JP2002261245A5 - - Google Patents

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Publication number
JP2002261245A5
JP2002261245A5 JP2001060090A JP2001060090A JP2002261245A5 JP 2002261245 A5 JP2002261245 A5 JP 2002261245A5 JP 2001060090 A JP2001060090 A JP 2001060090A JP 2001060090 A JP2001060090 A JP 2001060090A JP 2002261245 A5 JP2002261245 A5 JP 2002261245A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001060090A
Other languages
Japanese (ja)
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JP4748867B2 (ja
JP2002261245A (ja
Filing date
Publication date
Priority claimed from JP2001060090A external-priority patent/JP4748867B2/ja
Priority to JP2001060090A priority Critical patent/JP4748867B2/ja
Application filed filed Critical
Priority to US10/084,978 priority patent/US6794674B2/en
Publication of JP2002261245A publication Critical patent/JP2002261245A/ja
Priority to US10/879,754 priority patent/US7155684B2/en
Priority to US11/633,569 priority patent/US7465974B2/en
Priority to US12/271,501 priority patent/US7737473B2/en
Priority to US12/772,604 priority patent/US8063417B2/en
Publication of JP2002261245A5 publication Critical patent/JP2002261245A5/ja
Publication of JP4748867B2 publication Critical patent/JP4748867B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001060090A 2001-03-05 2001-03-05 集積回路装置 Expired - Lifetime JP4748867B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001060090A JP4748867B2 (ja) 2001-03-05 2001-03-05 集積回路装置
US10/084,978 US6794674B2 (en) 2001-03-05 2002-03-01 Integrated circuit device and method for forming the same
US10/879,754 US7155684B2 (en) 2001-03-05 2004-06-30 Integrated circuit device and method for forming the same
US11/633,569 US7465974B2 (en) 2001-03-05 2006-12-05 Integrated circuit device and method for forming the same
US12/271,501 US7737473B2 (en) 2001-03-05 2008-11-14 Integrated circuit device and method for forming the same
US12/772,604 US8063417B2 (en) 2001-03-05 2010-05-03 Integrated circuit device and method for forming the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001060090A JP4748867B2 (ja) 2001-03-05 2001-03-05 集積回路装置

Publications (3)

Publication Number Publication Date
JP2002261245A JP2002261245A (ja) 2002-09-13
JP2002261245A5 true JP2002261245A5 (enExample) 2010-06-17
JP4748867B2 JP4748867B2 (ja) 2011-08-17

Family

ID=18919558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001060090A Expired - Lifetime JP4748867B2 (ja) 2001-03-05 2001-03-05 集積回路装置

Country Status (2)

