KR100838460B1 - 서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법 - Google Patents

서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법 Download PDF

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Publication number
KR100838460B1
KR100838460B1 KR1020060122163A KR20060122163A KR100838460B1 KR 100838460 B1 KR100838460 B1 KR 100838460B1 KR 1020060122163 A KR1020060122163 A KR 1020060122163A KR 20060122163 A KR20060122163 A KR 20060122163A KR 100838460 B1 KR100838460 B1 KR 100838460B1
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support plate
substrate
plate
bonding
semiconductor wafer
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Korean (ko)
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KR20070059994A (ko
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아키히코 나카무라
아쯔시 미야나리
요시히로 이나오
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도쿄 오카 고교 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B2038/1891—Using a robot for handling the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020060122163A 2005-12-06 2006-12-05 서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법 Active KR100838460B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005352594A JP4781802B2 (ja) 2005-12-06 2005-12-06 サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法
JPJP-P-2005-00352594 2005-12-06

Publications (2)

Publication Number Publication Date
KR20070059994A KR20070059994A (ko) 2007-06-12
KR100838460B1 true KR100838460B1 (ko) 2008-06-16

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KR1020060122163A Active KR100838460B1 (ko) 2005-12-06 2006-12-05 서포트 플레이트의 첩합도구와 첩합장치, 및 서포트 플레이트의 첩합방법

Country Status (4)

Country Link
US (2) US8136564B2 (enExample)
JP (1) JP4781802B2 (enExample)
KR (1) KR100838460B1 (enExample)
TW (1) TW200731447A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170044216A (ko) * 2012-02-09 2017-04-24 도오꾜오까고오교 가부시끼가이샤 첩부 방법 및 첩부 장치

