JP4781802B2 - サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法 - Google Patents

サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法 Download PDF

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Publication number
JP4781802B2
JP4781802B2 JP2005352594A JP2005352594A JP4781802B2 JP 4781802 B2 JP4781802 B2 JP 4781802B2 JP 2005352594 A JP2005352594 A JP 2005352594A JP 2005352594 A JP2005352594 A JP 2005352594A JP 4781802 B2 JP4781802 B2 JP 4781802B2
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JP
Japan
Prior art keywords
support plate
substrate
plate
laminating
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005352594A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007158122A (ja
Inventor
彰彦 中村
淳 宮成
吉浩 稲尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Ohka Kogyo Co Ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Priority to JP2005352594A priority Critical patent/JP4781802B2/ja
Priority to US11/633,604 priority patent/US8136564B2/en
Priority to TW095145191A priority patent/TW200731447A/zh
Priority to KR1020060122163A priority patent/KR100838460B1/ko
Publication of JP2007158122A publication Critical patent/JP2007158122A/ja
Application granted granted Critical
Publication of JP4781802B2 publication Critical patent/JP4781802B2/ja
Priority to US13/369,448 priority patent/US8931535B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B2038/1891—Using a robot for handling the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005352594A 2005-12-06 2005-12-06 サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法 Expired - Lifetime JP4781802B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005352594A JP4781802B2 (ja) 2005-12-06 2005-12-06 サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法
US11/633,604 US8136564B2 (en) 2005-12-06 2006-12-04 Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate
TW095145191A TW200731447A (en) 2005-12-06 2006-12-05 Bonding means and bonding apparatus for supporting plate, and bonding method for supporting plate
KR1020060122163A KR100838460B1 (ko) 2005-12-06 2006-12-05 서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법
US13/369,448 US8931535B2 (en) 2005-12-06 2012-02-09 Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005352594A JP4781802B2 (ja) 2005-12-06 2005-12-06 サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法

Publications (2)

Publication Number Publication Date
JP2007158122A JP2007158122A (ja) 2007-06-21
JP4781802B2 true JP4781802B2 (ja) 2011-09-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005352594A Expired - Lifetime JP4781802B2 (ja) 2005-12-06 2005-12-06 サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法

Country Status (4)

Country Link
US (2) US8136564B2 (enExample)
JP (1) JP4781802B2 (enExample)
KR (1) KR100838460B1 (enExample)
TW (1) TW200731447A (enExample)

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JP5149207B2 (ja) * 2009-01-13 2013-02-20 株式会社荏原製作所 基板搭載装置
WO2010121068A2 (en) * 2009-04-16 2010-10-21 Suss Microtec, Inc. Improved apparatus for temporary wafer bonding and debonding
JP5449239B2 (ja) * 2010-05-12 2014-03-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及びプログラムを記録した記憶媒体
JP5572575B2 (ja) * 2010-05-12 2014-08-13 東京エレクトロン株式会社 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
SG179299A1 (en) * 2010-09-13 2012-04-27 Trimech Technology Pte Ltd A display panel substrate assembly, an apparatus and a method for forming a display panel substrate assembly
JP6018732B2 (ja) * 2011-03-25 2016-11-02 不二越機械工業株式会社 ワーク貼着方法およびワーク貼着装置
DE102011113292A1 (de) * 2011-09-05 2013-03-07 Schmid Vacuum Technology Gmbh Vakuumdurchführung und Vakuumbeschichtungsvorrichtung mit Vakuumdurchführungen
JP5427856B2 (ja) * 2011-09-07 2014-02-26 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
JP5913914B2 (ja) * 2011-11-08 2016-04-27 東京応化工業株式会社 基板処理装置及び基板処理方法
JP6055597B2 (ja) * 2012-02-09 2016-12-27 東京応化工業株式会社 貼付方法及び貼付装置
JP5639617B2 (ja) * 2012-05-11 2014-12-10 東京応化工業株式会社 貼付装置および貼付方法
JP6001934B2 (ja) * 2012-06-25 2016-10-05 東京応化工業株式会社 重ね合わせ装置および重ね合わせ方法
JP6088835B2 (ja) 2012-09-28 2017-03-01 東京応化工業株式会社 貼合装置および貼り合わせ方法
JP5759086B2 (ja) 2013-03-29 2015-08-05 東京応化工業株式会社 貼付方法
CN103273719B (zh) * 2013-06-07 2015-09-09 无锡隆盛科技股份有限公司 氧传感器芯片叠压装置
JP5585689B2 (ja) * 2013-06-13 2014-09-10 株式会社ニコン 基板ホルダおよび貼り合せ装置
JP6374680B2 (ja) * 2013-12-13 2018-08-15 東京応化工業株式会社 貼付方法
WO2017066418A1 (en) * 2015-10-15 2017-04-20 Applied Materials, Inc. Substrate carrier system
CN106739424B (zh) * 2015-11-20 2020-02-14 财团法人工业技术研究院 取下贴合装置及应用此装置的取下方法与贴合方法
JP6612670B2 (ja) * 2016-03-31 2019-11-27 東京応化工業株式会社 基板処理装置、及び、基板処理方法
US10730276B2 (en) * 2017-01-17 2020-08-04 Maven Optronics Co., Ltd. System and method for vacuum film lamination
CN108110096B (zh) * 2018-02-10 2024-09-06 江苏应材微机电科技有限公司 一种led生产设备用新型扩晶机
CN108711556B (zh) * 2018-05-25 2020-06-19 北京北方华创微电子装备有限公司 去气腔室以及去气方法
CN109473380A (zh) * 2018-10-26 2019-03-15 志圣科技（广州）有限公司 晶圆加工机台及其加工方法
CN111029292B (zh) * 2019-12-25 2022-08-02 山东天岳先进科技股份有限公司 一种晶锭的粘结分离装置及方法
KR102377036B1 (ko) * 2020-02-24 2022-03-22 피에스케이홀딩스 (주) 정렬 장치, 그리고 이를 포함하는 기판 처리 장치
CN113728422B (zh) * 2020-03-24 2024-01-09 株式会社日立高新技术 真空处理装置
JP7688884B2 (ja) * 2020-08-28 2025-06-05 Ａｉメカテック株式会社 基板処理装置、及び基板処理方法
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JP2022087393A (ja) * 2020-12-01 2022-06-13 ウシオ電機株式会社 Ｌｅｄ素子及びその製造方法
JP7578905B2 (ja) * 2020-12-01 2024-11-07 ウシオ電機株式会社 Ｌｅｄ素子及びその製造方法
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Also Published As

Publication number Publication date
KR100838460B1 (ko) 2008-06-16
US20120132359A1 (en) 2012-05-31
TWI323923B (enExample) 2010-04-21
US8136564B2 (en) 2012-03-20
JP2007158122A (ja) 2007-06-21
US20070125495A1 (en) 2007-06-07
KR20070059994A (ko) 2007-06-12
US8931535B2 (en) 2015-01-13
TW200731447A (en) 2007-08-16

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