CN115008852B - 一种用于晶体抛光的多孔阻尼布及其制备工艺 - Google Patents
一种用于晶体抛光的多孔阻尼布及其制备工艺 Download PDFInfo
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Abstract
本发明公开了一种用于晶体抛光的多孔阻尼布及其制备工艺,属于晶体抛光技术领域,包括阻尼布面层、热熔胶粘接层和阻尼布基层,所述阻尼布面层的底部设置有热熔胶粘接层,所述热熔胶粘接层的底部设置有阻尼布基层,所述阻尼布面层上设置有均匀分布的抛光微孔,抛光微孔的直径为30‑38μm。为了解决硬度和耐磨性差且使用寿命低下的问题,本发明的用于晶体抛光的多孔阻尼布及其制备工艺,采用环氧树脂、聚四氟乙烯、石墨、Cr、分散剂和催化剂制备阻尼布面层,且将阻尼布面层、热熔胶粘接层和阻尼布基层热压制得多孔阻尼布,采用该种方式制备的多孔阻尼布可提高多孔阻尼布的硬度及耐磨性,提升抛光效果,延长多孔阻尼布的使用寿命。
Description
技术领域
本发明涉及晶体抛光技术领域,特别涉及一种用于晶体抛光的多孔阻尼布及其制备工艺。
背景技术
目前,在蓝宝石晶片抛光尤其是精抛工艺中,普遍采用贴蜡工艺,而贴蜡工艺需经过贴蜡前加热、上蜡贴片和下蜡等步骤;其操作步骤多,工艺流程复杂,操作环境脏污多,不易清洗,公开号为CN104889874B的中国专利公开了一种蓝宝石抛光用吸附垫,所述吸附垫从其厚度方向的一端至另一端依次包括阻尼布层、热熔胶层和环氧树脂板层;所述阻尼布层厚度为0.2-0.4mm,热熔胶层厚度为0.05-0.15mm,环氧树脂板层厚度为0.15-2.0mm;且所述热熔胶层和环氧树脂板层上均开设有与待抛光的蓝宝石基片尺寸匹配的多个通孔。本发明还提供一种吸附垫的制备方法,包括预贴合、冲压开孔、热压贴合并冷却和裁剪步骤。本发明提供的吸附垫使用寿命长,且用于加工蓝宝石产品的抛光良率高,产品的生产工艺简化。本发明提供的制备方法工艺简单,可以制作不同厚度、不同通孔尺寸的产品,制作过程中参数设定范围广,可以大批量生产。但是上述专利在对晶体抛光时,其存在硬度和耐磨性差且使用寿命低下的缺陷。
发明内容
本发明的目的在于提供一种用于晶体抛光的多孔阻尼布及其制备工艺,采用环氧树脂、聚四氟乙烯、石墨、Cr、分散剂和催化剂制备阻尼布面层,且将阻尼布面层、热熔胶粘接层和阻尼布基层热压制得多孔阻尼布,采用该种方式制备的多孔阻尼布可提高多孔阻尼布的硬度及耐磨性,提升抛光效果,延长多孔阻尼布的使用寿命,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:
一种用于晶体抛光的多孔阻尼布,包括阻尼布面层、热熔胶粘接层和阻尼布基层,所述阻尼布面层的底部设置有热熔胶粘接层,所述热熔胶粘接层的底部设置有阻尼布基层,所述阻尼布面层上设置有均匀分布的抛光微孔,抛光微孔的直径为30-38μm。
进一步地,所述阻尼布面层包括如下质量份数的原料:
环氧树脂:24-36份;聚四氟乙烯:12-18份;石墨:4-10份;Cr:6-14份;分散剂:3-8份;催化剂:2-6份。
进一步地,所述分散剂为乙烯基双硬脂酰胺、三硬脂酸甘油酯、聚乙烯蜡中的一种或两种,所述催化剂为过氧化氢或高锰酸钾中的一种。
进一步地,所述阻尼布面层的制备工艺包括:将环氧树脂、聚四氟乙烯、石墨和Cr加入混料机内,通过高速旋转的搅拌叶片对原料进行充分地混合,使其混合均匀,之后再向混料机内加入分散剂和催化剂,使原料均一分散和快速催化反应,原料反应融合后,将原料投入挤压机内,通过旋转的挤压辊对原料进行挤压成片。
进一步地,所述混料机的混料转速为1200-1600r/min,混料时间为20-30min。
进一步地,所述阻尼布基层包括耐磨底层、稳固中层和附着表层,所述耐磨底层的表面设置有稳固中层,所述稳固中层的表面设置有附着表层,所述耐磨底层、稳固中层和附着表层的厚度比为1:0.9:1.2,所述耐磨底层采用聚氨酯材质且纵横交叉编制而成。
