JP4834897B2 - 不揮発性半導体記憶装置およびその動作方法 - Google Patents
不揮発性半導体記憶装置およびその動作方法 Download PDFInfo
- Publication number
- JP4834897B2 JP4834897B2 JP2000180763A JP2000180763A JP4834897B2 JP 4834897 B2 JP4834897 B2 JP 4834897B2 JP 2000180763 A JP2000180763 A JP 2000180763A JP 2000180763 A JP2000180763 A JP 2000180763A JP 4834897 B2 JP4834897 B2 JP 4834897B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- insulating film
- gate
- memory device
- nonvolatile semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Read Only Memory (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000180763A JP4834897B2 (ja) | 2000-05-02 | 2000-06-12 | 不揮発性半導体記憶装置およびその動作方法 |
| US09/842,795 US6674120B2 (en) | 2000-05-02 | 2001-04-27 | Nonvolatile semiconductor memory device and method of operation thereof |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000138251 | 2000-05-02 | ||
| JP2000-138251 | 2000-05-02 | ||
| JP2000138251 | 2000-05-02 | ||
| JP2000180763A JP4834897B2 (ja) | 2000-05-02 | 2000-06-12 | 不揮発性半導体記憶装置およびその動作方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002026149A JP2002026149A (ja) | 2002-01-25 |
| JP2002026149A5 JP2002026149A5 (enExample) | 2007-02-01 |
| JP4834897B2 true JP4834897B2 (ja) | 2011-12-14 |
Family
ID=26591659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000180763A Expired - Lifetime JP4834897B2 (ja) | 2000-05-02 | 2000-06-12 | 不揮発性半導体記憶装置およびその動作方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6674120B2 (enExample) |
| JP (1) | JP4834897B2 (enExample) |
Families Citing this family (79)
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| JP2004095889A (ja) * | 2002-08-30 | 2004-03-25 | Fasl Japan Ltd | 半導体記憶装置及びその製造方法 |
| US6917078B2 (en) * | 2002-08-30 | 2005-07-12 | Micron Technology Inc. | One transistor SOI non-volatile random access memory cell |
| KR100523839B1 (ko) * | 2002-10-07 | 2005-10-27 | 한국전자통신연구원 | 건식 리소그라피 방법 및 이를 이용한 게이트 패턴 형성방법 |
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| US7394703B2 (en) * | 2002-10-15 | 2008-07-01 | Halo Lsi, Inc. | Twin insulator charge storage device operation and its fabrication method |
| KR100848248B1 (ko) | 2002-12-28 | 2008-07-24 | 동부일렉트로닉스 주식회사 | 플래시 메모리 소자 및 그 제조 방법 |
| US6806535B2 (en) * | 2003-01-22 | 2004-10-19 | Macronix International Co., Ltd. | Non-volatile memory and fabricating method thereof |
| US6794764B1 (en) * | 2003-03-05 | 2004-09-21 | Advanced Micro Devices, Inc. | Charge-trapping memory arrays resistant to damage from contact hole information |
| CA2820537C (en) | 2003-04-23 | 2015-10-20 | Valeritas, Inc. | Hydraulically actuated pump for fluid administration |
| US8125003B2 (en) * | 2003-07-02 | 2012-02-28 | Micron Technology, Inc. | High-performance one-transistor memory cell |
| JP2005051227A (ja) | 2003-07-17 | 2005-02-24 | Nec Electronics Corp | 半導体記憶装置 |
| US6914819B2 (en) * | 2003-09-04 | 2005-07-05 | Macronix International Co., Ltd. | Non-volatile flash memory |
| US6998317B2 (en) * | 2003-12-18 | 2006-02-14 | Sharp Laboratories Of America, Inc. | Method of making a non-volatile memory using a plasma oxidized high-k charge-trapping layer |
| KR100560301B1 (ko) * | 2003-12-30 | 2006-03-10 | 주식회사 하이닉스반도체 | 트랩 가능한 부도체를 사용하는 불휘발성 디램의 구동회로 및 방법 |
| EP1553635A1 (en) * | 2004-01-08 | 2005-07-13 | Macronix International Co., Ltd. | Nonvolatile semiconductor memory and operating method of the memory |
| JP5162075B2 (ja) * | 2004-01-08 | 2013-03-13 | マクロニックス インターナショナル カンパニー リミテッド | 不揮発性半導体メモリ及びその動作方法 |
| US20050167733A1 (en) * | 2004-02-02 | 2005-08-04 | Advanced Micro Devices, Inc. | Memory device and method of manufacture |
| KR100618819B1 (ko) * | 2004-02-06 | 2006-08-31 | 삼성전자주식회사 | 오버레이 마진이 개선된 반도체 소자 및 그 제조방법 |
| JP4546117B2 (ja) * | 2004-03-10 | 2010-09-15 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置 |
| JP2005317117A (ja) * | 2004-04-28 | 2005-11-10 | Sony Corp | 不揮発性半導体メモリ装置の動作方法、および、不揮発性半導体メモリ装置 |
| US7366025B2 (en) * | 2004-06-10 | 2008-04-29 | Saifun Semiconductors Ltd. | Reduced power programming of non-volatile cells |
