JP6149286B2 - 研磨パッド - Google Patents
研磨パッド Download PDFInfo
- Publication number
- JP6149286B2 JP6149286B2 JP2012232997A JP2012232997A JP6149286B2 JP 6149286 B2 JP6149286 B2 JP 6149286B2 JP 2012232997 A JP2012232997 A JP 2012232997A JP 2012232997 A JP2012232997 A JP 2012232997A JP 6149286 B2 JP6149286 B2 JP 6149286B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polishing pad
- polyimide resin
- polished
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims description 214
- 229920001721 polyimide Polymers 0.000 claims description 59
- 239000009719 polyimide resin Substances 0.000 claims description 59
- 239000003822 epoxy resin Substances 0.000 claims description 23
- 229920000647 polyepoxide Polymers 0.000 claims description 23
- 239000002002 slurry Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 14
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 13
- 239000011148 porous material Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 15
- 239000004745 nonwoven fabric Substances 0.000 description 15
- 239000010410 layer Substances 0.000 description 13
- 239000011521 glass Substances 0.000 description 12
- 239000006061 abrasive grain Substances 0.000 description 11
- 239000000835 fiber Substances 0.000 description 9
- 230000014759 maintenance of location Effects 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 5
- 229920005749 polyurethane resin Polymers 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000004088 foaming agent Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
実施例1は、図2に示すようなスエードタイプ研磨パッドBELLATRIX(FILWEL社製)の表面にポリイミド樹脂を塗布厚さが100μmになるように塗布して作製した研磨パッドである。そして、この研磨パッドを用いて、ソーダガラスの研磨加工を行った。研磨条件については、以下に示すような条件で研磨を行った。
(研磨条件)
研磨装置:片面ラッピング装置NP−300(ナノファクタ社製)
定盤径:直径200mm
ワーク:ソーダガラス(直径20mm、厚さ10mm、粗さ0.4μmRa)
研磨スラリー:酸化セリウムを3wt%水に懸濁したスラリー
スラリー流量:25mL/min
研磨圧力:20kPa
研磨定盤回転数:90rpm
ワークホルダー回転数:90rpm
研磨時間:30min
比較例1では、未処理の状態のスエードタイプ研磨パッドBELLATRIX(FILWEL社製)を用いて、実施例1と同様の条件にてソーダガラスの研磨を行った。
比較例2では、スエードタイプ研磨パッドBELLATRIX(FILWEL社製)の表面にフッ素樹脂を塗布厚さが20μmになるように塗布して作製した研磨パッドを用いて、実施例1と同様の条件にてソーダガラスの研磨を行った。
また、比較例3では、スエードタイプ研磨パッドBELLATRIX(FILWEL社製)の表面にエポキシ樹脂を塗布厚さが60μmになるように塗布して作製した研磨パッドを用いて、実施例1と同様の条件にてソーダガラスの研磨を行った。
2 基材(ポリイミド樹脂)
3 気孔
4 基材
5 ナップ層
6 ポリイミド樹脂膜
Claims (3)
- 被研磨物との間に研磨材が分散された研磨スラリーを供給しながら前記被研磨物を研磨するための研磨パッドであって、当該研磨パッドの基材が、前記ポリイミド樹脂で形成され、A硬度が70〜98°の範囲内で、且つ、発泡倍率が10〜60%で表面に直径が0.01〜3.00mmの多数の気孔が形成された多孔質な薄形円柱状であることを特徴とする研磨パッド。
- 被研磨物との間に研磨材が分散された研磨スラリーを供給しながら前記被研磨物を研磨するための研磨パッドであって、当該研磨パッドの基材が、前記ポリイミド樹脂、及びエポキシ樹脂又はウレタン樹脂の混合物で形成され、この内、前記ポリイミド樹脂の混合割合が40〜95であり、A硬度が70〜98°の範囲内で、且つ、発泡倍率が10〜60%で表面に直径が0.01〜3.00mmの多数の気孔が形成された多孔質な薄形円柱状であることを特徴とする研磨パッド。
- 被研磨物との間に研磨材が分散された研磨スラリーを供給しながら前記被研磨物を研磨するための研磨パッドであって、繊維により構成される不織布、該不織布にウレタン樹脂等を含浸させたウレタン含浸不織布、又は樹脂フィルム等からなる当該研磨パッドの基材上の厚さ方向に細長く多数の縦穴が形成されてなるナップ層に厚さが60μm以上のポリイミド樹脂膜が形成されてなることを特徴とする研磨パッド。」
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012232997A JP6149286B2 (ja) | 2012-10-22 | 2012-10-22 | 研磨パッド |
Applications Claiming Priority (1)
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---|---|---|---|
JP2012232997A JP6149286B2 (ja) | 2012-10-22 | 2012-10-22 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014083617A JP2014083617A (ja) | 2014-05-12 |
JP6149286B2 true JP6149286B2 (ja) | 2017-06-21 |
Family
ID=50787197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2012232997A Expired - Fee Related JP6149286B2 (ja) | 2012-10-22 | 2012-10-22 | 研磨パッド |
Country Status (1)
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JP (1) | JP6149286B2 (ja) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2816865B2 (ja) * | 1989-07-25 | 1998-10-27 | 市川毛織株式会社 | 研磨用ニードルフェルト |
JP2616736B2 (ja) * | 1995-01-25 | 1997-06-04 | 日本電気株式会社 | ウエーハ研磨装置 |
JPH10249737A (ja) * | 1997-03-14 | 1998-09-22 | Nikon Corp | 磁気記録媒体用基板の研磨用パッド及び研磨方法 |
JP2002086343A (ja) * | 2000-09-11 | 2002-03-26 | Nitto Denko Corp | 研磨パッド |
JP2003025215A (ja) * | 2001-07-10 | 2003-01-29 | Unitika Ltd | 研磨用不織布並びに研磨シート |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
JP4621014B2 (ja) * | 2004-12-10 | 2011-01-26 | 東洋ゴム工業株式会社 | 研磨パッドおよび半導体デバイスの製造方法 |
JP2010149259A (ja) * | 2008-12-26 | 2010-07-08 | Nitta Haas Inc | 研磨布 |
JP2012101298A (ja) * | 2010-11-08 | 2012-05-31 | Ritsumeikan | 研磨パッド |
JP5766943B2 (ja) * | 2010-12-10 | 2015-08-19 | 学校法人立命館 | 研磨パッド |
-
2012
- 2012-10-22 JP JP2012232997A patent/JP6149286B2/ja not_active Expired - Fee Related
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