TWI357639B - Electrically conductive connection with isolation - Google Patents

Electrically conductive connection with isolation Download PDF

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Publication number
TWI357639B
TWI357639B TW096117569A TW96117569A TWI357639B TW I357639 B TWI357639 B TW I357639B TW 096117569 A TW096117569 A TW 096117569A TW 96117569 A TW96117569 A TW 96117569A TW I357639 B TWI357639 B TW I357639B
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TW
Taiwan
Prior art keywords
electrically insulating
layer
connecting layer
adhesive
roughness
Prior art date
Application number
TW096117569A
Other languages
English (en)
Chinese (zh)
Other versions
TW200807646A (en
Inventor
Stefan Illek
Andreas Ploessl
Original Assignee
Osram Opto Semiconductors Gmbh
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Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of TW200807646A publication Critical patent/TW200807646A/zh
Application granted granted Critical
Publication of TWI357639B publication Critical patent/TWI357639B/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
TW096117569A 2006-05-19 2007-05-17 Electrically conductive connection with isolation TWI357639B (en)

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DE102006028692.8A DE102006028692B4 (de) 2006-05-19 2006-06-22 Elektrisch leitende Verbindung mit isolierendem Verbindungsmedium

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KR (1) KR101367545B1 (enExample)
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WO2007134581A1 (de) 2007-11-29
TW200807646A (en) 2008-02-01
DE102006028692A1 (de) 2007-11-22
KR20090027639A (ko) 2009-03-17
US20090302429A1 (en) 2009-12-10
US8102060B2 (en) 2012-01-24
KR101367545B1 (ko) 2014-02-26
JP2009537970A (ja) 2009-10-29
JP5208922B2 (ja) 2013-06-12
DE102006028692B4 (de) 2021-09-02
EP2018664A1 (de) 2009-01-28

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