JP5009914B2 - 表面織り目加工微小孔性研磨パッド - Google Patents
表面織り目加工微小孔性研磨パッド Download PDFInfo
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- JP5009914B2 JP5009914B2 JP2008526988A JP2008526988A JP5009914B2 JP 5009914 B2 JP5009914 B2 JP 5009914B2 JP 2008526988 A JP2008526988 A JP 2008526988A JP 2008526988 A JP2008526988 A JP 2008526988A JP 5009914 B2 JP5009914 B2 JP 5009914B2
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Images
Classifications
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- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0063—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by extrusion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
- B29C44/3469—Cell or pore nucleation
- B29C44/348—Cell or pore nucleation by regulating the temperature and/or the pressure, e.g. suppression of foaming until the pressure is rapidly decreased
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
- B29C44/34—Auxiliary operations
- B29C44/56—After-treatment of articles, e.g. for altering the shape
- B29C44/5627—After-treatment of articles, e.g. for altering the shape by mechanical deformation, e.g. crushing, embossing, stretching
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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- Y10T428/24496—Foamed or cellular component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
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- Y10T428/24496—Foamed or cellular component
- Y10T428/24504—Component comprises a polymer [e.g., rubber, etc.]
- Y10T428/24512—Polyurethane
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
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- Y10T428/249976—Voids specified as closed
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
- Y10T428/249976—Voids specified as closed
- Y10T428/249977—Specified thickness of void-containing component [absolute or relative], numerical cell dimension or density
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Description
この実施例は、均一な孔径を有する微小孔性フォームロッドを製造するための方法を説明する。
この実施例は、本発明の研磨パッドを調製するための方法を説明する。
この実施例は、本発明の研磨パッドを調製するための方法を説明する。
気泡数/cm3=((ρ固体/ρパッド材料)−1)*(6/πd3)
式中、ρ固体は1.2g/cm3に等しい固体熱可塑性ポリウレタンパッド(SCFガスなしでの)の密度であり、ρパッド材料は微細気泡熱可塑性ポリウレタンパッド(SCFガスによる)の密度であり、dは気泡径(球状と想定して、cm単位での)である。
この実施例は、本発明の微小孔性フォーム研磨パッドが良好な研磨特性を有することを説明する。
この実施例は、本発明の微小孔性フォーム研磨パッドが良好な研磨特性を有することを説明する。
この実施例は、本発明の微小孔性フォーム研磨パッドが透過性であり、研磨の間に研磨組成物を輸送することができることを説明する。
この実施例は、本発明の微小孔性フォーム研磨パッドが、従来型の独立気泡微小孔性研磨パッドに較べて優れた研磨レートを有することを示す。
この実施例は加圧ガス注入法を用いて本発明の研磨パッドを調製するための方法を説明する。
この実施例は、フォーム中の少なくとも75%の孔が平均孔気泡径の20μm以内の孔気泡径を有する、60μm以下の範囲にある平均孔気密径を有する本発明の研磨パッドの調製を説明する;該パッドは25μm〜1150μm範囲の深さ、0.25μm〜380μm範囲の幅、および1〜1000の長さ対幅アスペクト比を有する窪みを含む少なくとも一つの織り目加工表面を有し;該パッドの少なくとも一つの織り目加工表面は、表面積の平方センチメートル当り少なくとも10個の窪みを含み、少なくとも5μmの平均表面粗さを有する。