Country Link
US (5) US6794674B2 (enExample)
JP (1) JP4748867B2 (enExample)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6987383B2 (en) * 2000-02-10 2006-01-17 Matsushita Electric Industrial Co., Ltd. Semiconductor device having a connection inspecting circuit for inspecting connections of power source terminals and grounding terminals, and inspection method for the same
JP4748867B2 (ja) 2001-03-05 2011-08-17 パナソニック株式会社 集積回路装置
JP4596406B2 (ja) * 2001-08-22 2010-12-08 富士通セミコンダクター株式会社 集積回路の回路ブロック間自動配線設計方法及び装置並びにこの方法を実施するためのプログラム
US7007247B1 (en) * 2002-05-24 2006-02-28 Cadence Design Systems, Inc. Method and mechanism for RTL power optimization
US7194716B2 (en) * 2002-06-19 2007-03-20 Nascentric, Inc. Apparatus and methods for cell models for timing and power analysis
JP2004139181A (ja) * 2002-10-15 2004-05-13 Renesas Technology Corp レイアウト装置及びプログラム
US7287324B2 (en) * 2002-11-19 2007-10-30 Cadence Design Systems, Inc. Method, system, and article of manufacture for implementing metal-fill on an integrated circuit
US20040098688A1 (en) * 2002-11-19 2004-05-20 Cadence Design Systems, Inc. Method, system, and article of manufacture for implementing long wire metal-fill
US7231624B2 (en) 2002-11-19 2007-06-12 Cadence Design Systems, Inc. Method, system, and article of manufacture for implementing metal-fill with power or ground connection
US7328419B2 (en) * 2002-11-19 2008-02-05 Cadence Design Systems, Inc. Place and route tool that incorporates a metal-fill mechanism
US20060168551A1 (en) * 2003-06-30 2006-07-27 Sanyo Electric Co., Ltd. Integrated circuit having a multi-layer structure and design method thereof
JP2005197518A (ja) * 2004-01-08 2005-07-21 Matsushita Electric Ind Co Ltd 半導体装置とセル
JP4287294B2 (ja) * 2004-01-21 2009-07-01 株式会社東芝 自動設計方法、自動設計装置、及び半導体集積回路
US7219322B2 (en) * 2004-04-27 2007-05-15 Hewlett-Packard Development Company, L.P. Multiple propagation speeds of signals in layered circuit apparatus
JP2005327862A (ja) * 2004-05-13 2005-11-24 Toshiba Corp 半導体集積回路及び半導体集積回路の設計方法
US7200825B2 (en) * 2004-08-27 2007-04-03 International Business Machines Corporation Methodology of quantification of transmission probability for minority carrier collection in a semiconductor chip
JP2006073955A (ja) * 2004-09-06 2006-03-16 Fujitsu Ltd 半導体装置、設計装置、レイアウト設計方法、プログラム及び記録媒体
JP4820542B2 (ja) * 2004-09-30 2011-11-24 パナソニック株式会社 半導体集積回路
US7346869B2 (en) * 2004-10-29 2008-03-18 Synopsys, Inc. Power network analyzer for an integrated circuit design
US7275222B2 (en) * 2004-12-02 2007-09-25 International Business Machines Coproation Method, apparatus, and computer program product for enhancing a power distribution system in a ceramic integrated circuit package
JP2006173191A (ja) * 2004-12-13 2006-06-29 Matsushita Electric Ind Co Ltd 半導体集積回路の配線混雑度推定方法
JP2006202923A (ja) * 2005-01-19 2006-08-03 Nec Electronics Corp 半導体装置の設計方法、半導体装置の設計プログラム
WO2007003988A1 (en) * 2005-07-05 2007-01-11 Freescale Semiconductor, Inc. Device and method for compensating for voltage drops
US20070033562A1 (en) * 2005-08-05 2007-02-08 International Business Machines Corporation Integrated circuit power distribution layout with sliding grids
JP2007134468A (ja) * 2005-11-10 2007-05-31 Kawasaki Microelectronics Kk 半導体集積回路
WO2007057725A1 (en) 2005-11-15 2007-05-24 Freescale Semiconductor, Inc. Device and method for compensating for voltage drops
KR20070093335A (ko) * 2006-03-13 2007-09-18 마쯔시다덴기산교 가부시키가이샤 고체 촬상장치 및 그 구동방법
JP2007258215A (ja) * 2006-03-20 2007-10-04 Fujitsu Ltd セル配置プログラム、セル配置装置、及びセル配置方法
CN100468735C (zh) * 2006-08-25 2009-03-11 威盛电子股份有限公司 集成电路的电源地网络及其布置方法
JP2008091722A (ja) * 2006-10-03 2008-04-17 Matsushita Electric Ind Co Ltd 半導体集積回路
JP2008159736A (ja) * 2006-12-22 2008-07-10 Elpida Memory Inc 半導体装置及びその電源供給方法
US7727887B2 (en) * 2007-10-30 2010-06-01 International Business Machines Corporation Method for improved power distribution in a three dimensional vertical integrated circuit
US7701064B2 (en) * 2007-10-31 2010-04-20 International Business Machines Corporation Apparatus for improved power distribution in a three dimensional vertical integrated circuit
GB2466313A (en) * 2008-12-22 2010-06-23 Cambridge Silicon Radio Ltd Radio Frequency CMOS Transistor
KR101639618B1 (ko) * 2009-02-03 2016-07-15 삼성전자주식회사 전자 소자 모듈
JP2010283269A (ja) * 2009-06-08 2010-12-16 Renesas Electronics Corp 半導体装置
US8378491B2 (en) * 2010-08-24 2013-02-19 Infineon Technologies Ag Integrated circuit including interconnect levels
