JP4624781B2 - 微小孔性研磨パッド - Google Patents
微小孔性研磨パッド Download PDFInfo
- Publication number
- JP4624781B2 JP4624781B2 JP2004507027A JP2004507027A JP4624781B2 JP 4624781 B2 JP4624781 B2 JP 4624781B2 JP 2004507027 A JP2004507027 A JP 2004507027A JP 2004507027 A JP2004507027 A JP 2004507027A JP 4624781 B2 JP4624781 B2 JP 4624781B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing pad
- polishing
- porous foam
- pad according
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/04—Condition, form or state of moulded material or of the material to be shaped cellular or porous
- B29K2105/041—Microporous
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
この実施例は均一な孔径を有する微小孔性発泡体・ロッドを製造するための方法を示す。
この実施例は本発明の研磨パッドを調製するための方法を示す。
この実施例は本発明の研磨パッドを調製するための方法を示す。
この実施例は、本発明の微小孔性発泡体研磨パッドが良好な研磨特性を有することを示す。
この実施例は、本発明の微小孔性発泡体研磨パッドが良好な研磨特性を有することを示す。
この実施例は、本発明の微小孔性発泡体研磨パッドが浸透性であり、研磨の間に研磨組成物を輸送することができることを示す。
この実施例は、本発明の微小孔性発泡体研磨パッドが従来型の独立気泡微小孔性研磨パッドに比べて優れた研磨速度を有することを示す。
この実施例は、加圧ガス注入法を用いて本発明の研磨パッドを調製するための方法を示す。
Claims (26)
- 50μm以下の平均孔径を有し、75%以上の孔が平均孔径の20μm以内の孔径を有する多孔質発泡体を含む化学機械研磨用の研磨パッドであって;
前記多孔質発泡体が、ポリマー樹脂として熱可塑性ポリウレタンを含み;該熱可塑性ポリウレタンが20以下のメルトフローインデックス、50,000g/モル〜300,000g/モルの重量平均分子量(Mw)、および1.1〜6の多分散性インデックス(PDI)を有する熱可塑性ポリウレタンである研磨パッド。 - 平均孔径が40μm以下である請求項1に記載の研磨パッド。
- 多孔質発泡体が0.5g/cm3以上の密度を有する請求項1に記載の研磨パッド。
- 多孔質発泡体が25%以下の空隙率(void volume)を有する請求項1に記載の研磨パッド。
- 多孔質発泡体が独立気泡を含む請求項1に記載の研磨パッド。
- 多孔質発泡体が105気泡/cm3以上の気泡密度を有する請求項1に記載の研磨パッド。
- 熱可塑性ポリウレタンがずり速度(γ)150l/sおよび205℃の温度で2〜8のレオロジー・プロセシング・インデックス(RPI)を有する請求項1に記載の研磨パッド。
- 熱可塑性ポリウレタンが350MPa〜1000MPaの曲げ弾性率を有する請求項1に記載の研磨パッド。
- 熱可塑性ポリウレタンが20℃〜110℃のガラス転位温度および120℃〜250℃の融解転移温度を有する請求項1に記載の研磨パッド。
- 多孔質発泡体が、更に、水吸収性ポリマーを含む請求項1に記載の研磨パッド。
- 水吸収性ポリマーが架橋ポリアクリルアミド、架橋ポリアクリル酸、架橋ポリビニルアルコール、およびそれらの組合せからなる群から選択される請求項10に記載の研磨パッド。
- 多孔質発泡体が、更に、研磨剤粒子、ポリマー粒子、複合粒子、液体キャリアに可溶な粒子、およびそれらの組合せからなる群から選択される粒子を含む請求項1に記載の研磨パッド。
- 多孔質発泡体が、更に、シリカ、アルミナ、セリア、およびそれらの組合せからなる群から選択される研磨剤粒子を含む請求項13に記載の研磨パッド。
- 平均孔径が1μm〜20μmである請求項1に記載の研磨パッド。
- 90%以上の孔が平均孔径の20μm以内の孔径を有する請求項14に記載の研磨パッド。
- 多孔質発泡体が0.5g/cm3以上の密度を有する請求項14に記載の研磨パッド。
- 多孔質発泡体が25%以下の空隙容積を有する請求項14に記載の研磨パッド。
- 多孔質発泡体が独立気泡を含む請求項14に記載の研磨パッド。
- 多孔質発泡体が105気泡/cm3以上の気泡密度を有する請求項14に記載の研磨パッド。
- 熱可塑性ポリウレタンがずり速度(γ)150l/sおよび205℃の温度で2〜8のレオロジー・プロセシング・インデックス(RPI)を有する請求項14に記載の研磨パッド。
- 熱可塑性ポリウレタンが350MPa〜1000MPaの曲げ弾性率を有する請求項14に記載の研磨パッド。
- 熱可塑性ポリウレタンが20℃〜110℃のガラス転位温度および120℃〜250℃の融解転移温度を有する請求項14に記載の研磨パッド。
- 多孔質発泡体が、更に、水吸収性ポリマーを含む請求項14に記載の研磨パッド。
- 水吸収性ポリマーが架橋ポリアクリルアミド、架橋ポリアクリル酸、架橋ポリビニルアルコール、およびそれらの組合せからなる群から選択される請求項23に記載の研磨パッド。
- 多孔質発泡体が、更に、研磨剤粒子、ポリマー粒子、複合粒子、液体キャリアに可溶な粒子、およびそれらの組合せからなる群から選択される粒子を含む請求項14に記載の研磨パッド。