この実施例は、フォーム中の少なくとも75%の孔が平均孔気泡径の20μm内の孔気泡径を有する、60μm以下の範囲にある平均孔気泡径を有する本発明の研磨パッドの調製を説明する;該パッドは25μm〜1150μm範囲の深さ、0.25μm〜380μm範囲の幅、および1〜1000の長さ対幅アスペクト比を有する窪みを含む少なくとも一つの織り目加工表面を有し;該パッドの少なくとも一つの織り目加工表面は、表面積の平方センチメートル当り少なくとも10個の窪みを含み、少なくとも5μmの平均表面粗さを有し、その上に刻まれる溝の織り目加工パターンを有する。
Claims (29)
- 60μm以下の範囲にある平均孔気泡径を有する多孔質高分子フォームを含む化学機械研磨用に適する表面織り目加工研磨パッドであって、該フォーム中の少なくとも75%の孔が該平均孔気泡径から±30μm内の孔気泡径を有し、該パッドは、25μm〜1150μm範囲内の深さ、0.25μm〜380μm範囲内の幅、および1〜1000の長さ対幅アスペクト比を有する窪みを含む少なくとも一つの織り目加工表面を有し、該パッドの少なくとも一つの織り目加工表面は、表面積の平方センチメートル当り少なくとも10個の窪みを含み、少なくとも5μmの平均表面粗さを有する、表面織り目加工研磨パッド。
- 多孔質高分子フォームが立方センチメートル当り少なくとも104気泡の孔気泡密度を有する請求項1に記載の研磨パッド。
- 多孔質高分子フォームが少なくとも0.5g/cm3の密度を有する請求項1に記載の研磨パッド。
- 多孔質高分子フォーム中で気泡の大部分が独立気泡である請求項1に記載の研磨パッド。
- 多孔質高分子フォームが熱可塑性ポリウレタンを含む請求項1に記載の研磨パッド。
- 熱可塑性ポリウレタンが20,000g/モル〜600,000g/モルの質量平均分子量(Mw)を有する請求項5に記載の研磨パッド。
- 熱可塑性ポリウレタンが20以下のメルト・フロー・インデックス(MFI)を有する請求項6に記載の研磨パッド。
- 熱可塑性ポリウレタンが1.1〜6の多分散指数(PDI)を有する請求項6に記載の研磨パッド。
- 熱可塑性ポリウレタンが2〜10のレオロジー・プロセシング・インデックス(RPI)を有する請求項6に記載の研磨パッド。
- 多孔質高分子フォームが8%以下の平均圧縮率%を有する請求項5に記載の研磨パッド。
- 熱可塑性ポリウレタンフォームが少なくとも20%の平均跳ね返り率%を有する請求項5に記載の研磨パッド。
- 少なくとも一つの織り目加工表面がショアA75〜ショアD90範囲にある硬度を有する請求項1に記載の研磨パッド。
- 少なくとも一つの織り目加工表面が、さらに、その上に刻まれる溝の織り目加工パターンを含む請求項1に記載の研磨パッド。
- 溝がそれぞれ25μm〜500μm範囲にある幅を有する請求項13に記載の研磨パッド。
- 溝が25μm〜500μm範囲にある深さを有する請求項13に記載の研磨パッド。
- 少なくとも一つの織り目加工表面がその上に刻まれる溝のメッシュパターンを含む請求項1に記載の研磨パッドであって、該メッシュパターンは、間隙を介した平行な溝の第1パターン、および間隙を介した平行な溝の第1パターンを横切る間隙を介した平行な溝の第2パターンを含む、研磨パッド。
- 溝がそれぞれ25μm〜500μm範囲にある幅を有する請求項16に記載の研磨パッド。
- 間隙を介した平行な溝の第1および第2パターンの平行な溝が、250μm〜1000μm範囲にある距離分相互に間隙を空ける請求項16に記載の研磨パッド。
- 溝が25μm〜500μm範囲にある深さを有する請求項16に記載の研磨パッド。
- 多孔質高分子フォームが1μm〜30μm範囲にある平均孔径を有する請求項1に記載の研磨パッド。
- (a)ガスを高い温度および圧力にさらすことにより超臨界ガスを発生させ、単相溶液を生成するために、ポリマー樹脂を該超臨界ガスと混合し、
(b)単相溶液から高分子フォームのシートを押出成形し、
(c)該シートを圧縮し、および
(d)高分子フォームのそのように押出成形され圧縮されたシートから少なくとも一つの織り目加工表面を有する研磨パッドを形成すること、
を含む請求項1に記載の研磨パッドを製造するための方法。 - ポリマー樹脂と混合される超臨界ガスの量が単相溶液の全体体積の0.01%〜5%である請求項21に記載の方法。
- さらに、研磨パッドを形成する前に、圧縮され押出成形された高分子フォームシートの表面上に、溝の少なくとも一つの織り目加工パターンを刻む追加の段階を含む請求項21に記載の方法。
- 溝がそれぞれ25μm〜500μm範囲にある幅を有する請求項23に記載の方法。
- 溝が25μm〜500μm範囲にある深さを有する請求項23に記載の方法。
- さらに、その表面粗さを低減するためにパッドの少なくとも一つの織り目加工表面をバフ研磨する追加の段階を含む請求項21に記載の方法。
- (a)回転するプラテン、
(b)請求項1に記載の研磨パッド、および
(c)被加工物を回転研磨パッドと接触させることにより研磨しようとする被加工物を保持する担体、
を含む化学機械研磨装置。 - さらに原位置終点検出システムを含む、請求項27に記載の化学機械研磨装置。
- (a)請求項1に記載の研磨パッドを提供し、
(b)被加工物を回転研磨パッドと接触させ、および
(c)被加工物に対して研磨パッドを動かせて被加工物を薄く削り、それによって被加工物を研磨すること、
を含む被加工物を研磨する方法。
Applications Claiming Priority (3)
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US11/207,964 US20050276967A1 (en) | 2002-05-23 | 2005-08-19 | Surface textured microporous polishing pads |
US11/207,964 | 2005-08-19 | ||