进一步地,所述稳固中层内置有储气仓、支撑筋管和连通导管,所述储气仓安装在稳固中层的内侧且储气仓的两侧面设置有支撑筋管,所述支撑筋管用于支撑稳固中层,等间距分布的支撑筋管连通在储气仓上,相邻的支撑筋管之间通过连通导管连接导通,所述支撑筋管上设置有等间距分布的溢气孔。
进一步地,所述储气仓上设置有进气接口,所述进气接口处设置有防止漏气的单向阀。
进一步地,所述阻尼布面层、热熔胶粘接层和阻尼布基层的厚度比为1:0.1:0.9。
根据本发明的另一个方面,提供了一种用于晶体抛光的多孔阻尼布的制备工艺,包括如下步骤:
S1:将热熔胶粘接层和阻尼布基层分别装在不同的放卷轴上,放卷轴放卷热熔胶粘接层和阻尼布基层,热熔胶粘接层和阻尼布基层经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.4-0.5MPa,热压温度为121-124℃,热压时间为16-28s,制成半成品阻尼布;
S2:将半成品阻尼布和阻尼布面层分别装在不同的放卷轴上,放卷轴放卷半成品阻尼布和阻尼布面层,半成品阻尼布和阻尼布面层经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.7-0.8MPa,热压温度为121-124℃,热压时间为26-42s,热压后降温至室温,制得多孔阻尼布。
与现有技术相比,本发明的有益效果是:
1、本发明的用于晶体抛光的多孔阻尼布及其制备工艺,采用环氧树脂、聚四氟乙烯、石墨、Cr、分散剂和催化剂制备阻尼布面层,且将热熔胶粘接层和阻尼布基层分别装在不同的放卷轴上,放卷轴放卷热熔胶粘接层和阻尼布基层,热熔胶粘接层和阻尼布基层经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.4-0.5MPa,热压温度为121-124℃,热压时间为16-28s,制成半成品阻尼布,将半成品阻尼布和阻尼布面层分别装在不同的放卷轴上,放卷轴放卷半成品阻尼布和阻尼布面层,半成品阻尼布和阻尼布面层经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.7-0.8MPa,热压温度为121-124℃,热压时间为26-42s,热压后降温至室温,制得多孔阻尼布,采用该种方式制备的多孔阻尼布可提高多孔阻尼布的硬度及耐磨性,提升抛光效果,延长多孔阻尼布的使用寿命。
2、本发明的用于晶体抛光的多孔阻尼布及其制备工艺,通过纵横交错的支撑筋管和连通导管可形成支撑网,用于支撑多孔阻尼布,提高多孔阻尼布的硬度,且多孔阻尼布在对晶体抛光时,通过进气接口向储气仓内充气,且储气仓内的气体引流至支撑筋管内,且通过溢气孔排出,可张紧多孔阻尼布,避免多孔阻尼布松弛,提高多孔阻尼布的抛光效果。
附图说明
图1为本发明的用于晶体抛光的多孔阻尼布的结构图;
图2为本发明的阻尼布基层的结构图;
图3为本发明的多孔阻尼布制备方法的流程图;
图4为本发明的稳固中层的剖面示意图;
图5为本发明的储气仓上设置支撑筋管的侧向示意图;
图6为本发明的储气仓上设置支撑筋管的俯视图;
图7为本发明的储气仓上设置支撑筋管的仰视图。
图中:1、阻尼布面层;2、热熔胶粘接层;3、阻尼布基层;31、耐磨底层;32、稳固中层;321、储气仓;3211、进气接口;322、支撑筋管;3221、溢气孔;323、连通导管;33、附着表层。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例一
参阅图1,一种用于晶体抛光的多孔阻尼布,包括阻尼布面层1、热熔胶粘接层2和阻尼布基层3,阻尼布面层1的底部设置有热熔胶粘接层2,热熔胶粘接层2的底部设置有阻尼布基层3,阻尼布面层1、热熔胶粘接层2和阻尼布基层3的厚度比为1:0.1:0.9,阻尼布面层1上设置有均匀分布的抛光微孔,抛光微孔的直径为30-38μm。
