JP5158092B2 - 弾性波装置 - Google Patents
弾性波装置 Download PDFInfo
- Publication number
- JP5158092B2 JP5158092B2 JP2009543728A JP2009543728A JP5158092B2 JP 5158092 B2 JP5158092 B2 JP 5158092B2 JP 2009543728 A JP2009543728 A JP 2009543728A JP 2009543728 A JP2009543728 A JP 2009543728A JP 5158092 B2 JP5158092 B2 JP 5158092B2
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- Prior art keywords
- protective film
- acoustic wave
- film
- wave device
- silicon
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02984—Protection measures against damaging
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02937—Means for compensation or elimination of undesirable effects of chemical damage, e.g. corrosion
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1078—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05568—Disposition the whole external layer protruding from the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H2009/0019—Surface acoustic wave multichip
Description
10a 電子部品
11 弾性波装置
12 基板
12a 下面
12b 側面
15 保護膜
18 保護膜
20,21 IDT電極
30 弾性波装置
34 保護膜
Claims (3)
- 基板にIDT電極が形成された弾性波素子と、
前記弾性波素子を覆うように形成される保護膜と、
を備え、
前記弾性波素子は、前記IDT電極を含む前記基板上に形成されたSiO 2 膜をさらに備え、
前記保護膜が前記SiO 2 膜の上から形成されており、
前記保護膜に、前記IDT電極により励起される弾性波のエネルギーが分布しており、
前記保護膜は、珪素と窒素を主成分とする窒化シリコン膜であり、前記保護膜の音速の変化が抑制されるように、前記珪素と前記窒素との組成比を1:Xで表すとき、前記Xが1.15以下であることを特徴とする、弾性波装置。 - 前記弾性波素子を複数搭載する共通基板をさらに備え、
前記保護膜が、前記共通基板上に搭載された複数の前記弾性波素子を覆うように形成されていることを特徴とする、請求項1に記載の弾性波装置。 - 前記Xが1.00を超えることを特徴とする、請求項1又は2に記載の弾性波装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009543728A JP5158092B2 (ja) | 2007-11-28 | 2008-10-28 | 弾性波装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007307650 | 2007-11-28 | ||
JP2007307650 | 2007-11-28 | ||
PCT/JP2008/069567 WO2009069421A1 (ja) | 2007-11-28 | 2008-10-28 | 弾性波装置 |
JP2009543728A JP5158092B2 (ja) | 2007-11-28 | 2008-10-28 | 弾性波装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012221700A Division JP5408512B2 (ja) | 2007-11-28 | 2012-10-03 | 弾性波装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2009069421A1 JPWO2009069421A1 (ja) | 2011-04-07 |
JP5158092B2 true JP5158092B2 (ja) | 2013-03-06 |
Family
ID=40678324
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009543728A Active JP5158092B2 (ja) | 2007-11-28 | 2008-10-28 | 弾性波装置 |
JP2012221700A Active JP5408512B2 (ja) | 2007-11-28 | 2012-10-03 | 弾性波装置 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012221700A Active JP5408512B2 (ja) | 2007-11-28 | 2012-10-03 | 弾性波装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8120230B2 (ja) |
JP (2) | JP5158092B2 (ja) |
CN (1) | CN101868915B (ja) |
DE (1) | DE112008003117B4 (ja) |
WO (1) | WO2009069421A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9142804B2 (en) * | 2010-02-09 | 2015-09-22 | Samsung Display Co., Ltd. | Organic light-emitting device including barrier layer and method of manufacturing the same |
JP5501792B2 (ja) * | 2010-02-22 | 2014-05-28 | 京セラ株式会社 | 弾性波装置及びその製造方法 |
US8638318B2 (en) * | 2010-05-28 | 2014-01-28 | Elo Touch Solutions, Inc. | Multi-layer coversheet for saw touch panel |
US9293684B2 (en) * | 2011-07-29 | 2016-03-22 | Kyocera Corporation | Electronic part comprising acoustic wave device |
US9680445B2 (en) * | 2014-10-31 | 2017-06-13 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Packaged device including cavity package with elastic layer within molding compound |
JP2019145886A (ja) * | 2018-02-16 | 2019-08-29 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
JP2019145895A (ja) * | 2018-02-16 | 2019-08-29 | 株式会社村田製作所 | 弾性波装置、マルチプレクサ、高周波フロントエンド回路及び通信装置 |
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JP2001044787A (ja) * | 1999-07-30 | 2001-02-16 | Kyocera Corp | 弾性表面波装置 |
JP2002016475A (ja) * | 2000-06-27 | 2002-01-18 | Murata Mfg Co Ltd | 弾性表面波装置及びその製造方法 |
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-
2008
- 2008-10-28 DE DE112008003117.7T patent/DE112008003117B4/de active Active
- 2008-10-28 JP JP2009543728A patent/JP5158092B2/ja active Active
- 2008-10-28 WO PCT/JP2008/069567 patent/WO2009069421A1/ja active Application Filing
- 2008-10-28 CN CN2008801172474A patent/CN101868915B/zh active Active
-
2010
- 2010-05-21 US US12/784,564 patent/US8120230B2/en active Active
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2012
- 2012-10-03 JP JP2012221700A patent/JP5408512B2/ja active Active
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JPH07254835A (ja) * | 1994-03-15 | 1995-10-03 | Murata Mfg Co Ltd | 弾性表面波共振子フィルタ |
JPH1131759A (ja) * | 1997-07-14 | 1999-02-02 | Sony Corp | 吸湿保護膜を有する実装回路基板及び実装回路基板の吸湿保護膜形成方法 |
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Also Published As
Publication number | Publication date |
---|---|
US20100219717A1 (en) | 2010-09-02 |
DE112008003117T5 (de) | 2010-09-30 |
WO2009069421A1 (ja) | 2009-06-04 |
CN101868915A (zh) | 2010-10-20 |
JP5408512B2 (ja) | 2014-02-05 |
JP2013034230A (ja) | 2013-02-14 |
DE112008003117B4 (de) | 2015-11-12 |
JPWO2009069421A1 (ja) | 2011-04-07 |
US8120230B2 (en) | 2012-02-21 |
CN101868915B (zh) | 2013-11-06 |
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