PCT/US2006/030783 WO2007024464A1 (en) | 2005-08-19 | 2006-08-08 | Surface textured microporous polishing pads |
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JP2009504426A JP2009504426A (ja) | 2009-02-05 |
JP2009504426A5 JP2009504426A5 (ja) | 2009-09-24 |
JP5009914B2 true JP5009914B2 (ja) | 2012-08-29 |
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JP2008526988A Active JP5009914B2 (ja) | 2005-08-19 | 2006-08-08 | 表面織り目加工微小孔性研磨パッド |
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US (1) | US20050276967A1 (ja) |
JP (1) | JP5009914B2 (ja) |
KR (1) | KR101281874B1 (ja) |
CN (1) | CN101282818A (ja) |
TW (1) | TWI308097B (ja) |
WO (1) | WO2007024464A1 (ja) |
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JP3769581B1 (ja) * | 2005-05-18 | 2006-04-26 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法 |
US20070161720A1 (en) * | 2005-11-30 | 2007-07-12 | Applied Materials, Inc. | Polishing Pad with Surface Roughness |
KR100741984B1 (ko) * | 2006-02-17 | 2007-07-23 | 삼성전자주식회사 | 화학기계적 연마 장치의 연마 패드 및 그의 제조방법 |
US7438636B2 (en) * | 2006-12-21 | 2008-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US7569268B2 (en) * | 2007-01-29 | 2009-08-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US8177603B2 (en) * | 2008-04-29 | 2012-05-15 | Semiquest, Inc. | Polishing pad composition |
CN102026775A (zh) * | 2008-05-16 | 2011-04-20 | 东丽株式会社 | 研磨垫 |
JP5549111B2 (ja) * | 2008-05-22 | 2014-07-16 | Jsr株式会社 | 化学機械研磨パッドの研磨層形成用組成物、化学機械研磨パッドおよび化学機械研磨方法 |
TWI409137B (zh) * | 2008-06-19 | 2013-09-21 | Bestac Advanced Material Co Ltd | 研磨墊及其微型結構形成方法 |
JP5233621B2 (ja) * | 2008-12-02 | 2013-07-10 | 旭硝子株式会社 | 磁気ディスク用ガラス基板及びその製造方法。 |
JP5748747B2 (ja) * | 2009-06-10 | 2015-07-15 | エルジー・ケム・リミテッド | 多孔性シートの製造方法及びこれにより製造された多孔性シート |
KR101855073B1 (ko) * | 2009-12-22 | 2018-05-09 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 연마 패드 및 그의 제조 방법 |
JP5484145B2 (ja) * | 2010-03-24 | 2014-05-07 | 東洋ゴム工業株式会社 | 研磨パッド |
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2005
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- 2006-08-08 WO PCT/US2006/030783 patent/WO2007024464A1/en active Application Filing
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- 2006-08-08 KR KR1020087006531A patent/KR101281874B1/ko active IP Right Grant
- 2006-08-18 TW TW95130500A patent/TWI308097B/zh not_active IP Right Cessation
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WO2007024464A1 (en) | 2007-03-01 |
US20050276967A1 (en) | 2005-12-15 |
CN101282818A (zh) | 2008-10-08 |
JP2009504426A (ja) | 2009-02-05 |
KR101281874B1 (ko) | 2013-07-03 |
TW200722225A (en) | 2007-06-16 |
TWI308097B (en) | 2009-04-01 |
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