JP5089212B2 - 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法 - Google Patents

発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法 Download PDF

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JP5089212B2
JP5089212B2 JP2007077313A JP2007077313A JP5089212B2 JP 5089212 B2 JP5089212 B2 JP 5089212B2 JP 2007077313 A JP2007077313 A JP 2007077313A JP 2007077313 A JP2007077313 A JP 2007077313A JP 5089212 B2 JP5089212 B2 JP 5089212B2
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Prior art keywords
light emitting
emitting device
light
sealing body
body layer
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Japanese (ja)
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JP2008235824A (ja
JP2008235824A5 (OSRAM
Inventor
俊雄 幡
正宏 小西
誠 英賀谷
泰司 森本
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Sharp Corp
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Sharp Corp
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Priority to JP2007077313A priority Critical patent/JP5089212B2/ja
Priority to US12/051,602 priority patent/US7872418B2/en
Priority to CN2008101314744A priority patent/CN101312185B/zh
Priority to CN2012100074754A priority patent/CN102569280A/zh
Publication of JP2008235824A publication Critical patent/JP2008235824A/ja
Publication of JP2008235824A5 publication Critical patent/JP2008235824A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/10—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances sulfides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
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    • H10H20/851—Wavelength conversion means

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JP2007077313A 2007-03-23 2007-03-23 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法 Active JP5089212B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007077313A JP5089212B2 (ja) 2007-03-23 2007-03-23 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法
US12/051,602 US7872418B2 (en) 2007-03-23 2008-03-19 Light emitting device and method for manufacturing the same
CN2008101314744A CN101312185B (zh) 2007-03-23 2008-03-21 发光装置及其制造方法
CN2012100074754A CN102569280A (zh) 2007-03-23 2008-03-21 发光装置及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007077313A JP5089212B2 (ja) 2007-03-23 2007-03-23 発光装置およびそれを用いたｌｅｄランプ、発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2008235824A JP2008235824A (ja) 2008-10-02
JP2008235824A5 JP2008235824A5 (OSRAM) 2010-05-06
JP5089212B2 true JP5089212B2 (ja) 2012-12-05

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US (1) US7872418B2 (OSRAM)
JP (1) JP5089212B2 (OSRAM)
CN (2) CN101312185B (OSRAM)

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JP5158472B2 (ja) * 2007-05-24 2013-03-06 スタンレー電気株式会社 半導体発光装置
TW201022576A (en) * 2008-12-11 2010-06-16 Advanced Connectek Inc Light emitting diode lamp source module
DE102009008738A1 (de) * 2009-02-12 2010-08-19 Osram Opto Semiconductors Gmbh Halbleiteranordnung und Verfahren zum Herstellen einer Halbleiteranordnung
JP5680278B2 (ja) * 2009-02-13 2015-03-04 シャープ株式会社 発光装置
JP5330889B2 (ja) * 2009-04-14 2013-10-30 電気化学工業株式会社 照明用ｌｅｄモジュール
US8337030B2 (en) * 2009-05-13 2012-12-25 Cree, Inc. Solid state lighting devices having remote luminescent material-containing element, and lighting methods
US8922106B2 (en) * 2009-06-02 2014-12-30 Bridgelux, Inc. Light source with optics to produce a spherical emission pattern
JP2011009298A (ja) 2009-06-23 2011-01-13 Citizen Electronics Co Ltd 発光ダイオード光源装置
JP5354191B2 (ja) * 2009-06-30 2013-11-27 東芝ライテック株式会社 電球形ランプおよび照明器具
JP5379615B2 (ja) * 2009-09-09 2013-12-25 パナソニック株式会社 照明装置
JP5623062B2 (ja) 2009-11-13 2014-11-12 シャープ株式会社 発光装置およびその製造方法
KR20110086648A (ko) 2010-01-15 2011-07-29 엘지이노텍 주식회사 발광 모듈, 백라이트 유닛 및 표시 장치
JP2011151268A (ja) 2010-01-22 2011-08-04 Sharp Corp 発光装置
JP2011204897A (ja) * 2010-03-25 2011-10-13 Toshiba Lighting & Technology Corp 発光モジュール
KR101192181B1 (ko) * 2010-03-31 2012-10-17 (주)포인트엔지니어링 광 소자 디바이스 및 그 제조 방법
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