| JP2006032489A (ja) * | 2004-07-13 | 2006-02-02 | Nec Electronics Corp | 不揮発性半導体記憶装置及びその製造方法 |
| US7423312B1 (en) * | 2004-07-20 | 2008-09-09 | Spansion Llc | Apparatus and method for a memory array with shallow trench isolation regions between bit lines for increased process margins |
| US7145186B2 (en) | 2004-08-24 | 2006-12-05 | Micron Technology, Inc. | Memory cell with trenched gated thyristor |
| US7098505B1 (en) | 2004-09-09 | 2006-08-29 | Actel Corporation | Memory device with multiple memory layers of local charge storage |
| US7518179B2 (en) | 2004-10-08 | 2009-04-14 | Freescale Semiconductor, Inc. | Virtual ground memory array and method therefor |
| US7214983B2 (en) * | 2004-11-24 | 2007-05-08 | Macronix International Co., Ltd. | Non-volatile memory and fabricating method thereof |
| KR100640620B1 (ko) * | 2004-12-27 | 2006-11-02 | 삼성전자주식회사 | 트윈비트 셀 구조의 nor형 플래쉬 메모리 소자 및 그제조 방법 |
| US7511329B2 (en) * | 2005-02-24 | 2009-03-31 | United Microelectronics Corp. | NAND-type non-volatile memory |
| WO2006129341A1 (ja) | 2005-05-30 | 2006-12-07 | Spansion Llc | 半導体装置およびその製造方法 |
| US7602009B2 (en) * | 2005-06-16 | 2009-10-13 | Micron Technology, Inc. | Erasable non-volatile memory device using hole trapping in high-K dielectrics |
| US7314798B2 (en) * | 2005-07-25 | 2008-01-01 | Freescale Semiconductor, Inc. | Method of fabricating a nonvolatile storage array with continuous control gate employing hot carrier injection programming |
| US7619270B2 (en) * | 2005-07-25 | 2009-11-17 | Freescale Semiconductor, Inc. | Electronic device including discontinuous storage elements |
| US7211487B2 (en) * | 2005-07-25 | 2007-05-01 | Freescale Semiconductor, Inc. | Process for forming an electronic device including discontinuous storage elements |
| US7250340B2 (en) * | 2005-07-25 | 2007-07-31 | Freescale Semiconductor, Inc. | Method of fabricating programmable structure including discontinuous storage elements and spacer control gates in a trench |
| US7256454B2 (en) * | 2005-07-25 | 2007-08-14 | Freescale Semiconductor, Inc | Electronic device including discontinuous storage elements and a process for forming the same |
| US7582929B2 (en) * | 2005-07-25 | 2009-09-01 | Freescale Semiconductor, Inc | Electronic device including discontinuous storage elements |
| US7642594B2 (en) * | 2005-07-25 | 2010-01-05 | Freescale Semiconductor, Inc | Electronic device including gate lines, bit lines, or a combination thereof |
| US7619275B2 (en) * | 2005-07-25 | 2009-11-17 | Freescale Semiconductor, Inc. | Process for forming an electronic device including discontinuous storage elements |
| US7112490B1 (en) * | 2005-07-25 | 2006-09-26 | Freescale Semiconductor, Inc. | Hot carrier injection programmable structure including discontinuous storage elements and spacer control gates in a trench |
| US7226840B2 (en) * | 2005-07-25 | 2007-06-05 | Freescale Semiconductor, Inc. | Process for forming an electronic device including discontinuous storage elements |
| US7205608B2 (en) * | 2005-07-25 | 2007-04-17 | Freescale Semiconductor, Inc. | Electronic device including discontinuous storage elements |
| US7262997B2 (en) * | 2005-07-25 | 2007-08-28 | Freescale Semiconductor, Inc. | Process for operating an electronic device including a memory array and conductive lines |
| US7394686B2 (en) * | 2005-07-25 | 2008-07-01 | Freescale Semiconductor, Inc. | Programmable structure including discontinuous storage elements and spacer control gates in a trench |
| US7285819B2 (en) * | 2005-07-25 | 2007-10-23 | Freescale Semiconductor, Inc. | Nonvolatile storage array with continuous control gate employing hot carrier injection programming |
| US7211858B2 (en) * | 2005-07-25 | 2007-05-01 | Freescale Semiconductor, Inc. | Split gate storage device including a horizontal first gate and a vertical second gate in a trench |
| US20070020840A1 (en) * | 2005-07-25 | 2007-01-25 | Freescale Semiconductor, Inc. | Programmable structure including nanocrystal storage elements in a trench |
