TW200722225A - Surface textured microporous polishing pads - Google Patents

Surface textured microporous polishing pads

Info

Publication number
TW200722225A
TW200722225A TW095130500A TW95130500A TW200722225A TW 200722225 A TW200722225 A TW 200722225A TW 095130500 A TW095130500 A TW 095130500A TW 95130500 A TW95130500 A TW 95130500A TW 200722225 A TW200722225 A TW 200722225A
Authority
TW
Taiwan
Prior art keywords
range
cell size
textured
pore cell
pad
Prior art date
Application number
TW095130500A
Other languages
Chinese (zh)
Other versions
TWI308097B (en
Inventor
Abaneshwar Prasad
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of TW200722225A publication Critical patent/TW200722225A/en
Application granted granted Critical
Publication of TWI308097B publication Critical patent/TWI308097B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0063—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by extrusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
    • B29C44/34—Auxiliary operations
    • B29C44/3469—Cell or pore nucleation
    • B29C44/348—Cell or pore nucleation by regulating the temperature and/or the pressure, e.g. suppression of foaming until the pressure is rapidly decreased
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C44/00—Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
    • B29C44/34—Auxiliary operations
    • B29C44/56—After-treatment of articles, e.g. for altering the shape
    • B29C44/5627—After-treatment of articles, e.g. for altering the shape by mechanical deformation, e.g. crushing, embossing, stretching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24496—Foamed or cellular component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24496—Foamed or cellular component
    • Y10T428/24504—Component comprises a polymer [e.g., rubber, etc.]
    • Y10T428/24512—Polyurethane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249976—Voids specified as closed
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249976—Voids specified as closed
    • Y10T428/249977—Specified thickness of void-containing component [absolute or relative], numerical cell dimension or density

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)

Abstract

A surface-textured polishing pad suitable for chemical-mechanical polishing comprises a porous polymeric foam having an average pore cell size in the range of 60 μm or less. At least 75% of the pores in the foam have a pore cell size within 30 μm of the average pore cell size. The pad has at least one textured surface that includes divots having a depth in the range of 25 μm to 1150 μm, a width in the range of 0.25 μm to 380 μm, and a length-to-width aspect ratio of 1 to 1000. In addition, the at least one textured surface of the pad includes at least 10 divots per square centimeter of surface area, and has an average surface roughness of at least 5 μm. Preferably, at least one textured surface has at least one pattern of spaced, parallel grooves imprinted thereon.
TW95130500A 2005-08-19 2006-08-18 Surface textured microporous polishing pads TWI308097B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/207,964 US20050276967A1 (en) 2002-05-23 2005-08-19 Surface textured microporous polishing pads

Publications (2)

Publication Number Publication Date
TW200722225A true TW200722225A (en) 2007-06-16
TWI308097B TWI308097B (en) 2009-04-01

Family

ID=37491794

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95130500A TWI308097B (en) 2005-08-19 2006-08-18 Surface textured microporous polishing pads

Country Status (6)

Country Link
US (1) US20050276967A1 (en)
JP (1) JP5009914B2 (en)
KR (1) KR101281874B1 (en)
CN (1) CN101282818A (en)
TW (1) TWI308097B (en)
WO (1) WO2007024464A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409137B (en) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd Polishing pad and the method of forming micro-structure thereof
TWI733868B (en) * 2016-08-04 2021-07-21 美商羅門哈斯電子材料Ｃｍｐ控股公司 Thermoplastic poromeric polishing pad
TWI735628B (en) * 2016-08-04 2021-08-11 美商羅門哈斯電子材料Ｃｍｐ控股公司 Tapering method for poromeric polishing pad

