JP4748867B2 - 集積回路装置 - Google Patents

集積回路装置 Download PDF

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Publication number
JP4748867B2
JP4748867B2 JP2001060090A JP2001060090A JP4748867B2 JP 4748867 B2 JP4748867 B2 JP 4748867B2 JP 2001060090 A JP2001060090 A JP 2001060090A JP 2001060090 A JP2001060090 A JP 2001060090A JP 4748867 B2 JP4748867 B2 JP 4748867B2
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JP
Japan
Prior art keywords
wiring
voltage supply
supply wiring
collective
distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001060090A
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English (en)
Japanese (ja)
Other versions
JP2002261245A (ja
JP2002261245A5 (enExample
Inventor
馨一 楠本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2001060090A priority Critical patent/JP4748867B2/ja
Priority to US10/084,978 priority patent/US6794674B2/en
Publication of JP2002261245A publication Critical patent/JP2002261245A/ja
Priority to US10/879,754 priority patent/US7155684B2/en
Priority to US11/633,569 priority patent/US7465974B2/en
Priority to US12/271,501 priority patent/US7737473B2/en
Priority to US12/772,604 priority patent/US8063417B2/en
Publication of JP2002261245A5 publication Critical patent/JP2002261245A5/ja
Application granted granted Critical
Publication of JP4748867B2 publication Critical patent/JP4748867B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/427—Power or ground buses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/998—Input and output buffer/driver structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2001060090A 2001-03-05 2001-03-05 集積回路装置 Expired - Lifetime JP4748867B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001060090A JP4748867B2 (ja) 2001-03-05 2001-03-05 集積回路装置
US10/084,978 US6794674B2 (en) 2001-03-05 2002-03-01 Integrated circuit device and method for forming the same
US10/879,754 US7155684B2 (en) 2001-03-05 2004-06-30 Integrated circuit device and method for forming the same
US11/633,569 US7465974B2 (en) 2001-03-05 2006-12-05 Integrated circuit device and method for forming the same
US12/271,501 US7737473B2 (en) 2001-03-05 2008-11-14 Integrated circuit device and method for forming the same
US12/772,604 US8063417B2 (en) 2001-03-05 2010-05-03 Integrated circuit device and method for forming the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001060090A JP4748867B2 (ja) 2001-03-05 2001-03-05 集積回路装置

Publications (3)

Publication Number Publication Date
JP2002261245A JP2002261245A (ja) 2002-09-13
JP2002261245A5 JP2002261245A5 (enExample) 2010-06-17
JP4748867B2 true JP4748867B2 (ja) 2011-08-17

Family

ID=18919558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001060090A Expired - Lifetime JP4748867B2 (ja) 2001-03-05 2001-03-05 集積回路装置

Country Status (2)

Country Link
US (5) US6794674B2 (enExample)
JP (1) JP4748867B2 (enExample)

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JP4748867B2 (ja) 2001-03-05 2011-08-17 パナソニック株式会社 集積回路装置
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CN100468735C (zh) * 2006-08-25 2009-03-11 威盛电子股份有限公司 集成电路的电源地网络及其布置方法
JP2008091722A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 半導体集積回路
JP2008159736A (ja) * 2006-12-22 2008-07-10 Elpida Memory Inc 半導体装置及びその電源供給方法
US7727887B2 (en) * 2007-10-30 2010-06-01 International Business Machines Corporation Method for improved power distribution in a three dimensional vertical integrated circuit
US7701064B2 (en) * 2007-10-31 2010-04-20 International Business Machines Corporation Apparatus for improved power distribution in a three dimensional vertical integrated circuit
GB2466313A (en) * 2008-12-22 2010-06-23 Cambridge Silicon Radio Ltd Radio Frequency CMOS Transistor
KR101639618B1 (ko) * 2009-02-03 2016-07-15 삼성전자주식회사 전자 소자 모듈
JP2010283269A (ja) * 2009-06-08 2010-12-16 Renesas Electronics Corp 半導体装置
US8378491B2 (en) * 2010-08-24 2013-02-19 Infineon Technologies Ag Integrated circuit including interconnect levels
US8826216B2 (en) 2012-06-18 2014-09-02 International Business Machines Corporation Token-based current control to mitigate current delivery limitations in integrated circuits
US8863068B2 (en) 2012-06-18 2014-10-14 International Business Machines Corporation Current-aware floorplanning to overcome current delivery limitations in integrated circuits
US8826203B2 (en) * 2012-06-18 2014-09-02 International Business Machines Corporation Automating current-aware integrated circuit and package design and optimization
US8914764B2 (en) 2012-06-18 2014-12-16 International Business Machines Corporation Adaptive workload based optimizations coupled with a heterogeneous current-aware baseline design to mitigate current delivery limitations in integrated circuits
JP5939960B2 (ja) * 2012-11-09 2016-06-29 キヤノン株式会社 半導体装置、液体吐出ヘッド、液体吐出ヘッドカードリッジおよび記録装置
US8819610B2 (en) * 2013-01-09 2014-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Method and layout of an integrated circuit
KR102041265B1 (ko) * 2013-05-02 2019-11-27 삼성전자주식회사 Ｅｍｉ 차폐기능과 방열 기능을 가지는 반도체 패키지
US9165882B2 (en) * 2013-09-27 2015-10-20 Taiwan Semiconductor Manufacturing Co., Ltd. Power rail for preventing DC electromigration
KR102349417B1 (ko) 2015-07-16 2022-01-10 삼성전자 주식회사 전압 강하를 개선할 수 있는 구조를 갖는 반도체 장치와 이를 포함하는 장치
CN115796102B (zh) * 2021-09-10 2026-01-13 群创光电股份有限公司 具有电子组件的电子装置

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Also Published As

Publication number Publication date
US20100244102A1 (en) 2010-09-30
US8063417B2 (en) 2011-11-22
US20040238850A1 (en) 2004-12-02
US7465974B2 (en) 2008-12-16
US6794674B2 (en) 2004-09-21
US20070079261A1 (en) 2007-04-05
US7155684B2 (en) 2006-12-26
US20020149116A1 (en) 2002-10-17
US20090078968A1 (en) 2009-03-26
US7737473B2 (en) 2010-06-15
JP2002261245A (ja) 2002-09-13

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