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100034450A (ko) * 2008-09-24 2010-04-01 삼성전자주식회사 기판접합장치
JP5149207B2 (ja) * 2009-01-13 2013-02-20 株式会社荏原製作所 基板搭載装置
WO2010121068A2 (en) * 2009-04-16 2010-10-21 Suss Microtec, Inc. Improved apparatus for temporary wafer bonding and debonding
JP5449239B2 (ja) * 2010-05-12 2014-03-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及びプログラムを記録した記憶媒体
JP5572575B2 (ja) * 2010-05-12 2014-08-13 東京エレクトロン株式会社 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体
SG179299A1 (en) * 2010-09-13 2012-04-27 Trimech Technology Pte Ltd A display panel substrate assembly, an apparatus and a method for forming a display panel substrate assembly
JP6018732B2 (ja) * 2011-03-25 2016-11-02 不二越機械工業株式会社 ワーク貼着方法およびワーク貼着装置
DE102011113292A1 (de) * 2011-09-05 2013-03-07 Schmid Vacuum Technology Gmbh Vakuumdurchführung und Vakuumbeschichtungsvorrichtung mit Vakuumdurchführungen
JP5427856B2 (ja) * 2011-09-07 2014-02-26 東京エレクトロン株式会社 接合方法、プログラム、コンピュータ記憶媒体及び接合システム
JP5913914B2 (ja) * 2011-11-08 2016-04-27 東京応化工業株式会社 基板処理装置及び基板処理方法
JP5639617B2 (ja) * 2012-05-11 2014-12-10 東京応化工業株式会社 貼付装置および貼付方法
JP6001934B2 (ja) * 2012-06-25 2016-10-05 東京応化工業株式会社 重ね合わせ装置および重ね合わせ方法
JP6088835B2 (ja) 2012-09-28 2017-03-01 東京応化工業株式会社 貼合装置および貼り合わせ方法
JP5759086B2 (ja) 2013-03-29 2015-08-05 東京応化工業株式会社 貼付方法
CN103273719B (zh) * 2013-06-07 2015-09-09 无锡隆盛科技股份有限公司 氧传感器芯片叠压装置
JP5585689B2 (ja) * 2013-06-13 2014-09-10 株式会社ニコン 基板ホルダおよび貼り合せ装置
JP6374680B2 (ja) * 2013-12-13 2018-08-15 東京応化工業株式会社 貼付方法
WO2017066418A1 (en) * 2015-10-15 2017-04-20 Applied Materials, Inc. Substrate carrier system
CN106739424B (zh) * 2015-11-20 2020-02-14 财团法人工业技术研究院 取下贴合装置及应用此装置的取下方法与贴合方法
JP6612670B2 (ja) * 2016-03-31 2019-11-27 東京応化工業株式会社 基板処理装置、及び、基板処理方法
US10730276B2 (en) * 2017-01-17 2020-08-04 Maven Optronics Co., Ltd. System and method for vacuum film lamination
CN108110096B (zh) * 2018-02-10 2024-09-06 江苏应材微机电科技有限公司 一种led生产设备用新型扩晶机
CN108711556B (zh) * 2018-05-25 2020-06-19 北京北方华创微电子装备有限公司 去气腔室以及去气方法
CN109473380A (zh) * 2018-10-26 2019-03-15 志圣科技（广州）有限公司 晶圆加工机台及其加工方法
CN111029292B (zh) * 2019-12-25 2022-08-02 山东天岳先进科技股份有限公司 一种晶锭的粘结分离装置及方法
KR102377036B1 (ko) * 2020-02-24 2022-03-22 피에스케이홀딩스 (주) 정렬 장치, 그리고 이를 포함하는 기판 처리 장치
CN113728422B (zh) * 2020-03-24 2024-01-09 株式会社日立高新技术 真空处理装置
JP7688884B2 (ja) * 2020-08-28 2025-06-05 Ａｉメカテック株式会社 基板処理装置、及び基板処理方法
KR102840203B1 (ko) 2020-09-01 2025-08-01 삼성전자주식회사 기판 정렬 장치 및 이를 구비하는 기판 본딩 설비
JP2022087393A (ja) * 2020-12-01 2022-06-13 ウシオ電機株式会社 Ｌｅｄ素子及びその製造方法
JP7578905B2 (ja) * 2020-12-01 2024-11-07 ウシオ電機株式会社 Ｌｅｄ素子及びその製造方法
CN113263820A (zh) * 2021-05-19 2021-08-17 曹健 一种复合结构铁粉芯胚体堆叠均匀压制装置
JP7580129B2 (ja) 2022-04-12 2024-11-11 Ａｉメカテック株式会社 基板重ね合わせ装置及び基板重ね合わせ方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950031408A (ko) * 1994-04-19 1995-12-18 하르트무트 디에크위쉬 막 프레스와 가공편 상승방법
JP2002192394A (ja) * 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc 無機基板のプレス加工法およびプレス装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3902255A1 (de) * 1989-01-26 1990-08-02 Nokia Unterhaltungselektronik Verfahren und vorrichtung zum herstellen einer fluessigkristallzelle
JP2945089B2 (ja) * 1990-07-05 1999-09-06 古河電気工業株式会社 ウエハへのテープ貼付装置
JPH065109A (ja) 1992-06-23 1994-01-14 Matsushita Electric Works Ltd 太陽光採光装置
JP4689797B2 (ja) * 2000-07-19 2011-05-25 Ｎｅｃ液晶テクノロジー株式会社 液晶表示装置の製造装置及びその製造方法
JP2002137352A (ja) * 2000-08-25 2002-05-14 Internatl Business Mach Corp <Ibm> シート材の積層方法、シート材の積層装置、液晶表示パネルの製造方法および液晶表示パネルの製造装置
JP3742000B2 (ja) * 2000-11-30 2006-02-01 富士通株式会社 プレス装置
US6808566B2 (en) * 2001-09-19 2004-10-26 Tokyo Electron Limited Reduced-pressure drying unit and coating film forming method
US6845779B2 (en) 2001-11-13 2005-01-25 Fsi International, Inc. Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
JP2004165403A (ja) * 2002-11-13 2004-06-10 Ricoh Co Ltd アライメント接着方法およびアライメント接着装置
JP2005191535A (ja) * 2003-12-01 2005-07-14 Tokyo Ohka Kogyo Co Ltd 貼り付け装置および貼り付け方法
WO2005055312A1 (ja) * 2003-12-04 2005-06-16 Hirata Corporation 基板位置決めシステム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950031408A (ko) * 1994-04-19 1995-12-18 하르트무트 디에크위쉬 막 프레스와 가공편 상승방법
JP2002192394A (ja) * 2000-12-28 2002-07-10 Mitsubishi Gas Chem Co Inc 無機基板のプレス加工法およびプレス装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170044216A (ko) * 2012-02-09 2017-04-24 도오꾜오까고오교 가부시끼가이샤 첩부 방법 및 첩부 장치
KR101959151B1 (ko) * 2012-02-09 2019-03-15 도오꾜오까고오교 가부시끼가이샤 첩부 방법 및 첩부 장치

Also Published As

Publication number Publication date
US20120132359A1 (en) 2012-05-31
TWI323923B (enExample) 2010-04-21
US8136564B2 (en) 2012-03-20
JP2007158122A (ja) 2007-06-21
US20070125495A1 (en) 2007-06-07
JP4781802B2 (ja) 2011-09-28
KR20070059994A (ko) 2007-06-12
US8931535B2 (en) 2015-01-13
TW200731447A (en) 2007-08-16

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