JP2005131621A5 - - Google Patents

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Publication number
JP2005131621A5
JP2005131621A5 JP2003405202A JP2003405202A JP2005131621A5 JP 2005131621 A5 JP2005131621 A5 JP 2005131621A5 JP 2003405202 A JP2003405202 A JP 2003405202A JP 2003405202 A JP2003405202 A JP 2003405202A JP 2005131621 A5 JP2005131621 A5 JP 2005131621A5
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JP
Japan
Prior art keywords
substrate
movement path
thin film
nozzle
setting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003405202A
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English (en)
Japanese (ja)
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JP2005131621A (ja
JP4689159B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2003405202A priority Critical patent/JP4689159B2/ja
Priority claimed from JP2003405202A external-priority patent/JP4689159B2/ja
Priority to US10/970,712 priority patent/US20050122351A1/en
Publication of JP2005131621A publication Critical patent/JP2005131621A/ja
Publication of JP2005131621A5 publication Critical patent/JP2005131621A5/ja
Priority to US13/049,078 priority patent/US8322847B2/en
Application granted granted Critical
Publication of JP4689159B2 publication Critical patent/JP4689159B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003405202A 2003-10-28 2003-10-28 液滴吐出システム Expired - Fee Related JP4689159B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003405202A JP4689159B2 (ja) 2003-10-28 2003-10-28 液滴吐出システム
US10/970,712 US20050122351A1 (en) 2003-10-28 2004-10-21 Liquid droplet ejection system and control program of ejection condition of compositions
US13/049,078 US8322847B2 (en) 2003-10-28 2011-03-16 Liquid droplet ejection system and control program of ejection condition of compositions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003405202A JP4689159B2 (ja) 2003-10-28 2003-10-28 液滴吐出システム

Publications (3)

Publication Number Publication Date
JP2005131621A JP2005131621A (ja) 2005-05-26
JP2005131621A5 true JP2005131621A5 (enExample) 2006-12-21
JP4689159B2 JP4689159B2 (ja) 2011-05-25

Family

ID=34631697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003405202A Expired - Fee Related JP4689159B2 (ja) 2003-10-28 2003-10-28 液滴吐出システム

Country Status (2)

