバイス、及び、電気伝導性接続部の製造方法 Download PDF

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JP5208922B2
JP5208922B2 JP2009510280A JP2009510280A JP5208922B2 JP 5208922 B2 JP5208922 B2 JP 5208922B2 JP 2009510280 A JP2009510280 A JP 2009510280A JP 2009510280 A JP2009510280 A JP 2009510280A JP 5208922 B2 JP5208922 B2 JP 5208922B2
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conductor surface
connection layer
manufacturing
conductor
layer
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JP2009537970A5 (enExample
JP2009537970A (ja
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プロースル、アンドレアス
イレク、シュテファン
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates

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  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
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DE102006028692A1 (de) 2007-11-22
KR20090027639A (ko) 2009-03-17
US20090302429A1 (en) 2009-12-10
US8102060B2 (en) 2012-01-24
KR101367545B1 (ko) 2014-02-26
JP2009537970A (ja) 2009-10-29
DE102006028692B4 (de) 2021-09-02
EP2018664A1 (de) 2009-01-28

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