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3769581B1 (en) * 2005-05-18 2006-04-26 東洋ゴム工業株式会社 Polishing pad and manufacturing method thereof
US20070161720A1 (en) * 2005-11-30 2007-07-12 Applied Materials, Inc. Polishing Pad with Surface Roughness
KR100741984B1 (en) * 2006-02-17 2007-07-23 삼성전자주식회사 Polishing pad of chemical mechanical polisher and method of manufacturing the same
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7569268B2 (en) * 2007-01-29 2009-08-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US8177603B2 (en) * 2008-04-29 2012-05-15 Semiquest, Inc. Polishing pad composition
US20110045753A1 (en) * 2008-05-16 2011-02-24 Toray Industries, Inc. Polishing pad
JP5549111B2 (en) * 2008-05-22 2014-07-16 Ｊｓｒ株式会社 Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad, and chemical mechanical polishing method
JP5233621B2 (en) * 2008-12-02 2013-07-10 旭硝子株式会社 Glass substrate for magnetic disk and method for producing the same.
US20120085038A1 (en) * 2009-06-10 2012-04-12 Lg Chem, Ltd. Method for manufacturing porous sheet and porous sheet manufactured by the method
WO2011087737A2 (en) * 2009-12-22 2011-07-21 3M Innovative Properties Company Polishing pad and method of making the same
JP5484145B2 (en) * 2010-03-24 2014-05-07 東洋ゴム工業株式会社 Polishing pad
US20120017935A1 (en) * 2010-07-21 2012-01-26 International Business Machines Corporation Magnetic tape head cleaning
US8702479B2 (en) * 2010-10-15 2014-04-22 Nexplanar Corporation Polishing pad with multi-modal distribution of pore diameters
WO2013161714A1 (en) * 2012-04-27 2013-10-31 株式会社イノアックコーポレーション Method for producing resin foam, and resin foam
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
US10213895B2 (en) * 2013-07-02 2019-02-26 Fujibo Holdings, Inc. Polishing pad and method for manufacturing same
US9963566B2 (en) 2013-08-02 2018-05-08 Nike, Inc. Low density foamed articles and methods for making
US9919458B2 (en) 2013-08-02 2018-03-20 Nike, Inc. Method and thermoplastic foamed article
US20150056895A1 (en) * 2013-08-22 2015-02-26 Cabot Microelectronics Corporation Ultra high void volume polishing pad with closed pore structure
WO2015057562A1 (en) * 2013-10-18 2015-04-23 3M Innovative Properties Company Coated abrasive article and method of making the same
WO2015120430A1 (en) * 2014-02-10 2015-08-13 President And Fellows Of Harvard College 3d-printed polishing pad for chemical-mechanical planarization (cmp)
JP6315246B2 (en) * 2014-03-31 2018-04-25 富士紡ホールディングス株式会社 Polishing pad and manufacturing method thereof
KR102440303B1 (en) * 2014-05-07 2022-09-05 씨엠씨 머티리얼즈, 인코포레이티드 Multi-layer polishing pad for cmp
BR112017004668B1 (en) * 2014-09-11 2021-09-08 Huntsman International Llc PRODUCTION LINE
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN107078048B (en) 2014-10-17 2021-08-13 应用材料公司 CMP pad construction with composite material properties using additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
JP6864622B2 (en) * 2015-01-14 2021-04-28 アーケマ・インコーポレイテッド Foamed polymer powder
JP6446337B2 (en) * 2015-06-29 2018-12-26 株式会社クラレ Polishing pad
CN108136563A (en) * 2015-07-30 2018-06-08 Jh罗得股份有限公司 It polymerize polishing material, the medium comprising polymerization polishing material and system and its formation and application method
CN108025420B (en) * 2015-09-25 2020-10-27 嘉柏微电子材料股份公司 Polyurethane chemical mechanical polishing pad with high modulus ratio
CN113103145B (en) 2015-10-30 2023-04-11 应用材料公司 Apparatus and method for forming polishing article having desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10456886B2 (en) 2016-01-19 2019-10-29 Applied Materials, Inc. Porous chemical mechanical polishing pads
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN106737247B (en) * 2017-01-03 2018-12-28 山东理工大学 A kind of grinding tool of high tangential grinding force and low normal grinding force
CN106625037B (en) * 2017-01-05 2019-01-01 山东理工大学 A kind of method for grinding of high tangential grinding force and low normal grinding force
CN109153107A (en) * 2017-03-31 2019-01-04 古河电气工业株式会社 Polishing pad
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
KR101949905B1 (en) * 2017-08-23 2019-02-19 에스케이씨 주식회사 Porous polyurethane polishing pad and preparation method thereof
EP3687755A1 (en) * 2017-09-29 2020-08-05 3M Innovative Properties Company Polymeric foam layer and methods of making the same
KR20210042171A (en) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 Formulations for advanced polishing pads
CN109571303B (en) * 2018-12-05 2020-06-30 郑州磨料磨具磨削研究所有限公司 Method for impregnating ceramic grinding tool with supercritical fluid
KR102293801B1 (en) * 2019-11-28 2021-08-25 에스케이씨솔믹스 주식회사 Polishing pad, preparation method thereof, and preparation method of semiconductor device using same
KR102237311B1 (en) 2020-06-19 2021-04-07 에스케이씨솔믹스 주식회사 Polishing pad, preparation method thereof and preparation method of semiconductor device using same
US11759909B2 (en) 2020-06-19 2023-09-19 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
KR102237321B1 (en) 2020-06-19 2021-04-07 에스케이씨솔믹스 주식회사 Polishing pad, preparation method thereof and preparation method of semiconductor device using same
KR102237326B1 (en) 2020-06-19 2021-04-07 에스케이씨솔믹스 주식회사 Polishing pad, preparation method thereof and preparation method of semiconductor device using same
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
KR102237316B1 (en) 2020-06-19 2021-04-07 에스케이씨솔믹스 주식회사 Polishing pad, preparation method thereof and preparation method of semiconductor device using same
CN111730794B (en) * 2020-06-30 2022-02-11 华东理工大学 Supercritical fluid foaming method of thermoplastic elastomer, product and application thereof
KR102497825B1 (en) * 2020-09-29 2023-02-08 에스케이엔펄스 주식회사 Polishing pad, manufacturing method thereof and preparing method of semiconductor device using the same
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
IL308359A (en) 2021-05-17 2024-01-01 Jabil Inc Improved method for forming thermoplastic additive manufacturing powders
KR102561824B1 (en) 2021-06-02 2023-07-31 에스케이엔펄스 주식회사 Polishing pad and method for preparing semiconductor device using the same

