JP2002261245A5 - - Google Patents
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- JP2002261245A5 JP2002261245A5 JP2001060090A JP2001060090A JP2002261245A5 JP 2002261245 A5 JP2002261245 A5 JP 2002261245A5 JP 2001060090 A JP2001060090 A JP 2001060090A JP 2001060090 A JP2001060090 A JP 2001060090A JP 2002261245 A5 JP2002261245 A5 JP 2002261245A5
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001060090A JP4748867B2 (ja) | 2001-03-05 | 2001-03-05 | 集積回路装置 |
| US10/084,978 US6794674B2 (en) | 2001-03-05 | 2002-03-01 | Integrated circuit device and method for forming the same |
| US10/879,754 US7155684B2 (en) | 2001-03-05 | 2004-06-30 | Integrated circuit device and method for forming the same |
| US11/633,569 US7465974B2 (en) | 2001-03-05 | 2006-12-05 | Integrated circuit device and method for forming the same |
| US12/271,501 US7737473B2 (en) | 2001-03-05 | 2008-11-14 | Integrated circuit device and method for forming the same |
| US12/772,604 US8063417B2 (en) | 2001-03-05 | 2010-05-03 | Integrated circuit device and method for forming the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001060090A JP4748867B2 (ja) | 2001-03-05 | 2001-03-05 | 集積回路装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002261245A JP2002261245A (ja) | 2002-09-13 |
| JP2002261245A5 true JP2002261245A5 (enExample) | 2010-06-17 |
| JP4748867B2 JP4748867B2 (ja) | 2011-08-17 |
Family
ID=18919558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001060090A Expired - Lifetime JP4748867B2 (ja) | 2001-03-05 | 2001-03-05 | 集積回路装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (5) | US6794674B2 (enExample) |
| JP (1) | JP4748867B2 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6987383B2 (en) * | 2000-02-10 | 2006-01-17 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device having a connection inspecting circuit for inspecting connections of power source terminals and grounding terminals, and inspection method for the same |
| JP4748867B2 (ja) | 2001-03-05 | 2011-08-17 | パナソニック株式会社 | 集積回路装置 |
| JP4596406B2 (ja) * | 2001-08-22 | 2010-12-08 | 富士通セミコンダクター株式会社 | 集積回路の回路ブロック間自動配線設計方法及び装置並びにこの方法を実施するためのプログラム |
| US7007247B1 (en) * | 2002-05-24 | 2006-02-28 | Cadence Design Systems, Inc. | Method and mechanism for RTL power optimization |
| US7194716B2 (en) * | 2002-06-19 | 2007-03-20 | Nascentric, Inc. | Apparatus and methods for cell models for timing and power analysis |
| JP2004139181A (ja) * | 2002-10-15 | 2004-05-13 | Renesas Technology Corp | レイアウト装置及びプログラム |
| US7287324B2 (en) * | 2002-11-19 | 2007-10-30 | Cadence Design Systems, Inc. | Method, system, and article of manufacture for implementing metal-fill on an integrated circuit |
| US20040098688A1 (en) * | 2002-11-19 | 2004-05-20 | Cadence Design Systems, Inc. | Method, system, and article of manufacture for implementing long wire metal-fill |
| US7231624B2 (en) | 2002-11-19 | 2007-06-12 | Cadence Design Systems, Inc. | Method, system, and article of manufacture for implementing metal-fill with power or ground connection |
| US7328419B2 (en) * | 2002-11-19 | 2008-02-05 | Cadence Design Systems, Inc. | Place and route tool that incorporates a metal-fill mechanism |
| US20060168551A1 (en) * | 2003-06-30 | 2006-07-27 | Sanyo Electric Co., Ltd. | Integrated circuit having a multi-layer structure and design method thereof |
| JP2005197518A (ja) * | 2004-01-08 | 2005-07-21 | Matsushita Electric Ind Co Ltd | 半導体装置とセル |
| JP4287294B2 (ja) * | 2004-01-21 | 2009-07-01 | 株式会社東芝 | 自動設計方法、自動設計装置、及び半導体集積回路 |
| US7219322B2 (en) * | 2004-04-27 | 2007-05-15 | Hewlett-Packard Development Company, L.P. | Multiple propagation speeds of signals in layered circuit apparatus |
| JP2005327862A (ja) * | 2004-05-13 | 2005-11-24 | Toshiba Corp | 半導体集積回路及び半導体集積回路の設計方法 |
| US7200825B2 (en) * | 2004-08-27 | 2007-04-03 | International Business Machines Corporation | Methodology of quantification of transmission probability for minority carrier collection in a semiconductor chip |
