TWI323923B - - Google Patents
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- Publication number
- TWI323923B TWI323923B TW095145191A TW95145191A TWI323923B TW I323923 B TWI323923 B TW I323923B TW 095145191 A TW095145191 A TW 095145191A TW 95145191 A TW95145191 A TW 95145191A TW I323923 B TWI323923 B TW I323923B
- Authority
- TW
- Taiwan
- Prior art keywords
- support plate
- substrate
- plate
- bonding
- support
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 50
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000012545 processing Methods 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 238000001816 cooling Methods 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 54
- 239000004065 semiconductor Substances 0.000 description 52
- 238000012937 correction Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000012407 engineering method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- ZKEYULQFFYBZBG-UHFFFAOYSA-N lanthanum carbide Chemical compound [La].[C-]#[C] ZKEYULQFFYBZBG-UHFFFAOYSA-N 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- -1 polybutylene naphthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B2038/1891—Using a robot for handling the layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005352594A JP4781802B2 (ja) | 2005-12-06 | 2005-12-06 | サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200731447A TW200731447A (en) | 2007-08-16 |
| TWI323923B true TWI323923B (enExample) | 2010-04-21 |
Family
ID=38117556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095145191A TW200731447A (en) | 2005-12-06 | 2006-12-05 | Bonding means and bonding apparatus for supporting plate, and bonding method for supporting plate |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8136564B2 (enExample) |
| JP (1) | JP4781802B2 (enExample) |
| KR (1) | KR100838460B1 (enExample) |
| TW (1) | TW200731447A (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100034450A (ko) * | 2008-09-24 | 2010-04-01 | 삼성전자주식회사 | 기판접합장치 |
| JP5149207B2 (ja) * | 2009-01-13 | 2013-02-20 | 株式会社荏原製作所 | 基板搭載装置 |
| WO2010121068A2 (en) * | 2009-04-16 | 2010-10-21 | Suss Microtec, Inc. | Improved apparatus for temporary wafer bonding and debonding |
| JP5449239B2 (ja) * | 2010-05-12 | 2014-03-19 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及びプログラムを記録した記憶媒体 |
| JP5572575B2 (ja) * | 2010-05-12 | 2014-08-13 | 東京エレクトロン株式会社 | 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体 |
| SG179299A1 (en) * | 2010-09-13 | 2012-04-27 | Trimech Technology Pte Ltd | A display panel substrate assembly, an apparatus and a method for forming a display panel substrate assembly |
| JP6018732B2 (ja) * | 2011-03-25 | 2016-11-02 | 不二越機械工業株式会社 | ワーク貼着方法およびワーク貼着装置 |
| DE102011113292A1 (de) * | 2011-09-05 | 2013-03-07 | Schmid Vacuum Technology Gmbh | Vakuumdurchführung und Vakuumbeschichtungsvorrichtung mit Vakuumdurchführungen |
| JP5427856B2 (ja) * | 2011-09-07 | 2014-02-26 | 東京エレクトロン株式会社 | 接合方法、プログラム、コンピュータ記憶媒体及び接合システム |
| JP5913914B2 (ja) * | 2011-11-08 | 2016-04-27 | 東京応化工業株式会社 | 基板処理装置及び基板処理方法 |
| JP6055597B2 (ja) * | 2012-02-09 | 2016-12-27 | 東京応化工業株式会社 | 貼付方法及び貼付装置 |
| JP5639617B2 (ja) * | 2012-05-11 | 2014-12-10 | 東京応化工業株式会社 | 貼付装置および貼付方法 |
| JP6001934B2 (ja) * | 2012-06-25 | 2016-10-05 | 東京応化工業株式会社 | 重ね合わせ装置および重ね合わせ方法 |
| JP6088835B2 (ja) | 2012-09-28 | 2017-03-01 | 東京応化工業株式会社 | 貼合装置および貼り合わせ方法 |
| JP5759086B2 (ja) | 2013-03-29 | 2015-08-05 | 東京応化工業株式会社 | 貼付方法 |
| CN103273719B (zh) * | 2013-06-07 | 2015-09-09 | 无锡隆盛科技股份有限公司 | 氧传感器芯片叠压装置 |
| JP5585689B2 (ja) * | 2013-06-13 | 2014-09-10 | 株式会社ニコン | 基板ホルダおよび貼り合せ装置 |
| JP6374680B2 (ja) * | 2013-12-13 | 2018-08-15 | 東京応化工業株式会社 | 貼付方法 |