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US (2) US20050122351A1 (enExample)
JP (1) JP4689159B2 (enExample)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7393081B2 (en) * 2003-06-30 2008-07-01 Semiconductor Energy Laboratory Co., Ltd. Droplet jetting device and method of manufacturing pattern
US8263983B2 (en) * 2003-10-28 2012-09-11 Semiconductor Energy Laboratory Co., Ltd. Wiring substrate and semiconductor device
US7446054B2 (en) * 2003-10-28 2008-11-04 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
KR101061888B1 (ko) 2003-11-14 2011-09-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 그 제조방법
WO2005048223A1 (en) * 2003-11-14 2005-05-26 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and method for manufacturing the same
WO2005048354A1 (en) * 2003-11-14 2005-05-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element, method for manufacturing the same, liquid crystal display device, and method for manufacturing the same
CN100451797C (zh) * 2003-11-14 2009-01-14 株式会社半导体能源研究所 显示装置及其制造法
KR101219038B1 (ko) * 2004-10-26 2013-01-07 삼성디스플레이 주식회사 박막 트랜지스터 표시판 및 그 제조 방법
JP3874003B2 (ja) * 2004-10-27 2007-01-31 セイコーエプソン株式会社 配線パターン形成方法、及び膜パターン形成方法
US7858451B2 (en) 2005-02-03 2010-12-28 Semiconductor Energy Laboratory Co., Ltd. Electronic device, semiconductor device and manufacturing method thereof
JP4636921B2 (ja) * 2005-03-30 2011-02-23 セイコーエプソン株式会社 表示装置の製造方法、表示装置および電子機器
JP4743393B2 (ja) * 2005-06-27 2011-08-10 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置
JP2007076156A (ja) * 2005-09-14 2007-03-29 Brother Ind Ltd プリンタ
US7756600B2 (en) 2005-09-22 2010-07-13 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
CN101300084B (zh) * 2005-10-31 2014-07-09 武藏工业株式会社 液体材料涂布装置
JP2007152339A (ja) * 2005-11-11 2007-06-21 Seiko Epson Corp 吐出方法およびカラーフィルタの製造方法、電気光学装置および電子機器
KR101229280B1 (ko) * 2005-12-28 2013-02-04 삼성디스플레이 주식회사 표시 기판과, 이의 제조 방법 및 이를 구비한 표시 패널
US20070222817A1 (en) * 2006-03-24 2007-09-27 Shinichi Kurita Methods and apparatus for inkjet printing using multiple sets of print heads
KR101184069B1 (ko) * 2006-03-29 2012-09-19 엘지디스플레이 주식회사 폴리이미드막 도포 장치 및 그 방법
KR100797093B1 (ko) * 2006-07-07 2008-01-22 한국기계연구원 나노 소자 구조물 및 이의 제조 방법
JP5085965B2 (ja) * 2007-03-30 2012-11-28 富士フイルム株式会社 樹脂膜形成方法、樹脂膜形成装置、及び電子回路基板製造方法
US8551556B2 (en) * 2007-11-20 2013-10-08 Palo Alto Research Center Incorporated Method for obtaining controlled sidewall profile in print-patterned structures
JP2010040238A (ja) * 2008-08-01 2010-02-18 Panasonic Corp プラズマディスプレイパネルの製造方法
KR20120064695A (ko) * 2009-09-03 2012-06-19 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스들을 프린트하기 위한 프린트 방법 및 관련 제어 장치
IT1398428B1 (it) * 2009-09-03 2013-02-22 Applied Materials Inc Procedimento di controllo multiplo per la stampa di uno schema multistrato e relativo impianto
US8669644B2 (en) * 2009-10-07 2014-03-11 Texas Instruments Incorporated Hydrogen passivation of integrated circuits
JP5919630B2 (ja) * 2010-07-30 2016-05-18 株式会社リコー 薄膜形成装置、薄膜形成方法、圧電素子の形成方法、及び液滴吐出ヘッドの製造方法
EP2428994A1 (en) 2010-09-10 2012-03-14 Applied Materials, Inc. Method and system for depositing a thin-film transistor
DE102011100554A1 (de) * 2010-12-21 2012-06-21 Jörg R. Bauer Verfahren und Vorrichtung zur digitalen Herstellung einer Ummantelung einer Funktionsschicht auf einer Substratoberfläche
JP5675393B2 (ja) * 2011-01-31 2015-02-25 武蔵エンジニアリング株式会社 動作プログラムの自動生成プログラムおよび装置
JP5726804B2 (ja) * 2012-04-19 2015-06-03 株式会社東芝 表示パネル及び表示装置
WO2013173401A1 (en) * 2012-05-16 2013-11-21 U.S. Coatings Ip Co. Llc Process for measuring liquid property and use thereof
US20130323434A1 (en) * 2012-05-29 2013-12-05 King Abdullah University Of Science And Technology Inkjet printing with in situ fast annealing for patterned multilayer deposition
JP6011962B2 (ja) * 2012-08-30 2016-10-25 国立研究開発法人産業技術総合研究所 パターン印刷装置、パターン印刷方法、および試験装置
US9442369B1 (en) * 2013-02-15 2016-09-13 Kla-Tencor Corporation Method and apparatus for lithographic mask production
KR101477376B1 (ko) * 2013-03-14 2014-12-29 삼성전기주식회사 유체 토출 장치
US11267012B2 (en) 2014-06-25 2022-03-08 Universal Display Corporation Spatial control of vapor condensation using convection
EP2960059B1 (en) 2014-06-25 2018-10-24 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US11220737B2 (en) * 2014-06-25 2022-01-11 Universal Display Corporation Systems and methods of modulating flow during vapor jet deposition of organic materials
US10566534B2 (en) 2015-10-12 2020-02-18 Universal Display Corporation Apparatus and method to deliver organic material via organic vapor-jet printing (OVJP)
US20220320435A1 (en) * 2019-08-13 2022-10-06 Kateeva, Inc. Systems, devices, and methods for drying material deposited on substrates for electronic device manufacturing
KR102457107B1 (ko) * 2021-01-26 2022-10-20 재단법인 오송첨단의료산업진흥재단 구조물 패키징을 위한 패키징 시스템 및 이를 이용한 구조물 패키징 방법
CN114683729B (zh) * 2022-06-01 2022-08-26 芯体素(杭州)科技发展有限公司 一种Mini-LED背光板反射层的打印方法及装置
TW202508714A (zh) * 2023-06-30 2025-03-01 日商武藏工業股份有限公司 液體塗佈方法及液體塗佈裝置