| JP2006073955A (ja) * | 2004-09-06 | 2006-03-16 | Fujitsu Ltd | 半導体装置、設計装置、レイアウト設計方法、プログラム及び記録媒体 |
| JP4820542B2 (ja) * | 2004-09-30 | 2011-11-24 | パナソニック株式会社 | 半導体集積回路 |
| US7346869B2 (en) * | 2004-10-29 | 2008-03-18 | Synopsys, Inc. | Power network analyzer for an integrated circuit design |
| US7275222B2 (en) * | 2004-12-02 | 2007-09-25 | International Business Machines Coproation | Method, apparatus, and computer program product for enhancing a power distribution system in a ceramic integrated circuit package |
| JP2006173191A (ja) * | 2004-12-13 | 2006-06-29 | Matsushita Electric Ind Co Ltd | 半導体集積回路の配線混雑度推定方法 |
| JP2006202923A (ja) * | 2005-01-19 | 2006-08-03 | Nec Electronics Corp | 半導体装置の設計方法、半導体装置の設計プログラム |
| WO2007003988A1 (en) * | 2005-07-05 | 2007-01-11 | Freescale Semiconductor, Inc. | Device and method for compensating for voltage drops |
| US20070033562A1 (en) * | 2005-08-05 | 2007-02-08 | International Business Machines Corporation | Integrated circuit power distribution layout with sliding grids |
| JP2007134468A (ja) * | 2005-11-10 | 2007-05-31 | Kawasaki Microelectronics Kk | 半導体集積回路 |
| WO2007057725A1 (en) | 2005-11-15 | 2007-05-24 | Freescale Semiconductor, Inc. | Device and method for compensating for voltage drops |
| KR20070093335A (ko) * | 2006-03-13 | 2007-09-18 | 마쯔시다덴기산교 가부시키가이샤 | 고체 촬상장치 및 그 구동방법 |
| JP2007258215A (ja) * | 2006-03-20 | 2007-10-04 | Fujitsu Ltd | セル配置プログラム、セル配置装置、及びセル配置方法 |
| CN100468735C (zh) * | 2006-08-25 | 2009-03-11 | 威盛电子股份有限公司 | 集成电路的电源地网络及其布置方法 |
| JP2008091722A (ja) * | 2006-10-03 | 2008-04-17 | Matsushita Electric Ind Co Ltd | 半導体集積回路 |
| JP2008159736A (ja) * | 2006-12-22 | 2008-07-10 | Elpida Memory Inc | 半導体装置及びその電源供給方法 |
| US7727887B2 (en) * | 2007-10-30 | 2010-06-01 | International Business Machines Corporation | Method for improved power distribution in a three dimensional vertical integrated circuit |
| US7701064B2 (en) * | 2007-10-31 | 2010-04-20 | International Business Machines Corporation | Apparatus for improved power distribution in a three dimensional vertical integrated circuit |
| GB2466313A (en) * | 2008-12-22 | 2010-06-23 | Cambridge Silicon Radio Ltd | Radio Frequency CMOS Transistor |
| KR101639618B1 (ko) * | 2009-02-03 | 2016-07-15 | 삼성전자주식회사 | 전자 소자 모듈 |
| JP2010283269A (ja) * | 2009-06-08 | 2010-12-16 | Renesas Electronics Corp | 半導体装置 |
| US8378491B2 (en) * | 2010-08-24 | 2013-02-19 | Infineon Technologies Ag | Integrated circuit including interconnect levels |
| US8826216B2 (en) | 2012-06-18 | 2014-09-02 | International Business Machines Corporation | Token-based current control to mitigate current delivery limitations in integrated circuits |
| US8863068B2 (en) | 2012-06-18 | 2014-10-14 | International Business Machines Corporation | Current-aware floorplanning to overcome current delivery limitations in integrated circuits |
| US8826203B2 (en) * | 2012-06-18 | 2014-09-02 | International Business Machines Corporation | Automating current-aware integrated circuit and package design and optimization |
| US8914764B2 (en) | 2012-06-18 | 2014-12-16 | International Business Machines Corporation | Adaptive workload based optimizations coupled with a heterogeneous current-aware baseline design to mitigate current delivery limitations in integrated circuits |
| JP5939960B2 (ja) * | 2012-11-09 | 2016-06-29 | キヤノン株式会社 | 半導体装置、液体吐出ヘッド、液体吐出ヘッドカードリッジおよび記録装置 |
| US8819610B2 (en) * | 2013-01-09 | 2014-08-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and layout of an integrated circuit |
| KR102041265B1 (ko) * | 2013-05-02 | 2019-11-27 | 삼성전자주식회사 | Emi 차폐기능과 방열 기능을 가지는 반도체 패키지 |
| US9165882B2 (en) * | 2013-09-27 | 2015-10-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Power rail for preventing DC electromigration |
| KR102349417B1 (ko) | 2015-07-16 | 2022-01-10 | 삼성전자 주식회사 | 전압 강하를 개선할 수 있는 구조를 갖는 반도체 장치와 이를 포함하는 장치 |
| CN115796102B (zh) * | 2021-09-10 | 2026-01-13 | 群创光电股份有限公司 | 具有电子组件的电子装置 |
Family Cites Families (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US149116A (en) * | 1874-03-31 | Improvement in rotary engines | ||