阻尼布面层1包括如下质量份数的原料:
环氧树脂:24份;聚四氟乙烯:12份;石墨:4份;Cr:6份;分散剂:3份;催化剂:2份。
分散剂为乙烯基双硬脂酰胺。
分散剂是一种在分子内同时具有亲油性和亲水性两种相反性质的界面活性剂,可均一分散那些难于溶解于液体的无机、有机颜料的固体及液体颗粒,同时也能防止颗粒的沉降和凝聚,形成安定悬浮液所需的两亲性试剂,提升光泽,增加流平效果,防止浮色发花,提高着色力,降低粘度,增加颜料载入量,减少絮凝,增加贮藏稳定性,增加展色性,增加颜色饱和度、增加透明度或遮盖力。
催化剂为过氧化氢。
催化剂是指一种在不改变反应总标准吉布斯自由能变化的情况下提高反应速率的物质,也可以表述为在化学反应里能提高化学反应速率而不改变化学平衡,且本身的质量和化学性质在化学反应前后都没有发生改变的物质。
阻尼布面层1的制备工艺包括:将环氧树脂、聚四氟乙烯、石墨和Cr加入混料机内,通过高速旋转的搅拌叶片对原料进行充分地混合,使其混合均匀,之后再向混料机内加入分散剂和催化剂,使原料均一分散和快速催化反应,原料反应融合后,将原料投入挤压机内,通过旋转的挤压辊对原料进行挤压成片。
混料机的混料转速为1200-1600r/min,混料时间为20-30min。
参阅图2,阻尼布基层3包括耐磨底层31、稳固中层32和附着表层33,耐磨底层31的表面设置有稳固中层32,稳固中层32的表面设置有附着表层33,耐磨底层31、稳固中层32和附着表层33的厚度比为1:0.9:1.2。
耐磨底层31采用聚氨酯材质且纵横交叉编制而成。
参阅图3,为了更好的展现用于晶体抛光的多孔阻尼布的制备流程,本实施例现提出一种用于晶体抛光的多孔阻尼布的制备方法,包括如下步骤:
S1:将热熔胶粘接层2和阻尼布基层3分别装在不同的放卷轴上,放卷轴放卷热熔胶粘接层2和阻尼布基层3,热熔胶粘接层2和阻尼布基层3经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.4-0.5MPa,热压温度为121-124℃,热压时间为16-28s,制成半成品阻尼布;
S2:将半成品阻尼布和阻尼布面层1分别装在不同的放卷轴上,放卷轴放卷半成品阻尼布和阻尼布面层1,半成品阻尼布和阻尼布面层1经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.7-0.8MPa,热压温度为121-124℃,热压时间为26-42s,热压后降温至室温,制得多孔阻尼布。
实施例二
参阅图1,一种用于晶体抛光的多孔阻尼布,包括阻尼布面层1、热熔胶粘接层2和阻尼布基层3,阻尼布面层1的底部设置有热熔胶粘接层2,热熔胶粘接层2的底部设置有阻尼布基层3,阻尼布面层1、热熔胶粘接层2和阻尼布基层3的厚度比为1:0.1:0.9,阻尼布面层1上设置有均匀分布的抛光微孔,抛光微孔的直径为30-38μm。
阻尼布面层1包括如下质量份数的原料:
环氧树脂:24份;聚四氟乙烯:12份;石墨:4份;Cr:14份;分散剂:3份;催化剂:2份。
分散剂为三硬脂酸甘油酯。
催化剂为过氧化氢。
阻尼布面层1的制备工艺包括:将环氧树脂、聚四氟乙烯、石墨和Cr加入混料机内,通过高速旋转的搅拌叶片对原料进行充分地混合,使其混合均匀,之后再向混料机内加入分散剂和催化剂,使原料均一分散和快速催化反应,原料反应融合后,将原料投入挤压机内,通过旋转的挤压辊对原料进行挤压成片。
混料机的混料转速为1200-1600r/min,混料时间为20-30min。
参阅图2,阻尼布基层3包括耐磨底层31、稳固中层32和附着表层33,耐磨底层31的表面设置有稳固中层32,稳固中层32的表面设置有附着表层33,耐磨底层31、稳固中层32和附着表层33的厚度比为1:0.9:1.2。
耐磨底层31采用聚氨酯材质且纵横交叉编制而成。
实施例三