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138228A (en) * 1977-02-02 1979-02-06 Ralf Hoehn Abrasive of a microporous polymer matrix with inorganic particles thereon
US4239567A (en) * 1978-10-16 1980-12-16 Western Electric Company, Inc. Removably holding planar articles for polishing operations
JPH01193166A (en) * 1988-01-28 1989-08-03 Showa Denko Kk Pad for specularly grinding semiconductor wafer
US5182307A (en) * 1990-11-21 1993-01-26 Board Of Regents Of The University Of Washington Polyethylene terephthalate foams with integral crystalline skins
DE4321823C2 (en) * 1993-07-01 1997-03-06 Telefunken Microelectron Illumination unit for illuminated signs
US5441598A (en) * 1993-12-16 1995-08-15 Motorola, Inc. Polishing pad for chemical-mechanical polishing of a semiconductor substrate
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US6017265A (en) * 1995-06-07 2000-01-25 Rodel, Inc. Methods for using polishing pads
US5684055A (en) * 1994-12-13 1997-11-04 University Of Washington Semi-continuous production of solid state polymeric foams
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
GB2316414B (en) * 1996-07-31 2000-10-11 Tosoh Corp Abrasive shaped article, abrasive disc and polishing method
DE69717465T2 (en) * 1996-08-27 2003-07-10 Trexel, Inc. METHOD AND DEVICE FOR EXTRUDING POLYMER FOAM, ESPECIALLY MICROCELL foam
EP0984846B1 (en) * 1997-01-13 2004-11-24 Rodel, Inc. Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
KR20010006518A (en) * 1997-04-18 2001-01-26 매튜 네빌 Polishing Pad for a Semiconductor Substrate
JPH10329007A (en) * 1997-05-28 1998-12-15 Sony Corp Chemical machine polishing device
US6235380B1 (en) * 1997-07-24 2001-05-22 Trexel, Inc. Lamination of microcellular articles
WO1999032544A1 (en) * 1997-12-19 1999-07-01 Trexel, Inc. Microcellular foam extrusion/blow molding process and article made thereby
US6231942B1 (en) * 1998-01-21 2001-05-15 Trexel, Inc. Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby
GB2334205B (en) * 1998-02-12 2001-11-28 Shinetsu Handotai Kk Polishing method for semiconductor wafer and polishing pad used therein
JP2918883B1 (en) * 1998-07-15 1999-07-12 日本ピラー工業株式会社 Polishing pad
EP1043378B1 (en) * 1999-04-09 2006-02-15 Tosoh Corporation Molded abrasive product and polishing wheel using it
WO2000073036A2 (en) * 1999-05-27 2000-12-07 Trexel, Inc. Polymeric foam processing
US6146242A (en) * 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
US6171181B1 (en) * 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
US6290883B1 (en) * 1999-08-31 2001-09-18 Lucent Technologies Inc. Method for making porous CMP article
EP1224060B1 (en) * 1999-09-29 2004-06-23 Rodel Holdings, Inc. Polishing pad
US6368200B1 (en) * 2000-03-02 2002-04-09 Agere Systems Guardian Corporation Polishing pads from closed-cell elastomer foam
US6926507B2 (en) * 2000-03-07 2005-08-09 Trexel, Inc. Blowing agent delivery system
JP4615813B2 (en) * 2000-05-27 2011-01-19 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド Polishing pad for chemical mechanical planarization
JP3925041B2 (en) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 Polishing pad composition and polishing pad using the same
JP2001348271A (en) * 2000-06-01 2001-12-18 Tosoh Corp Polishing compact and polishing surface plate using the same
US20030022604A1 (en) * 2001-05-07 2003-01-30 3M Innovative Properties Company Abrasive product and method of making and using the same
US6685540B2 (en) * 2001-11-27 2004-02-03 Cabot Microelectronics Corporation Polishing pad comprising particles with a solid core and polymeric shell
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7166247B2 (en) * 2002-06-24 2007-01-23 Micron Technology, Inc. Foamed mechanical planarization pads made with supercritical fluid
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409137B (en) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd Polishing pad and the method of forming micro-structure thereof
TWI733868B (en) * 2016-08-04 2021-07-21 美商羅門哈斯電子材料Ｃｍｐ控股公司 Thermoplastic poromeric polishing pad
TWI735628B (en) * 2016-08-04 2021-08-11 美商羅門哈斯電子材料Ｃｍｐ控股公司 Tapering method for poromeric polishing pad

Also Published As

Publication number Publication date
KR20080037719A (en) 2008-04-30
KR101281874B1 (en) 2013-07-03
JP5009914B2 (en) 2012-08-29
JP2009504426A (en) 2009-02-05
US20050276967A1 (en) 2005-12-15
WO2007024464A1 (en) 2007-03-01
TWI308097B (en) 2009-04-01
CN101282818A (en) 2008-10-08

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