| US13790A (en) * | 1855-11-13 | Improvement in tobacco-presses | ||
| JPS61148834A (ja) * | 1984-12-24 | 1986-07-07 | Hitachi Ltd | 半導体装置 |
| JPS6284533A (ja) * | 1985-10-08 | 1987-04-18 | Fujitsu Ltd | 半導体大規模集積回路の製造方法 |
| JPH02268439A (ja) * | 1989-04-10 | 1990-11-02 | Hitachi Ltd | 半導体集積回路装置 |
| US5410173A (en) * | 1991-01-28 | 1995-04-25 | Kikushima; Ken'ichi | Semiconductor integrated circuit device |
| JPH04196475A (ja) * | 1990-11-28 | 1992-07-16 | Seiko Epson Corp | 半導体装置 |
| JPH0621224A (ja) * | 1991-09-13 | 1994-01-28 | Hitachi Ltd | 半導体集積回路装置 |
| US5345394A (en) * | 1992-02-10 | 1994-09-06 | S-Mos Systems, Inc. | Method for generating power slits |
| US5285018A (en) * | 1992-10-02 | 1994-02-08 | International Business Machines Corporation | Power and signal distribution in electronic packaging |
| JPH06208994A (ja) * | 1993-01-11 | 1994-07-26 | Hitachi Ltd | 半導体装置およびその製造方法 |
| US5723908A (en) * | 1993-03-11 | 1998-03-03 | Kabushiki Kaisha Toshiba | Multilayer wiring structure |
| JPH0778877A (ja) * | 1993-09-08 | 1995-03-20 | Fujitsu Ltd | 半導体装置 |
| JP3720064B2 (ja) * | 1994-01-20 | 2005-11-24 | 株式会社ルネサステクノロジ | 半導体集積回路 |
| US5663677A (en) * | 1995-03-30 | 1997-09-02 | Lucent Technologies Inc. | Integrated circuit multi-level interconnection technique |
| JPH08321551A (ja) | 1995-05-26 | 1996-12-03 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
| US5789807A (en) * | 1996-10-15 | 1998-08-04 | International Business Machines Corporation | On-chip power distribution for improved decoupling |
| JPH10189749A (ja) * | 1996-12-27 | 1998-07-21 | Toshiba Corp | 半導体集積回路装置、半導体集積回路装置の多電源供給方法、半導体集積回路装置の多電源供給プログラムを記録した機械読み取り可能な記録媒体 |
| US6208567B1 (en) * | 1997-01-31 | 2001-03-27 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device capable of cutting off a leakage current in a defective array section |
| US6308307B1 (en) * | 1998-01-29 | 2001-10-23 | Texas Instruments Incorporated | Method for power routing and distribution in an integrated circuit with multiple interconnect layers |
| JP3049049B1 (ja) * | 1999-03-25 | 2000-06-05 | 九州日本電気株式会社 | 半導体集積回路及びその試験方法 |
| JP2000332104A (ja) * | 1999-05-17 | 2000-11-30 | Nec Corp | 半導体装置およびその製造方法 |
| US6305000B1 (en) * | 1999-06-15 | 2001-10-16 | International Business Machines Corporation | Placement of conductive stripes in electronic circuits to satisfy metal density requirements |
| JP2001203270A (ja) * | 2000-01-18 | 2001-07-27 | Nec Corp | 半導体集積回路の配線方法および半導体集積回路 |
| US6987383B2 (en) * | 2000-02-10 | 2006-01-17 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device having a connection inspecting circuit for inspecting connections of power source terminals and grounding terminals, and inspection method for the same |
| JP3390408B2 (ja) * | 2000-05-29 | 2003-03-24 | エヌイーシーマイクロシステム株式会社 | 半導体集積回路 |
| JP2001339047A (ja) * | 2000-05-29 | 2001-12-07 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| US6306745B1 (en) * | 2000-09-21 | 2001-10-23 | Taiwan Semiconductor Manufacturing Company | Chip-area-efficient pattern and method of hierarchal power routing |
| JP4748867B2 (ja) * | 2001-03-05 | 2011-08-17 | パナソニック株式会社 | 集積回路装置 |
| JP5028714B2 (ja) * | 2001-03-30 | 2012-09-19 | 富士通セミコンダクター株式会社 | 半導体集積回路装置、および配線方法 |
| US6969420B2 (en) * | 2003-12-04 | 2005-11-29 | Industrial Technology Research Institute | Method of collecting nanoparticles by using a cyclone and method of designing the cyclone |
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2001
- 2001-03-05 JP JP2001060090A patent/JP4748867B2/ja not_active Expired - Lifetime
-
2002
- 2002-03-01 US US10/084,978 patent/US6794674B2/en not_active Expired - Lifetime
-
2004
- 2004-06-30 US US10/879,754 patent/US7155684B2/en not_active Expired - Lifetime
-
2006
- 2006-12-05 US US11/633,569 patent/US7465974B2/en not_active Expired - Lifetime
-
2008
- 2008-11-14 US US12/271,501 patent/US7737473B2/en not_active Expired - Lifetime
-
2010
- 2010-05-03 US US12/772,604 patent/US8063417B2/en not_active Expired - Fee Related