参阅图1,一种用于晶体抛光的多孔阻尼布,包括阻尼布面层1、热熔胶粘接层2和阻尼布基层3,阻尼布面层1的底部设置有热熔胶粘接层2,热熔胶粘接层2的底部设置有阻尼布基层3,阻尼布面层1、热熔胶粘接层2和阻尼布基层3的厚度比为1:0.1:0.9,阻尼布面层1上设置有均匀分布的抛光微孔,抛光微孔的直径为30-38μm。
阻尼布面层1包括如下质量份数的原料:
环氧树脂:24份;聚四氟乙烯:18份;石墨:4份;Cr:6份;分散剂:3份;催化剂:2份。
分散剂为聚乙烯蜡。
催化剂为高锰酸钾。
阻尼布面层1的制备工艺包括:将环氧树脂、聚四氟乙烯、石墨和Cr加入混料机内,通过高速旋转的搅拌叶片对原料进行充分地混合,使其混合均匀,之后再向混料机内加入分散剂和催化剂,使原料均一分散和快速催化反应,原料反应融合后,将原料投入挤压机内,通过旋转的挤压辊对原料进行挤压成片。
混料机的混料转速为1200-1600r/min,混料时间为20-30min。
参阅图2,阻尼布基层3包括耐磨底层31、稳固中层32和附着表层33,耐磨底层31的表面设置有稳固中层32,稳固中层32的表面设置有附着表层33,耐磨底层31、稳固中层32和附着表层33的厚度比为1:0.9:1.2。
耐磨底层31采用聚氨酯材质且纵横交叉编制而成。
实施例四
参阅图1,一种用于晶体抛光的多孔阻尼布,包括阻尼布面层1、热熔胶粘接层2和阻尼布基层3,阻尼布面层1的底部设置有热熔胶粘接层2,热熔胶粘接层2的底部设置有阻尼布基层3,阻尼布面层1、热熔胶粘接层2和阻尼布基层3的厚度比为1:0.1:0.9,阻尼布面层1上设置有均匀分布的抛光微孔,抛光微孔的直径为30-38μm。
阻尼布面层1包括如下质量份数的原料:
环氧树脂:24份;聚四氟乙烯:18份;石墨:10份;Cr:6份;分散剂:3份;催化剂:2份。
分散剂为三硬脂酸甘油酯。
催化剂为高锰酸钾。
阻尼布面层1的制备工艺包括:将环氧树脂、聚四氟乙烯、石墨和Cr加入混料机内,通过高速旋转的搅拌叶片对原料进行充分地混合,使其混合均匀,之后再向混料机内加入分散剂和催化剂,使原料均一分散和快速催化反应,原料反应融合后,将原料投入挤压机内,通过旋转的挤压辊对原料进行挤压成片。
混料机的混料转速为1200-1600r/min,混料时间为20-30min。
参阅图2,阻尼布基层3包括耐磨底层31、稳固中层32和附着表层33,耐磨底层31的表面设置有稳固中层32,稳固中层32的表面设置有附着表层33,耐磨底层31、稳固中层32和附着表层33的厚度比为1:0.9:1.2。
耐磨底层31采用聚氨酯材质且纵横交叉编制而成。
实施例五
参阅图1,一种用于晶体抛光的多孔阻尼布,包括阻尼布面层1、热熔胶粘接层2和阻尼布基层3,阻尼布面层1的底部设置有热熔胶粘接层2,热熔胶粘接层2的底部设置有阻尼布基层3,阻尼布面层1、热熔胶粘接层2和阻尼布基层3的厚度比为1:0.1:0.9,阻尼布面层1上设置有均匀分布的抛光微孔,抛光微孔的直径为30-38μm。
阻尼布面层1包括如下质量份数的原料:
环氧树脂:24份;聚四氟乙烯:12份;石墨:10份;Cr:6份;分散剂:3份;催化剂:2份。
分散剂为乙烯基双硬脂酰胺。
催化剂为过氧化氢。
阻尼布面层1的制备工艺包括:将环氧树脂、聚四氟乙烯、石墨和Cr加入混料机内,通过高速旋转的搅拌叶片对原料进行充分地混合,使其混合均匀,之后再向混料机内加入分散剂和催化剂,使原料均一分散和快速催化反应,原料反应融合后,将原料投入挤压机内,通过旋转的挤压辊对原料进行挤压成片。
混料机的混料转速为1200-1600r/min,混料时间为20-30min。
参阅图2,阻尼布基层3包括耐磨底层31、稳固中层32和附着表层33,耐磨底层31的表面设置有稳固中层32,稳固中层32的表面设置有附着表层33,耐磨底层31、稳固中层32和附着表层33的厚度比为1:0.9:1.2。
耐磨底层31采用聚氨酯材质且纵横交叉编制而成。
对比例一
一种多孔阻尼布,包括阻尼布面层1、热熔胶粘接层2和阻尼布基层3,阻尼布面层1包括如下质量份数的原料:
环氧树脂:24份;聚四氟乙烯:12份;石墨:4份;分散剂:3份;催化剂:2份。
对比例二
一种多孔阻尼布,包括阻尼布面层1、热熔胶粘接层2和阻尼布基层3,阻尼布面层1包括如下质量份数的原料:
环氧树脂:24份;Cr:6份;分散剂:3份;催化剂:2份。
按照实施例1-5及对比例1-2的质量份数的原料制备多孔阻尼布,且对制备的多孔阻尼布进行性能测试,其测试情况如下:
1、硬度性能测试:
硬度性能测试规定在10-35℃的室温下进行,试样平稳地放置在刚性支承物上,并使压头轴线与试样表面垂直,使压头与试样表面接触,在无冲击和振动的情况下施加试验力,初试验力保持不应超过3秒,将测在不小于1s且不大于8s的时间内,从初试验力增加到总试验力,并保持4s±2s,然后卸除主试验力,保持初试验力,经过短暂稳定后,进行读数,为了读数准确,在试验过程中,硬度计应避免受到任何冲击和震动,在多处取值时,两相邻压痕中心间距离至少应为压痕直径的4倍,但不得小于2mm,任一压痕中心距试样边缘距离至少应为压痕直径的2.5倍,但不得小于1mm,根据h值及常数N和S计算洛氏硬度,其中洛氏硬度=N-h/S,根据测试情况记录多孔阻尼布的硬度,如表1所示:
表1:硬度性能测试
按照实施例1-5的质量份数的原料制备的多孔阻尼布,相对于按照对比例1的质量份数的原料制备的多孔阻尼布,其硬度强,Cr原料的添加可明显提高多孔阻尼布的硬度。
2、耐磨性能测试:
称重法测量磨损试验前后试样重量变化,其差数即为磨损量,磨损量W=G1-G2,式中:W为试样磨损量;G1为磨损试验前的试样重量;G2为磨损试验后的试样重量;并记录试样的磨损量,如表2所示:
表2:耐磨性能测试
按照实施例1-5的质量份数的原料制备的多孔阻尼布,相对于按照对比例2的质量份数的原料制备的多孔阻尼布,其耐磨性能好,聚四氟乙烯和石墨的添加可明显提高多孔阻尼布的耐磨性能。
实施例六
参阅图4-图7,稳固中层32内置有储气仓321、支撑筋管322和连通导管323,储气仓321安装在稳固中层32的内侧且储气仓321的两侧面设置有支撑筋管322,支撑筋管322用于支撑稳固中层32,等间距分布的支撑筋管322连通在储气仓321上,相邻的支撑筋管322之间通过连通导管323连接导通,支撑筋管322上设置有等间距分布的溢气孔3221,储气仓321上设置有进气接口3211,进气接口3211处设置有防止漏气的单向阀。
通过纵横交错的支撑筋管322和连通导管323可形成支撑网,用于支撑多孔阻尼布,提高多孔阻尼布的硬度,且多孔阻尼布在对晶体抛光时,通过进气接口3211向储气仓321内充气,且储气仓321内的气体引流至支撑筋管322内,且通过溢气孔3221排出,可张紧多孔阻尼布,避免多孔阻尼布松弛,提高多孔阻尼布的抛光效果。
综上所述,本发明的用于晶体抛光的多孔阻尼布及其制备工艺,采用环氧树脂、聚四氟乙烯、石墨、Cr、分散剂和催化剂制备阻尼布面层1,且将热熔胶粘接层2和阻尼布基层3分别装在不同的放卷轴上,放卷轴放卷热熔胶粘接层2和阻尼布基层3,热熔胶粘接层2和阻尼布基层3经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.4-0.5MPa,热压温度为121-124℃,热压时间为16-28s,制成半成品阻尼布,将半成品阻尼布和阻尼布面层1分别装在不同的放卷轴上,放卷轴放卷半成品阻尼布和阻尼布面层1,半成品阻尼布和阻尼布面层1经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.7-0.8MPa,热压温度为121-124℃,热压时间为26-42s,热压后降温至室温,制得多孔阻尼布,采用该种方式制备的多孔阻尼布可提高多孔阻尼布的硬度及耐磨性,提升抛光效果,延长多孔阻尼布的使用寿命,且通过纵横交错的支撑筋管322和连通导管323可形成支撑网,用于支撑多孔阻尼布,提高多孔阻尼布的硬度,且多孔阻尼布在对晶体抛光时,通过进气接口3211向储气仓321内充气,且储气仓321内的气体引流至支撑筋管322内,且通过溢气孔3221排出,可张紧多孔阻尼布,避免多孔阻尼布松弛,提高多孔阻尼布的抛光效果。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明披露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。
