JP4689159B2 - 液滴吐出システム - Google Patents

液滴吐出システム Download PDF

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Publication number
JP4689159B2
JP4689159B2 JP2003405202A JP2003405202A JP4689159B2 JP 4689159 B2 JP4689159 B2 JP 4689159B2 JP 2003405202 A JP2003405202 A JP 2003405202A JP 2003405202 A JP2003405202 A JP 2003405202A JP 4689159 B2 JP4689159 B2 JP 4689159B2
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JP
Japan
Prior art keywords
film
nozzle
composition
substrate
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003405202A
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English (en)
Japanese (ja)
Other versions
JP2005131621A5 (enExample
JP2005131621A (ja
Inventor
舜平 山崎
潤 小山
康行 荒井
慎志 前川
洋平 神野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2003405202A priority Critical patent/JP4689159B2/ja
Priority to US10/970,712 priority patent/US20050122351A1/en
Publication of JP2005131621A publication Critical patent/JP2005131621A/ja
Publication of JP2005131621A5 publication Critical patent/JP2005131621A5/ja
Priority to US13/049,078 priority patent/US8322847B2/en
Application granted granted Critical
Publication of JP4689159B2 publication Critical patent/JP4689159B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
JP2003405202A 2003-10-28 2003-10-28 液滴吐出システム Expired - Fee Related JP4689159B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003405202A JP4689159B2 (ja) 2003-10-28 2003-10-28 液滴吐出システム
US10/970,712 US20050122351A1 (en) 2003-10-28 2004-10-21 Liquid droplet ejection system and control program of ejection condition of compositions
US13/049,078 US8322847B2 (en) 2003-10-28 2011-03-16 Liquid droplet ejection system and control program of ejection condition of compositions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003405202A JP4689159B2 (ja) 2003-10-28 2003-10-28 液滴吐出システム

Publications (3)

Publication Number Publication Date
JP2005131621A JP2005131621A (ja) 2005-05-26
JP2005131621A5 JP2005131621A5 (enExample) 2006-12-21
JP4689159B2 true JP4689159B2 (ja) 2011-05-25

Family

ID=34631697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003405202A Expired - Fee Related JP4689159B2 (ja) 2003-10-28 2003-10-28 液滴吐出システム

Country Status (2)

Country Link
US (2) US20050122351A1 (enExample)
JP (1) JP4689159B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
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KR101477376B1 (ko) * 2013-03-14 2014-12-29 삼성전기주식회사 유체 토출 장치

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CN100483632C (zh) * 2003-10-28 2009-04-29 株式会社半导体能源研究所 用于制造半导体器件的方法
WO2005048223A1 (en) * 2003-11-14 2005-05-26 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
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US8053780B2 (en) * 2003-11-14 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element, method for manufacturing the same, liquid crystal display device, and method for manufacturing the same
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Also Published As

Publication number Publication date
US20110164083A1 (en) 2011-07-07
US8322847B2 (en) 2012-12-04
US20050122351A1 (en) 2005-06-09
JP2005131621A (ja) 2005-05-26

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