CN101303990B - 半导体模块的制造方法、半导体模块及便携设备 - Google Patents

半导体模块的制造方法、半导体模块及便携设备 Download PDF

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Publication number
CN101303990B
CN101303990B CN2008101277478A CN200810127747A CN101303990B CN 101303990 B CN101303990 B CN 101303990B CN 2008101277478 A CN2008101277478 A CN 2008101277478A CN 200810127747 A CN200810127747 A CN 200810127747A CN 101303990 B CN101303990 B CN 101303990B
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semiconductor
copper plate
semiconductor module
metallic plate
electrode
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CN2008101277478A
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Chinese (zh)
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CN101303990A (zh
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冈山芳央
柳瀬康行
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Sanyo Electric Co Ltd
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Sanyo Electric Co Ltd
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CN2008101277478A 2007-01-31 2008-01-31 半导体模块的制造方法、半导体模块及便携设备 Expired - Fee Related CN101303990B (zh)

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JP020657/07 2007-01-31
JP2007020657 2007-01-31
JP012240/08 2008-01-23
JP2008012240A JP4902558B2 (ja) 2007-01-31 2008-01-23 半導体モジュールの製造方法

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CN101303990A CN101303990A (zh) 2008-11-12
CN101303990B true CN101303990B (zh) 2011-08-24

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KR100823699B1 (ko) * 2006-11-29 2008-04-21 삼성전자주식회사 플립칩 어셈블리 및 그 제조 방법
JP2008211125A (ja) * 2007-02-28 2008-09-11 Spansion Llc 半導体装置およびその製造方法
JP4760930B2 (ja) * 2009-02-27 2011-08-31 株式会社デンソー Ｉｃ搭載基板、多層プリント配線板、及び製造方法
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