Claims (5)
1.一种用于晶体抛光的多孔阻尼布,包括阻尼布面层(1)、热熔胶粘接层(2)和阻尼布基层(3),其特征在于,所述阻尼布面层(1)的底部设置有热熔胶粘接层(2),所述热熔胶粘接层(2)的底部设置有阻尼布基层(3),所述阻尼布面层(1)上设置有均匀分布的抛光微孔,抛光微孔的直径为30-38μm;
所述阻尼布面层(1)包括如下质量份数的原料:
环氧树脂:24-36份;聚四氟乙烯:12-18份;石墨:4-10份;Cr:6-14份;分散剂:3-8份;催化剂:2-6份;
所述阻尼布面层(1)的制备工艺包括:将环氧树脂、聚四氟乙烯、石墨和Cr加入混料机内,通过高速旋转的搅拌叶片对原料进行充分地混合,使其混合均匀,之后再向混料机内加入分散剂和催化剂,使原料均一分散和快速催化反应,原料反应融合后,将原料投入挤压机内,通过旋转的挤压辊对原料进行挤压成片;
所述阻尼布基层(3)包括耐磨底层(31)、稳固中层(32)和附着表层(33),所述耐磨底层(31)的表面设置有稳固中层(32),所述稳固中层(32)的表面设置有附着表层(33),所述耐磨底层(31)、稳固中层(32)和附着表层(33)的厚度比为1:0.9:1.2,所述耐磨底层(31)采用聚氨酯材质且纵横交叉编制而成;
所述稳固中层(32)内置有储气仓(321)、支撑筋管(322)和连通导管(323),所述储气仓(321)安装在稳固中层(32)的内侧且储气仓(321)的两侧面设置有支撑筋管(322),所述支撑筋管(322)用于支撑稳固中层(32),等间距分布的支撑筋管(322)连通在储气仓(321)上,相邻的支撑筋管(322)之间通过连通导管(323)连接导通,所述支撑筋管(322)上设置有等间距分布的溢气孔(3221),所述储气仓(321)上设置有进气接口(3211),所述进气接口(3211)处设置有防止漏气的单向阀。
2.如权利要求1所述的一种用于晶体抛光的多孔阻尼布,其特征在于,所述分散剂为乙烯基双硬脂酰胺、三硬脂酸甘油酯、聚乙烯蜡中的一种或两种,所述催化剂为过氧化氢或高锰酸钾中的一种。
3.如权利要求2所述的一种用于晶体抛光的多孔阻尼布,其特征在于,所述混料机的混料转速为1200-1600r/min,混料时间为20-30min。
4.如权利要求3所述的一种用于晶体抛光的多孔阻尼布,其特征在于,所述阻尼布面层(1)、热熔胶粘接层(2)和阻尼布基层(3)的厚度比为1:0.1:0.9。
5.一种如权利要求4所述的用于晶体抛光的多孔阻尼布的制备工艺,其特征在于,包括如下步骤:
S1:将热熔胶粘接层(2)和阻尼布基层(3)分别装在不同的放卷轴上,放卷轴放卷热熔胶粘接层(2)和阻尼布基层(3),热熔胶粘接层(2)和阻尼布基层(3)经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.4-0.5MPa,热压温度为121-124℃,热压时间为16-28s,制成半成品阻尼布;
S2:将半成品阻尼布和阻尼布面层(1)分别装在不同的放卷轴上,放卷轴放卷半成品阻尼布和阻尼布面层(1),半成品阻尼布和阻尼布面层(1)经过挤压辊挤压后送至热压机的工作台上,经过热压机对其进行热压,热压压力为0.7-0.8MPa,热压温度为121-124℃,热压时间为26-42s,热压后降温至室温,制得多孔阻尼布。
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