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4435674A (en) * 1981-10-05 1984-03-06 The Gerber Scientific Instrument Company Method and apparatus for generating a verified plot
US5132248A (en) * 1988-05-31 1992-07-21 The United States Of America As Represented By The United States Department Of Energy Direct write with microelectronic circuit fabrication
JP2574963B2 (ja) * 1992-01-08 1997-01-22 日立テクノエンジニアリング株式会社 ペースト塗布機
US5412410A (en) * 1993-01-04 1995-05-02 Xerox Corporation Ink jet printhead for continuous tone and text printing
US6164746A (en) * 1993-09-24 2000-12-26 Canon Kabushiki Kaisha Ink-jet printer method and apparatus, color filter, display device, apparatus having display device, ink-jet head unit adjusting device and method, and ink-jet head unit
JP3424048B2 (ja) * 1994-01-18 2003-07-07 ノードソン株式会社 被塗物にコーティング剤を塗布する方法
JPH08229478A (ja) * 1995-02-23 1996-09-10 Nec Eng Ltd ペースト塗布装置
JP3113212B2 (ja) 1996-05-09 2000-11-27 富士通株式会社 プラズマディスプレイパネルの蛍光体層形成装置および蛍光体塗布方法
CA2306384A1 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
US20020159919A1 (en) * 1998-01-09 2002-10-31 Carl Churchill Method and apparatus for high-speed microfluidic dispensing using text file control
US6063339A (en) * 1998-01-09 2000-05-16 Cartesian Technologies, Inc. Method and apparatus for high-speed dot array dispensing
JPH11340129A (ja) * 1998-05-28 1999-12-10 Seiko Epson Corp パターン製造方法およびパターン製造装置
JP3504863B2 (ja) * 1998-08-13 2004-03-08 東京エレクトロン株式会社 レジスト塗布方法及び基板処理装置
JP4477726B2 (ja) * 1999-12-09 2010-06-09 シャープ株式会社 有機led素子の製造方法
JP2001260481A (ja) * 2000-01-12 2001-09-25 Fuji Photo Film Co Ltd 記録装置
JP4182657B2 (ja) * 2000-10-17 2008-11-19 セイコーエプソン株式会社 インクジェット式記録装置
JP2002134024A (ja) * 2000-10-27 2002-05-10 Toray Ind Inc 平面ディスプレイパネルの製造方法
JP4618750B2 (ja) * 2000-11-30 2011-01-26 リソテック ジャパン株式会社 上面ベークアンドクーリング装置
WO2002099478A1 (en) * 2001-06-01 2002-12-12 Seiko Epson Corporation Color filter, display unit and electronic apparatus, and production methods for them, and production device for display unit
JP3619791B2 (ja) * 2001-06-26 2005-02-16 株式会社 日立インダストリイズ ペースト塗布機
JP3976167B2 (ja) * 2001-08-17 2007-09-12 大日本スクリーン製造株式会社 基板処理装置
GB2379413A (en) * 2001-09-10 2003-03-12 Seiko Epson Corp Printhead alignment method
JP2003158066A (ja) * 2001-11-22 2003-05-30 Seiko Epson Corp レジスト除去装置及びレジスト除去方法
JP2003159786A (ja) * 2001-11-28 2003-06-03 Seiko Epson Corp 吐出方法およびその装置、電気光学装置、その製造方法およびその製造装置、カラーフィルタ、その製造方法およびその製造装置、ならびに基材を有するデバイス、その製造方法およびその製造装置
JP4387111B2 (ja) * 2002-01-24 2009-12-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2003251245A (ja) * 2002-03-06 2003-09-09 Ricoh Co Ltd 機能性素子基板、画像表示装置およびその製造装置
JP2003260396A (ja) * 2002-03-12 2003-09-16 Seiko Epson Corp 液状体塗布方法、液滴吐出装置、及び製膜装置
JP2003282561A (ja) * 2002-03-26 2003-10-03 Seiko Epson Corp デバイスの製造方法及びデバイス製造装置
JP3894548B2 (ja) * 2002-04-23 2007-03-22 キヤノン株式会社 液体吐出ヘッドならびに前記液体吐出ヘッドを用いたヘッドカートリッジおよび画像形成装置
US6702419B2 (en) * 2002-05-03 2004-03-09 Osram Opto Semiconductors Gmbh System and method for delivering droplets
US6641251B1 (en) * 2002-07-15 2003-11-04 Hewlett-Packard Development Company, Lp. Printing system for printing in scan and print media feed directions and method of performing a printing operation
US6890050B2 (en) * 2002-08-20 2005-05-10 Palo Alto Research Center Incorporated Method for the printing of homogeneous electronic material with a multi-ejector print head
US20040077112A1 (en) * 2002-10-18 2004-04-22 Elliott Stephen J. Conductive component manufacturing process employing an ink jet printer
US7183146B2 (en) * 2003-01-17 2007-02-27 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
US7061570B2 (en) * 2003-03-26 2006-06-13 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
US7393081B2 (en) * 2003-06-30 2008-07-01 Semiconductor Energy Laboratory Co., Ltd. Droplet jetting device and method of manufacturing pattern

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