JP2009537970A - 絶縁性接続媒体を用いた電気伝導性接続部 - Google Patents
絶縁性接続媒体を用いた電気伝導性接続部 Download PDFInfo
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- JP2009537970A JP2009537970A JP2009510280A JP2009510280A JP2009537970A JP 2009537970 A JP2009537970 A JP 2009537970A JP 2009510280 A JP2009510280 A JP 2009510280A JP 2009510280 A JP2009510280 A JP 2009510280A JP 2009537970 A JP2009537970 A JP 2009537970A
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Abstract
【選択図】図2
Description
前記第1表面及び前記第2表面の少なくとも1つは、地形学的な(topographic)表面構造を有し、
前記第1部品(5)の前記第1表面(6)は、電気絶縁性接続層(7)を介して、前記第2部品(8)の前記第2表面(9)に接続され、
前記第1部品(5)の前記第1表面(6)と前記第2部品(8)の前記第2表面(9)との間に、前記地形学的な表面構造を介して、電気伝導性コンタクトがある。
−反射層は、放射線生成エピタキシャル連続層の、キャリアに面する第1主要領域に設けられ又は形成され、前記反射層は、エピタキシャル連続層で生成される電磁放射線の少なくとも一部を反射して後者の中に戻す。
−エピタキシャル連続層は、領域内でほぼ20μm又はそれ以下、特にほぼ10μmの厚さを有する。
−エピタキシャル連続層は、エピタキシャル連続層において理想的に放射の近似エルゴード分布(an approximately ergodic distribution)へ導く混合構造を有する少なくとも1つの領域を有する少なくとも1つの半導体層を含む。すなわち、それは、可能な限りエルゴード的確率散乱挙動(ergodically stochastic scattering behavior)を有する。
前記第1表面及び/又は前記第2表面へ電気絶縁性接続層を設ける工程と、
互いに関して前記第1表面と前記第2表面とを位置決めする工程と、及び、
前記第1表面と前記第2表面との間に前記地形学的な表面構造を介して電気的伝導性コンタクトが生じるまで、前記第1部品及び/又は前記第2部品へ力を加える工程と、
を含む。
Claims (36)
- 第1表面(6)を有する第1部品(5)と、第2表面(9)を有する第2部品(8)と、を備えるデバイスにおいて、
前記第1表面及び前記第2表面の少なくとも1つが、地形学的な表面構造を有し、
前記第1部品(5)の前記第1表面(6)は、電気絶縁性接続層(7)を介して前記第2部品(8)の前記第2表面(9)に接続され、そして、
前記第1表面(6)と前記第2表面(9)との間に、前記地形学的な表面構造を介して電気伝導性コンタクトがある、
ことを特徴とするデバイス。 - 前記第1表面及び前記第2表面の両方が、地形学的な表面構造を有する、
ことを特徴とする請求項1に記載のデバイス。 - 前記地形学的な表面構造は、前記第1表面及び/又は前記第2表面の粗さにより生じる、
ことを特徴とする請求項1又は2に記載のデバイス。 - 前記第1部品(5)及び/又は前記第2部品(8)は、基板、ウェハ、ガラスキャリア、ヒートシンク、エピタキシャル連続層、及び光電子半導体チップからなるグループから選ばれる、
ことを特徴とする請求項1乃至3のうちいずれか一項に記載のデバイス。 - 前記第1部品(5)の前記第1表面(6)及び/又は前記第2部品(8)の前記第2表面(9)は、窪み(40)を有する、
ことを特徴とする請求項1乃至4のうちいずれか一項に記載のデバイス。 - 前記第1表面(6)及び前記第2表面(9)は、接合領域(41)を有し、
前記接合領域(41)には、前記接続層(7)が取り付けられ、
前記第1表面(6)及び/又は前記第2表面(9)の前記窪み(40)は、前記接合領域(41)の周囲に配置される、
ことを特徴とする請求項5に記載のデバイス。 - 前記窪み(40)は、前記接続層の接着剤のための収集貯液部として機能する、
ことを特徴とする請求項5又は6に記載のデバイス。 - 複数の前記窪み(40)は、それらが、規則的に離れて間隔を空けるように配置される、
ことを特徴とする請求項5乃至7のうちいずれか一項に記載のデバイス。 - 複数の前記窪み(40)は、それらが、不規則に離れて間隔を空けるように配置される、
ことを特徴とする請求項5乃至7のうちいずれか一項に記載のデバイス。 - 前記接続層(7)の平均厚さ(28)は、概ね前記第1表面(6)の粗さ及び/又は前記第2表面(9)の粗さの大きさである、
ことを特徴とする請求項1乃至9のうちいずれか一項に記載のデバイス。 - 前記第1表面(6)の粗さ及び/又は前記第2表面(9)の粗さは、少なくとも数ナノメートル(nm)である、
ことを特徴とする請求項3又は10に記載のデバイス。 - 前記第1表面(6)及び前記第2表面(9)は、それらが少なくとも部分的に電気伝導性であるように形成される、
ことを特徴とする請求項1乃至11のうちいずれか一項に記載のデバイス。 - 前記第1表面(6)及び/又は前記第2表面(9)は、少なくとも部分的に金属製に形成される、
ことを特徴とする請求項9に記載のデバイス。 - 前記接続層は、電気絶縁性接着剤を含む、
ことを特徴とする請求項1乃至13のうちいずれか一項に記載のデバイス。 - 前記接着剤は、耐溶解性、適切な真空度、温度安定性があり、且つ/又はUV硬化可能である、