| US7368350B2 (en) * | 2005-12-20 | 2008-05-06 | Infineon Technologies Ag | Memory cell arrays and methods for producing memory cell arrays |
| JP2007189008A (ja) * | 2006-01-12 | 2007-07-26 | Elpida Memory Inc | 半導体記憶装置およびその製造方法 |
| US7592224B2 (en) | 2006-03-30 | 2009-09-22 | Freescale Semiconductor, Inc | Method of fabricating a storage device including decontinuous storage elements within and between trenches |
| US20070284650A1 (en) * | 2006-06-07 | 2007-12-13 | Josef Willer | Memory device and a method of forming a memory device |
| JP4364226B2 (ja) * | 2006-09-21 | 2009-11-11 | 株式会社東芝 | 半導体集積回路 |
| US7838922B2 (en) * | 2007-01-24 | 2010-11-23 | Freescale Semiconductor, Inc. | Electronic device including trenches and discontinuous storage elements |
| US7651916B2 (en) * | 2007-01-24 | 2010-01-26 | Freescale Semiconductor, Inc | Electronic device including trenches and discontinuous storage elements and processes of forming and using the same |
| US7572699B2 (en) * | 2007-01-24 | 2009-08-11 | Freescale Semiconductor, Inc | Process of forming an electronic device including fins and discontinuous storage elements |
| US7416945B1 (en) * | 2007-02-19 | 2008-08-26 | Freescale Semiconductor, Inc. | Method for forming a split gate memory device |
| JP5252169B2 (ja) * | 2007-03-22 | 2013-07-31 | 日本電気株式会社 | 半導体装置 |
| US8258029B2 (en) * | 2007-04-10 | 2012-09-04 | Macronix International Co., Ltd. | Semiconductor structure and process for reducing the second bit effect of a memory device |
| US7848148B2 (en) * | 2007-10-18 | 2010-12-07 | Macronix International Co., Ltd. | One-transistor cell semiconductor on insulator random access memory |
| JP5491694B2 (ja) * | 2007-11-28 | 2014-05-14 | スパンション エルエルシー | 半導体装置およびその製造方法 |
| KR100926688B1 (ko) | 2007-12-07 | 2009-11-17 | 한양대학교 산학협력단 | 대용량 비휘발성 메모리 및 이의 제조방법 |
| JP2009152407A (ja) * | 2007-12-20 | 2009-07-09 | Toshiba Corp | 半導体記憶装置 |
| US7978518B2 (en) | 2007-12-21 | 2011-07-12 | Mosaid Technologies Incorporated | Hierarchical common source line structure in NAND flash memory |
| KR20090070468A (ko) * | 2007-12-27 | 2009-07-01 | 주식회사 동부하이텍 | 반도체 소자 및 그 제조 방법 |
| JP2009182114A (ja) * | 2008-01-30 | 2009-08-13 | Elpida Memory Inc | 半導体装置およびその製造方法 |
| KR101055387B1 (ko) | 2009-05-21 | 2011-08-09 | 주식회사 하이닉스반도체 | 불휘발성 메모리 소자의 제조방법 |
| JP5712579B2 (ja) * | 2010-11-30 | 2015-05-07 | 富士通セミコンダクター株式会社 | 半導体装置 |
| JP5516903B2 (ja) * | 2011-11-11 | 2014-06-11 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| JP5516904B2 (ja) * | 2011-11-11 | 2014-06-11 | セイコーエプソン株式会社 | 半導体装置の製造方法 |
| US9508854B2 (en) | 2013-12-06 | 2016-11-29 | Ecole Polytechnique Federale De Lausanne (Epfl) | Single field effect transistor capacitor-less memory device and method of operating the same |
| JP6266688B2 (ja) * | 2016-04-25 | 2018-01-24 | 株式会社フローディア | 不揮発性半導体記憶装置 |
| KR102699046B1 (ko) | 2016-12-15 | 2024-08-27 | 삼성전자주식회사 | 수직형 트랜지스터를 구비하는 집적 회로 및 이를 포함하는 반도체 장치 |
| TWI714840B (zh) * | 2018-04-12 | 2021-01-01 | 群聯電子股份有限公司 | 記憶體管理方法、記憶體儲存裝置及記憶體控制電路單元 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145080A (ja) * | 1991-11-25 | 1993-06-11 | Kawasaki Steel Corp | 不揮発性記憶装置 |
| JPH06177393A (ja) * | 1992-12-03 | 1994-06-24 | Rohm Co Ltd | 不揮発性記憶装置およびその駆動方法、ならびに製造方法 |
| JP3635681B2 (ja) * | 1994-07-15 | 2005-04-06 | ソニー株式会社 | バイアス回路の調整方法、電荷転送装置、及び電荷検出装置とその調整方法 |
| JP3951443B2 (ja) * | 1997-09-02 | 2007-08-01 | ソニー株式会社 | 不揮発性半導体記憶装置及びその書き込み方法 |
| US6348711B1 (en) * | 1998-05-20 | 2002-02-19 | Saifun Semiconductors Ltd. | NROM cell with self-aligned programming and erasure areas |
-
2000
- 2000-06-12 JP JP2000180763A patent/JP4834897B2/ja not_active Expired - Lifetime
-
2001
- 2001-04-27 US US09/842,795 patent/US6674120B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20020000592A1 (en) | 2002-01-03 |
| JP2002026149A (ja) | 2002-01-25 |
| US6674120B2 (en) | 2004-01-06 |
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