JP5688590B2 - 研磨パッド用表面処理剤及び研磨パッド用スプレー - Google Patents
研磨パッド用表面処理剤及び研磨パッド用スプレー Download PDFInfo
- Publication number
- JP5688590B2 JP5688590B2 JP2010253861A JP2010253861A JP5688590B2 JP 5688590 B2 JP5688590 B2 JP 5688590B2 JP 2010253861 A JP2010253861 A JP 2010253861A JP 2010253861 A JP2010253861 A JP 2010253861A JP 5688590 B2 JP5688590 B2 JP 5688590B2
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- JP
- Japan
- Prior art keywords
- polishing pad
- polishing
- treatment agent
- surface treatment
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 title claims description 169
- 239000012756 surface treatment agent Substances 0.000 title claims description 32
- 239000007921 spray Substances 0.000 title claims description 28
- 229920005989 resin Polymers 0.000 claims description 45
- 239000011347 resin Substances 0.000 claims description 45
- 229920001187 thermosetting polymer Polymers 0.000 claims description 41
- 239000006185 dispersion Substances 0.000 claims description 37
- 239000003822 epoxy resin Substances 0.000 claims description 36
- 229920000647 polyepoxide Polymers 0.000 claims description 36
- 239000002245 particle Substances 0.000 claims description 22
- 239000007787 solid Substances 0.000 claims description 20
- 239000002904 solvent Substances 0.000 claims description 13
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 26
- 239000007788 liquid Substances 0.000 description 13
- 239000006061 abrasive grain Substances 0.000 description 11
- 239000000835 fiber Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000007517 polishing process Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 239000002002 slurry Substances 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004745 nonwoven fabric Substances 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 230000014759 maintenance of location Effects 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010954 inorganic particle Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 230000001603 reducing effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
2 容器
3 分散液(研磨パッド用表面処理剤)
4 基材
5 エポキシ樹脂膜
6 研磨パッド
Claims (8)
- 熱硬化性樹脂を溶剤に分散させた分散液からなり、研磨パッドの表面に塗布されることにより、前記研磨パッドの表面に前記熱硬化樹脂からなる膜を形成するための研磨パッド用表面処理剤であって、
前記熱硬化性樹脂は、常温硬化型であることを特徴とする研磨パッド用表面処理剤。 - 前記熱硬化性樹脂は、A硬度が70〜100の範囲内であることを特徴とする請求項1記載の研磨パッド用表面処理剤。
- 前記熱硬化性樹脂は、1液タイプの常温硬化型であることを特徴とする請求項1又は2記載の研磨パッド用表面処理剤。
- 前記分散液は、20℃における粘度が1000cP以下であることを特徴とする請求項1〜3のいずれかに記載の研磨パッド用表面処理剤。
- 前記熱硬化性樹脂は、エポキシ樹脂であることを特徴とする請求項1〜4のいずれかに記載の研磨パッド用表面処理剤。
- 前記分散液に固体粒子を混合したことを特徴とする請求項1〜5のいずれかに記載の研磨パッド用表面処理剤。
- 請求項1〜6のいずれかに記載の研磨パッド用表面処理剤を噴霧可能な容器に充填してなることを特徴とする研磨パッド用スプレー。
- 前記噴霧可能な容器に高圧ガスを充填してなることを特徴とする請求項7記載の研磨パッド用スプレー。
Priority Applications (1)
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---|---|---|---|
JP2010253861A JP5688590B2 (ja) | 2010-11-12 | 2010-11-12 | 研磨パッド用表面処理剤及び研磨パッド用スプレー |
Applications Claiming Priority (1)
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JP2010253861A JP5688590B2 (ja) | 2010-11-12 | 2010-11-12 | 研磨パッド用表面処理剤及び研磨パッド用スプレー |
Publications (2)
Publication Number | Publication Date |
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JP2012101342A JP2012101342A (ja) | 2012-05-31 |
JP5688590B2 true JP5688590B2 (ja) | 2015-03-25 |
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JP2010253861A Active JP5688590B2 (ja) | 2010-11-12 | 2010-11-12 | 研磨パッド用表面処理剤及び研磨パッド用スプレー |
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Families Citing this family (1)
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JP6465676B2 (ja) * | 2015-01-30 | 2019-02-06 | 富士紡ホールディングス株式会社 | 研磨パッド及び研磨パッドの製造方法 |
Family Cites Families (4)
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JP3169262B2 (ja) * | 1992-05-18 | 2001-05-21 | 株式会社シマノ | 釣り竿 |
JPH08253976A (ja) * | 1995-03-15 | 1996-10-01 | Nisshinbo Ind Inc | 建築物の耐炎性を有する断熱構造体及びその工法 |
JP2000061817A (ja) * | 1998-08-24 | 2000-02-29 | Nikon Corp | 研磨パッド |
JP4372292B2 (ja) * | 1999-11-30 | 2009-11-25 | Jfeスチール株式会社 | 塗装亜鉛系めっき鋼管およびその製造方法 |
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