ことを特徴とする請求項14に記載のデバイス。 - 前記接着剤は、BCB(BisbenzoCycloButene)を含む、
ことを特徴とする請求項14又は15に記載のデバイス。 - 第1表面(6)を有する第1部品(5)と第2表面(9)を有する第2部品(8)との間に電気伝導性接続部を製造する方法であって、
前記第1表面及び前記第2表面の少なくとも1つが、地形学的な表面構造を有し、
前記第1表面及び/又は前記第2表面へ電気絶縁性接続層(7)を設ける工程と、
互いに関して前記第1表面(6)と前記第2表面(9)とを位置決めする工程と、
前記第1表面と前記第2表面との間に前記地形学的な表面構造を介して電気的伝導性コンタクトが生じるまで、前記第1部品(5)及び/又は前記第2部品(8)へ力(10)を加える工程と、
を含む、
ことを特徴とする電気伝導性接続部の製造方法。 - 前記第1表面(6)及び前記第2表面(9)は、地形学的な表面構造を有する、
ことを特徴とする請求項17に記載の製造方法。 - 前記地形学的な表面構造は、前記接続層が設けられるよりも前に形成される、
ことを特徴とする請求項17又は18に記載の製造方法。 - 前記地形学的な表面構造は、エッチング、研削、フォトリソグラフィパターニング、及び/又はサンドブラストにより形成される、
ことを特徴とする請求項19に記載の製造方法。 - 前記第1部品(5)及び/又は前記第2部品(8)は、基板、ウェハ、ガラスキャリア、ヒートシンク、エピタキシャル連続層、及び光電子半導体チップからなるグループから選ばれて使用される、
ことを特徴とする請求項17乃至20のうちいずれか一項に記載の製造方法。 - 前記第1部品(5)の前記第1表面(6)及び/又は前記第2部品(8)の前記第2表面(9)は、窪み(40)を有して、前記電気絶縁性接続層が設けられるよりも前に用意される、
ことを特徴とする請求項17乃至21のうちいずれか一項に記載の製造方法。 - 前記第1表面(6)及び前記第2表面(9)は、接合領域(41)を有し、
前記接合領域(41)には、前記接続層(7)が取り付けられ、
前記第1表面(6)及び/又は前記第2表面(9)の前記窪み(40)は、前記接合領域(41)の周囲に配置される、
ことを特徴とする請求項17乃至22のうちいずれか一項に記載の製造方法。 - 前記窪み(40)は、前記接続層の接着剤のための収集貯液部として機能する、
ことを特徴とする請求項22又は23に記載の製造方法。 - 複数の前記窪み(40)は、それらが、規則的に離れて間隔を空けるように配置される、
ことを特徴とする請求項22乃至24のうちいずれか一項に記載の製造方法。 - 複数の前記窪み(40)は、それらが、不規則に離れて間隔を空けるように配置される、
ことを特徴とする請求項22乃至24のうちいずれか一項に記載の製造方法。 - 前記窪み(40)は、エッチング、研削、エンボス加工、フォトリソグラフィパターニング、及び/又はサンドブラストにより形成される、
ことを特徴とする請求項22乃至26のうちいずれか一項に記載の製造方法。 - 前記接続層(7)は、パターニングされて形成される、
ことを特徴とする請求項17に記載の製造方法。 - 前記パターニングされた接続層の形成は、印刷法により行われる、
ことを特徴とする請求項28に記載の製造方法。 - 前記接続層(7)は、パターニングされずに設けられる、
ことを特徴とする請求項17に記載の製造方法。 - 前記パターニングされない接続層の形成は、スピンコーティング、又は気相成長により行われる、
ことを特徴とする請求項30に記載の製造方法。 - 設置後の前記接続層(7)の厚さ(28)は、100nm〜10μmの厚さを有する、
ことを特徴とする請求項17に記載の製造方法。 - 前記接続層(7)の厚さ(28)は、概ね前記第1表面(6)の粗さ及び/又は前記第2表面(9)の粗さの大きさであるように加えられる力(10)により、設置後、減少する、
ことを特徴とする請求項32に記載の製造方法。 - 接着剤を含む電気絶縁性接続層が使用される、
ことを特徴とする請求項17乃至33のうちいずれか一項に記載の製造方法。 - 耐溶解性、適切な真空度、温度安定性があり、且つ/又はUV硬化可能である接着剤が使用される、
ことを特徴とする請求項34に記載の製造方法。 - BCB(BisbenzoCycloButene)を含む接着剤が使用される、
ことを特徴とする請求項34又は35に記載の製造方法。
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DE102006028692.8 | 2006-06-22 | ||
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JP (1) | JP5208922B2 (ja) |
KR (1) | KR101367545B1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
DE102006028692B4 (de) | 2021-09-02 |
US8102060B2 (en) | 2012-01-24 |
KR101367545B1 (ko) | 2014-02-26 |
KR20090027639A (ko) | 2009-03-17 |
TW200807646A (en) | 2008-02-01 |
US20090302429A1 (en) | 2009-12-10 |
TWI357639B (en) | 2012-02-01 |
EP2018664A1 (de) | 2009-01-28 |
DE102006028692A1 (de) | 2007-11-22 |
WO2007134581A1 (de) | 2007-11-29 |
JP5208922B2 (ja) | 2013-06-12 |
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