JP2008211189A5 - - Google Patents

Download PDF

Info

Publication number
JP2008211189A5
JP2008211189A5 JP2008012240A JP2008012240A JP2008211189A5 JP 2008211189 A5 JP2008211189 A5 JP 2008211189A5 JP 2008012240 A JP2008012240 A JP 2008012240A JP 2008012240 A JP2008012240 A JP 2008012240A JP 2008211189 A5 JP2008211189 A5 JP 2008211189A5
Authority
JP
Japan
Prior art keywords
metal plate
main surface
protrusion
substrate
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008012240A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008211189A (ja
JP4902558B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008012240A priority Critical patent/JP4902558B2/ja
Priority claimed from JP2008012240A external-priority patent/JP4902558B2/ja
Priority to US12/022,812 priority patent/US7989359B2/en
Priority to CN2008101277478A priority patent/CN101303990B/zh
Publication of JP2008211189A publication Critical patent/JP2008211189A/ja
Publication of JP2008211189A5 publication Critical patent/JP2008211189A5/ja
Application granted granted Critical
Publication of JP4902558B2 publication Critical patent/JP4902558B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008012240A 2007-01-31 2008-01-23 半導体モジュールの製造方法 Expired - Fee Related JP4902558B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008012240A JP4902558B2 (ja) 2007-01-31 2008-01-23 半導体モジュールの製造方法
US12/022,812 US7989359B2 (en) 2007-01-31 2008-01-30 Semiconductor module manufacturing method, semiconductor module, and mobile device
CN2008101277478A CN101303990B (zh) 2007-01-31 2008-01-31 半导体模块的制造方法、半导体模块及便携设备

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007020657 2007-01-31
JP2007020657 2007-01-31
JP2008012240A JP4902558B2 (ja) 2007-01-31 2008-01-23 半導体モジュールの製造方法

Publications (3)

Publication Number Publication Date
JP2008211189A JP2008211189A (ja) 2008-09-11
JP2008211189A5 true JP2008211189A5 (enExample) 2011-03-03
JP4902558B2 JP4902558B2 (ja) 2012-03-21

Family

ID=39787193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008012240A Expired - Fee Related JP4902558B2 (ja) 2007-01-31 2008-01-23 半導体モジュールの製造方法

Country Status (3)

Country Link
US (1) US7989359B2 (enExample)
JP (1) JP4902558B2 (enExample)
CN (1) CN101303990B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100823699B1 (ko) * 2006-11-29 2008-04-21 삼성전자주식회사 플립칩 어셈블리 및 그 제조 방법
JP2008211125A (ja) * 2007-02-28 2008-09-11 Spansion Llc 半導体装置およびその製造方法
JP4760930B2 (ja) * 2009-02-27 2011-08-31 株式会社デンソー Ｉｃ搭載基板、多層プリント配線板、及び製造方法
JP2010262992A (ja) * 2009-04-30 2010-11-18 Sanyo Electric Co Ltd 半導体モジュールおよび携帯機器
TWI501376B (zh) * 2009-10-07 2015-09-21 精材科技股份有限公司 晶片封裝體及其製造方法
US9082832B2 (en) * 2011-09-21 2015-07-14 Stats Chippac, Ltd. Semiconductor device and method of forming protection and support structure for conductive interconnect structure
US9484259B2 (en) 2011-09-21 2016-11-01 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming protection and support structure for conductive interconnect structure
US8664039B2 (en) * 2011-10-18 2014-03-04 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for alignment in flip chip bonding
US9825209B2 (en) * 2012-12-21 2017-11-21 Panasonic Intellectual Property Management Co., Ltd. Electronic component package and method for manufacturing the same
JP7244339B2 (ja) * 2019-04-19 2023-03-22 株式会社三社電機製作所 半導体モジュール用外部端子
CN110164839B (zh) * 2019-05-27 2020-01-31 广东工业大学 一种高密度线路嵌入转移的扇出型封装结构与方法
JP7622571B2 (ja) * 2021-07-08 2025-01-28 住友電装株式会社 回路構成体、及び電気接続箱

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821627A (en) * 1993-03-11 1998-10-13 Kabushiki Kaisha Toshiba Electronic circuit device
JP3533284B2 (ja) 1996-04-24 2004-05-31 新光電気工業株式会社 半導体装置用基板及びその製造方法並びに半導体装置
AU6418998A (en) * 1997-03-21 1998-10-20 Seiko Epson Corporation Semiconductor device, film carrier tape, and method for manufacturing them
JP2000068641A (ja) 1998-08-20 2000-03-03 Mitsubishi Gas Chem Co Inc プリント配線板の製造方法
MY144503A (en) * 1998-09-14 2011-09-30 Ibiden Co Ltd Printed circuit board and method for its production
JP2001053195A (ja) * 1999-08-11 2001-02-23 Mitsui High Tec Inc 半導体装置の製造方法
JP2001223287A (ja) * 2000-02-07 2001-08-17 Mitsui High Tec Inc インターポーザーの製造方法
JP3767398B2 (ja) * 2001-03-19 2006-04-19 カシオ計算機株式会社 半導体装置およびその製造方法
JP2006310530A (ja) * 2005-04-28 2006-11-09 Sanyo Electric Co Ltd 回路装置およびその製造方法
JP4568215B2 (ja) 2005-11-30 2010-10-27 三洋電機株式会社 回路装置および回路装置の製造方法

Similar Documents

Publication Publication Date Title
JP2008211189A5 (enExample)
JP2008277742A5 (enExample)
JP2009194322A5 (enExample)
JP2014187166A5 (enExample)
RU2009138474A (ru) Сенсорная панель и способ ее производства
WO2009038033A1 (ja) エレクトロクロミック表示素子及びその製造方法
WO2007089723A3 (en) Thermal enhanced package
JP2009003434A5 (enExample)
JP5368715B2 (ja) 熱流センサ
JP2009267310A5 (enExample)
JP2010087221A5 (enExample)
JP2013219191A5 (enExample)
JP2003197988A5 (enExample)
JP2011513901A5 (enExample)
WO2011091959A8 (de) Verfahren zur lokalen hochdotierung und kontaktierung einer halbleiterstruktur, welche eine solarzelle oder eine vorstufe einer solarzelle ist
JP2017005117A5 (enExample)
WO2012049087A3 (en) Semiconductor module and method of manufacturing a semiconductor module
WO2008051369A3 (en) Low-cost electrostatic clamp with fast declamp time and the manufacture
JP2007288050A5 (enExample)
US20160377485A1 (en) Suspended type nanowire array and manufacturing method thereof
US8994164B2 (en) Semiconductor device and semiconductor device manufacturing method
US8770991B2 (en) Fuse connection unit
CN102956761A (zh) 发光二极管的封装方法
JP2009246174A5 (enExample)
CN104854965B (zh) 器件载体和器件载体装置