| WO2017066418A1 (en) * | 2015-10-15 | 2017-04-20 | Applied Materials, Inc. | Substrate carrier system |
| CN106739424B (zh) * | 2015-11-20 | 2020-02-14 | 财团法人工业技术研究院 | 取下贴合装置及应用此装置的取下方法与贴合方法 |
| JP6612670B2 (ja) * | 2016-03-31 | 2019-11-27 | 東京応化工業株式会社 | 基板処理装置、及び、基板処理方法 |
| US10730276B2 (en) * | 2017-01-17 | 2020-08-04 | Maven Optronics Co., Ltd. | System and method for vacuum film lamination |
| CN108110096B (zh) * | 2018-02-10 | 2024-09-06 | 江苏应材微机电科技有限公司 | 一种led生产设备用新型扩晶机 |
| CN108711556B (zh) * | 2018-05-25 | 2020-06-19 | 北京北方华创微电子装备有限公司 | 去气腔室以及去气方法 |
| CN109473380A (zh) * | 2018-10-26 | 2019-03-15 | 志圣科技（广州）有限公司 | 晶圆加工机台及其加工方法 |
| CN111029292B (zh) * | 2019-12-25 | 2022-08-02 | 山东天岳先进科技股份有限公司 | 一种晶锭的粘结分离装置及方法 |
| KR102377036B1 (ko) * | 2020-02-24 | 2022-03-22 | 피에스케이홀딩스 (주) | 정렬 장치, 그리고 이를 포함하는 기판 처리 장치 |
| CN113728422B (zh) * | 2020-03-24 | 2024-01-09 | 株式会社日立高新技术 | 真空处理装置 |
| JP7688884B2 (ja) * | 2020-08-28 | 2025-06-05 | Ａｉメカテック株式会社 | 基板処理装置、及び基板処理方法 |
| KR102840203B1 (ko) | 2020-09-01 | 2025-08-01 | 삼성전자주식회사 | 기판 정렬 장치 및 이를 구비하는 기판 본딩 설비 |
| JP2022087393A (ja) * | 2020-12-01 | 2022-06-13 | ウシオ電機株式会社 | Ｌｅｄ素子及びその製造方法 |
| JP7578905B2 (ja) * | 2020-12-01 | 2024-11-07 | ウシオ電機株式会社 | Ｌｅｄ素子及びその製造方法 |
| CN113263820A (zh) * | 2021-05-19 | 2021-08-17 | 曹健 | 一种复合结构铁粉芯胚体堆叠均匀压制装置 |
| JP7580129B2 (ja) | 2022-04-12 | 2024-11-11 | Ａｉメカテック株式会社 | 基板重ね合わせ装置及び基板重ね合わせ方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3902255A1 (de) * | 1989-01-26 | 1990-08-02 | Nokia Unterhaltungselektronik | Verfahren und vorrichtung zum herstellen einer fluessigkristallzelle |
| JP2945089B2 (ja) * | 1990-07-05 | 1999-09-06 | 古河電気工業株式会社 | ウエハへのテープ貼付装置 |
| JPH065109A (ja) | 1992-06-23 | 1994-01-14 | Matsushita Electric Works Ltd | 太陽光採光装置 |
| US5522478A (en) * | 1994-04-19 | 1996-06-04 | Smartech Llc | Method of elevating a workpiece |
| JP4689797B2 (ja) * | 2000-07-19 | 2011-05-25 | Ｎｅｃ液晶テクノロジー株式会社 | 液晶表示装置の製造装置及びその製造方法 |
| JP2002137352A (ja) * | 2000-08-25 | 2002-05-14 | Internatl Business Mach Corp <Ibm> | シート材の積層方法、シート材の積層装置、液晶表示パネルの製造方法および液晶表示パネルの製造装置 |
| JP3742000B2 (ja) * | 2000-11-30 | 2006-02-01 | 富士通株式会社 | プレス装置 |
| JP2002192394A (ja) | 2000-12-28 | 2002-07-10 | Mitsubishi Gas Chem Co Inc | 無機基板のプレス加工法およびプレス装置 |
| US6808566B2 (en) * | 2001-09-19 | 2004-10-26 | Tokyo Electron Limited | Reduced-pressure drying unit and coating film forming method |
| US6845779B2 (en) | 2001-11-13 | 2005-01-25 | Fsi International, Inc. | Edge gripping device for handling a set of semiconductor wafers in an immersion processing system |
| JP2004165403A (ja) * | 2002-11-13 | 2004-06-10 | Ricoh Co Ltd | アライメント接着方法およびアライメント接着装置 |
| JP2005191535A (ja) * | 2003-12-01 | 2005-07-14 | Tokyo Ohka Kogyo Co Ltd | 貼り付け装置および貼り付け方法 |
| WO2005055312A1 (ja) * | 2003-12-04 | 2005-06-16 | Hirata Corporation | 基板位置決めシステム |
-
2005
- 2005-12-06 JP JP2005352594A patent/JP4781802B2/ja not_active Expired - Lifetime
-
2006
- 2006-12-04 US US11/633,604 patent/US8136564B2/en not_active Expired - Fee Related
- 2006-12-05 KR KR1020060122163A patent/KR100838460B1/ko active Active
- 2006-12-05 TW TW095145191A patent/TW200731447A/zh unknown
-
2012
- 2012-02-09 US US13/369,448 patent/US8931535B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR100838460B1 (ko) | 2008-06-16 |
| US20120132359A1 (en) | 2012-05-31 |
| US8136564B2 (en) | 2012-03-20 |
| JP2007158122A (ja) | 2007-06-21 |
| US20070125495A1 (en) | 2007-06-07 |
| JP4781802B2 (ja) | 2011-09-28 |
| KR20070059994A (ko) | 2007-06-12 |
| US8931535B2 (en) | 2015-01-13 |
| TW200731447A (en) | 2007-08-16 |
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