US8826216B2 (en) 2012-06-18 2014-09-02 International Business Machines Corporation Token-based current control to mitigate current delivery limitations in integrated circuits
US8863068B2 (en) 2012-06-18 2014-10-14 International Business Machines Corporation Current-aware floorplanning to overcome current delivery limitations in integrated circuits
US8826203B2 (en) * 2012-06-18 2014-09-02 International Business Machines Corporation Automating current-aware integrated circuit and package design and optimization
US8914764B2 (en) 2012-06-18 2014-12-16 International Business Machines Corporation Adaptive workload based optimizations coupled with a heterogeneous current-aware baseline design to mitigate current delivery limitations in integrated circuits
JP5939960B2 (ja) * 2012-11-09 2016-06-29 キヤノン株式会社 半導体装置、液体吐出ヘッド、液体吐出ヘッドカードリッジおよび記録装置
US8819610B2 (en) * 2013-01-09 2014-08-26 Taiwan Semiconductor Manufacturing Company, Ltd. Method and layout of an integrated circuit
KR102041265B1 (ko) * 2013-05-02 2019-11-27 삼성전자주식회사 Emi 차폐기능과 방열 기능을 가지는 반도체 패키지
US9165882B2 (en) * 2013-09-27 2015-10-20 Taiwan Semiconductor Manufacturing Co., Ltd. Power rail for preventing DC electromigration
KR102349417B1 (ko) 2015-07-16 2022-01-10 삼성전자 주식회사 전압 강하를 개선할 수 있는 구조를 갖는 반도체 장치와 이를 포함하는 장치
CN115796102B (zh) * 2021-09-10 2026-01-13 群创光电股份有限公司 具有电子组件的电子装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US149116A (en) * 1874-03-31 Improvement in rotary engines
US13790A (en) * 1855-11-13 Improvement in tobacco-presses
JPS61148834A (ja) * 1984-12-24 1986-07-07 Hitachi Ltd 半導体装置
JPS6284533A (ja) * 1985-10-08 1987-04-18 Fujitsu Ltd 半導体大規模集積回路の製造方法
JPH02268439A (ja) * 1989-04-10 1990-11-02 Hitachi Ltd 半導体集積回路装置
US5410173A (en) * 1991-01-28 1995-04-25 Kikushima; Ken'ichi Semiconductor integrated circuit device
JPH04196475A (ja) * 1990-11-28 1992-07-16 Seiko Epson Corp 半導体装置
JPH0621224A (ja) * 1991-09-13 1994-01-28 Hitachi Ltd 半導体集積回路装置
US5345394A (en) * 1992-02-10 1994-09-06 S-Mos Systems, Inc. Method for generating power slits
US5285018A (en) * 1992-10-02 1994-02-08 International Business Machines Corporation Power and signal distribution in electronic packaging
JPH06208994A (ja) * 1993-01-11 1994-07-26 Hitachi Ltd 半導体装置およびその製造方法
US5723908A (en) * 1993-03-11 1998-03-03 Kabushiki Kaisha Toshiba Multilayer wiring structure
JPH0778877A (ja) * 1993-09-08 1995-03-20 Fujitsu Ltd 半導体装置
JP3720064B2 (ja) * 1994-01-20 2005-11-24 株式会社ルネサステクノロジ 半導体集積回路
US5663677A (en) * 1995-03-30 1997-09-02 Lucent Technologies Inc. Integrated circuit multi-level interconnection technique
JPH08321551A (ja) 1995-05-26 1996-12-03 Hitachi Ltd 半導体集積回路装置およびその製造方法
US5789807A (en) * 1996-10-15 1998-08-04 International Business Machines Corporation On-chip power distribution for improved decoupling
JPH10189749A (ja) * 1996-12-27 1998-07-21 Toshiba Corp 半導体集積回路装置、半導体集積回路装置の多電源供給方法、半導体集積回路装置の多電源供給プログラムを記録した機械読み取り可能な記録媒体
US6208567B1 (en) * 1997-01-31 2001-03-27 Matsushita Electric Industrial Co., Ltd. Semiconductor device capable of cutting off a leakage current in a defective array section
US6308307B1 (en) * 1998-01-29 2001-10-23 Texas Instruments Incorporated Method for power routing and distribution in an integrated circuit with multiple interconnect layers
JP3049049B1 (ja) * 1999-03-25 2000-06-05 九州日本電気株式会社 半導体集積回路及びその試験方法
JP2000332104A (ja) * 1999-05-17 2000-11-30 Nec Corp 半導体装置およびその製造方法
US6305000B1 (en) * 1999-06-15 2001-10-16 International Business Machines Corporation Placement of conductive stripes in electronic circuits to satisfy metal density requirements
JP2001203270A (ja) * 2000-01-18 2001-07-27 Nec Corp 半導体集積回路の配線方法および半導体集積回路
US6987383B2 (en) * 2000-02-10 2006-01-17 Matsushita Electric Industrial Co., Ltd. Semiconductor device having a connection inspecting circuit for inspecting connections of power source terminals and grounding terminals, and inspection method for the same
JP3390408B2 (ja) * 2000-05-29 2003-03-24 エヌイーシーマイクロシステム株式会社 半導体集積回路
JP2001339047A (ja) * 2000-05-29 2001-12-07 Matsushita Electric Ind Co Ltd 半導体装置
US6306745B1 (en) * 2000-09-21 2001-10-23 Taiwan Semiconductor Manufacturing Company Chip-area-efficient pattern and method of hierarchal power routing
JP4748867B2 (ja) * 2001-03-05 2011-08-17 パナソニック株式会社 集積回路装置
JP5028714B2 (ja) * 2001-03-30 2012-09-19 富士通セミコンダクター株式会社 半導体集積回路装置、および配線方法
US6969420B2 (en) * 2003-12-04 2005-11-29 Industrial Technology Research Institute Method of collecting nanoparticles by using a cyclone and method of designing the cyclone

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