- 多孔質発泡体が、更に、シリカ、アルミナ、セリア、およびそれらの組合せからなる群から選択される研磨剤粒子を含む請求項25に記載の研磨パッド。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38273902P | 2002-05-23 | 2002-05-23 | |
US10/281,782 US6913517B2 (en) | 2002-05-23 | 2002-10-28 | Microporous polishing pads |
PCT/IB2003/002123 WO2003099518A1 (en) | 2002-05-23 | 2003-05-21 | Microporous polishing pad |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009143456A Division JP5149243B2 (ja) | 2002-05-23 | 2009-06-16 | 微小孔性研磨パッド |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005532176A JP2005532176A (ja) | 2005-10-27 |
JP2005532176A5 JP2005532176A5 (ja) | 2006-08-31 |
JP4624781B2 true JP4624781B2 (ja) | 2011-02-02 |
Family
ID=29552962
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004507027A Expired - Fee Related JP4624781B2 (ja) | 2002-05-23 | 2003-05-21 | 微小孔性研磨パッド |
JP2009143456A Expired - Fee Related JP5149243B2 (ja) | 2002-05-23 | 2009-06-16 | 微小孔性研磨パッド |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009143456A Expired - Fee Related JP5149243B2 (ja) | 2002-05-23 | 2009-06-16 | 微小孔性研磨パッド |
Country Status (8)
Country | Link |
---|---|
US (4) | US6913517B2 (ja) |
EP (1) | EP1509364B1 (ja) |
JP (2) | JP4624781B2 (ja) |
KR (1) | KR100790217B1 (ja) |
CN (3) | CN100377837C (ja) |
AU (1) | AU2003228036A1 (ja) |
TW (1) | TW590853B (ja) |
WO (1) | WO2003099518A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230121042A (ko) | 2020-12-25 | 2023-08-17 | 후지보 홀딩스 가부시키가이샤 | 연마 패드, 그 제조 방법 및 연마 가공물의 제조 방법, 및 랩핑 패드, 그 제조 방법 및 랩 가공물의 제조 방법 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20230121042A (ko) | 2020-12-25 | 2023-08-17 | 후지보 홀딩스 가부시키가이샤 | 연마 패드, 그 제조 방법 및 연마 가공물의 제조 방법, 및 랩핑 패드, 그 제조 방법 및 랩 가공물의 제조 방법 |
Also Published As
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TW590853B (en) | 2004-06-11 |
AU2003228036A1 (en) | 2003-12-12 |
CN100377837C (zh) | 2008-04-02 |
US20040177563A1 (en) | 2004-09-16 |
US6896593B2 (en) | 2005-05-24 |
CN102189506B (zh) | 2013-03-13 |
CN101219531B (zh) | 2011-05-04 |
CN101219531A (zh) | 2008-07-16 |
JP2005532176A (ja) | 2005-10-27 |
US20040171340A1 (en) | 2004-09-02 |
JP2009274208A (ja) | 2009-11-26 |
US6935931B2 (en) | 2005-08-30 |
US6899598B2 (en) | 2005-05-31 |
US20030220061A1 (en) | 2003-11-27 |
EP1509364B1 (en) | 2013-09-04 |
US6913517B2 (en) | 2005-07-05 |
JP5149243B2 (ja) | 2013-02-20 |
CN102189506A (zh) | 2011-09-21 |
KR20050004184A (ko) | 2005-01-12 |
TW200404648A (en) | 2004-04-01 |
WO2003099518A1 (en) | 2003-12-04 |
KR100790217B1 (ko) | 2007-12-31 |
US20040171338A1 (en) | 2004-09-02 |
CN1671509A (zh) | 2005-09-21 |
EP1509364A1 (en) | 2005-03-02 |
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