JP2009537970A5 - - Google Patents

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Publication number
JP2009537970A5
JP2009537970A5 JP2009510280A JP2009510280A JP2009537970A5 JP 2009537970 A5 JP2009537970 A5 JP 2009537970A5 JP 2009510280 A JP2009510280 A JP 2009510280A JP 2009510280 A JP2009510280 A JP 2009510280A JP 2009537970 A5 JP2009537970 A5 JP 2009537970A5
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JP
Japan
Prior art keywords
manufacturing
connection layer
roughness
topographic
adhesive
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JP2009510280A
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English (en)
Japanese (ja)
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JP2009537970A (ja
JP5208922B2 (ja
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Priority claimed from DE102006028692.8A external-priority patent/DE102006028692B4/de
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Publication of JP2009537970A publication Critical patent/JP2009537970A/ja
Publication of JP2009537970A5 publication Critical patent/JP2009537970A5/ja
Application granted granted Critical
Publication of JP5208922B2 publication Critical patent/JP5208922B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009510280A 2006-05-19 2007-05-16 デバイス、及び、電気伝導性接続部の製造方法 Expired - Fee Related JP5208922B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102006023683 2006-05-19
DE102006023683.1 2006-05-19
DE102006028692.8A DE102006028692B4 (de) 2006-05-19 2006-06-22 Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium
DE102006028692.8 2006-06-22
PCT/DE2007/000897 WO2007134581A1 (de) 2006-05-19 2007-05-16 Elektrisch leitende verbindung mit isolierendem verbindungsmedium

Publications (3)

Publication Number Publication Date
JP2009537970A JP2009537970A (ja) 2009-10-29
JP2009537970A5 true JP2009537970A5 (enExample) 2011-07-07
JP5208922B2 JP5208922B2 (ja) 2013-06-12

Family

ID=38488603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009510280A Expired - Fee Related JP5208922B2 (ja) 2006-05-19 2007-05-16 デバイス、及び、電気伝導性接続部の製造方法

Country Status (7)

Country Link
US (1) US8102060B2 (enExample)
EP (1) EP2018664A1 (enExample)
JP (1) JP5208922B2 (enExample)
KR (1) KR101367545B1 (enExample)
DE (1) DE102006028692B4 (enExample)
TW (1) TWI357639B (enExample)
WO (1) WO2007134581A1 (enExample)

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US10522714B2 (en) 2011-06-15 2019-12-31 Sensor Electronic Technology, Inc. Device with inverted large scale light extraction structures
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US10319881B2 (en) 2011-06-15 2019-06-11 Sensor Electronic Technology, Inc. Device including transparent layer with profiled surface for improved extraction
US9741899B2 (en) 2011-06-15 2017-08-22 Sensor Electronic Technology, Inc. Device with inverted large scale light extraction structures
US9337387B2 (en) 2011-06-15 2016-05-10 Sensor Electronic Technology, Inc. Emitting device with improved extraction
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JPWO2013179766A1 (ja) 2012-05-30 2016-01-18 オリンパス株式会社 撮像装置、半導体装置および撮像ユニット
DE102012112988A1 (de) 2012-12-21 2014-07-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Scheinwerfer
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KR20220065292A (ko) 2020-11-13 2022-05-20 삼성전자주식회사 반도체 패키지 및 그의 제조 방법

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