JP4902558B2 - 半導体モジュールの製造方法 - Google Patents

半導体モジュールの製造方法 Download PDF

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Publication number
JP4902558B2
JP4902558B2 JP2008012240A JP2008012240A JP4902558B2 JP 4902558 B2 JP4902558 B2 JP 4902558B2 JP 2008012240 A JP2008012240 A JP 2008012240A JP 2008012240 A JP2008012240 A JP 2008012240A JP 4902558 B2 JP4902558 B2 JP 4902558B2
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Japan
Prior art keywords
protrusion
metal plate
semiconductor
copper plate
main surface
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Expired - Fee Related
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JP2008012240A
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English (en)
Japanese (ja)
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JP2008211189A5 (enExample
JP2008211189A (ja
Inventor
芳央 岡山
康行 柳瀬
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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Priority to JP2008012240A priority Critical patent/JP4902558B2/ja
Priority to US12/022,812 priority patent/US7989359B2/en
Priority to CN2008101277478A priority patent/CN101303990B/zh
Publication of JP2008211189A publication Critical patent/JP2008211189A/ja
Publication of JP2008211189A5 publication Critical patent/JP2008211189A5/ja
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Publication of JP4902558B2 publication Critical patent/JP4902558B2/ja
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2008012240A 2007-01-31 2008-01-23 半導体モジュールの製造方法 Expired - Fee Related JP4902558B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008012240A JP4902558B2 (ja) 2007-01-31 2008-01-23 半導体モジュールの製造方法
US12/022,812 US7989359B2 (en) 2007-01-31 2008-01-30 Semiconductor module manufacturing method, semiconductor module, and mobile device
CN2008101277478A CN101303990B (zh) 2007-01-31 2008-01-31 半导体模块的制造方法、半导体模块及便携设备

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JP2007020657 2007-01-31
JP2007020657 2007-01-31
JP2008012240A JP4902558B2 (ja) 2007-01-31 2008-01-23 半導体モジュールの製造方法

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JP2008211189A JP2008211189A (ja) 2008-09-11
JP2008211189A5 JP2008211189A5 (enExample) 2011-03-03
JP4902558B2 true JP4902558B2 (ja) 2012-03-21

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