JP4569298B2 - 熱電材料 - Google Patents

熱電材料 Download PDF

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Publication number
JP4569298B2
JP4569298B2 JP2004555069A JP2004555069A JP4569298B2 JP 4569298 B2 JP4569298 B2 JP 4569298B2 JP 2004555069 A JP2004555069 A JP 2004555069A JP 2004555069 A JP2004555069 A JP 2004555069A JP 4569298 B2 JP4569298 B2 JP 4569298B2
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JP
Japan
Prior art keywords
thermoelectric material
less
thermal conductivity
thermoelectric
sintered body
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Expired - Fee Related
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JP2004555069A
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English (en)
Japanese (ja)
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JPWO2004049464A1 (ja
Inventor
高志 原田
直大 戸田
均 角谷
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Publication date
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Publication of JPWO2004049464A1 publication Critical patent/JPWO2004049464A1/ja
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Anticipated expiration legal-status Critical
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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
JP2004555069A 2002-11-28 2003-11-27 熱電材料 Expired - Fee Related JP4569298B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002344763 2002-11-28
JP2002344763 2002-11-28
PCT/JP2003/015194 WO2004049464A1 (ja) 2002-11-28 2003-11-27 熱電材料及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2004049464A1 JPWO2004049464A1 (ja) 2006-03-30
JP4569298B2 true JP4569298B2 (ja) 2010-10-27

Family

ID=32375967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004555069A Expired - Fee Related JP4569298B2 (ja) 2002-11-28 2003-11-27 熱電材料

Country Status (6)

Country Link
US (1) US20060053969A1 (zh)
JP (1) JP4569298B2 (zh)
KR (1) KR100924054B1 (zh)
CN (1) CN100459201C (zh)
AU (1) AU2003284476A1 (zh)
WO (1) WO2004049464A1 (zh)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4497981B2 (ja) * 2004-03-30 2010-07-07 株式会社東芝 熱電材料および熱電変換素子
US8865995B2 (en) * 2004-10-29 2014-10-21 Trustees Of Boston College Methods for high figure-of-merit in nanostructured thermoelectric materials
US7465871B2 (en) * 2004-10-29 2008-12-16 Massachusetts Institute Of Technology Nanocomposites with high thermoelectric figures of merit
FR2884353B1 (fr) 2005-04-06 2007-07-13 Centre Nat Rech Scient Realisation de materiaux thermoelectriques par mecanosynthese
KR101398824B1 (ko) * 2006-06-26 2014-05-27 다이아몬드 이노베이션즈, 인크. Hpht 소결에 의해서 반도체들의 제벡 계수를 증가시키는 방법
WO2010080153A1 (en) * 2009-01-09 2010-07-15 Diamond Innovations, Inc. Affecting the thermoelectric figure of merit (zt) by high pressure, high temperature sintering
US8058092B2 (en) * 2007-09-28 2011-11-15 Stion Corporation Method and material for processing iron disilicide for photovoltaic application
US8614396B2 (en) * 2007-09-28 2013-12-24 Stion Corporation Method and material for purifying iron disilicide for photovoltaic application
US8440903B1 (en) 2008-02-21 2013-05-14 Stion Corporation Method and structure for forming module using a powder coating and thermal treatment process
US8772078B1 (en) 2008-03-03 2014-07-08 Stion Corporation Method and system for laser separation for exclusion region of multi-junction photovoltaic materials
US8075723B1 (en) 2008-03-03 2011-12-13 Stion Corporation Laser separation method for manufacture of unit cells for thin film photovoltaic materials
US8883047B2 (en) * 2008-04-30 2014-11-11 Massachusetts Institute Of Technology Thermoelectric skutterudite compositions and methods for producing the same
US7939454B1 (en) 2008-05-31 2011-05-10 Stion Corporation Module and lamination process for multijunction cells
US8207008B1 (en) 2008-08-01 2012-06-26 Stion Corporation Affixing method and solar decal device using a thin film photovoltaic
JP2010206024A (ja) * 2009-03-04 2010-09-16 Yanmar Co Ltd 熱電モジュールおよび熱電モジュールの製造方法
CN101549405A (zh) * 2009-05-19 2009-10-07 燕山大学 高致密化高性能纳米晶块体热电材料的高压烧结制备方法
US9123856B2 (en) * 2010-03-11 2015-09-01 Diamond Innovations, Inc. Affecting the thermoelectric figure of merit (ZT) and the power factor by high pressure, high temperature sintering
US10751801B2 (en) * 2013-11-22 2020-08-25 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Bulk monolithic nano-heterostructures and method of making the same
JP2012023201A (ja) * 2010-07-14 2012-02-02 Toyota Motor Corp 熱電変換材料の製造方法
CN103314458A (zh) * 2010-12-20 2013-09-18 波士顿学院理事会 具有提高的品质因数的半赫斯勒合金及其制造方法
US9048004B2 (en) 2010-12-20 2015-06-02 Gmz Energy, Inc. Half-heusler alloys with enhanced figure of merit and methods of making
CN102383023B (zh) * 2011-11-08 2013-06-05 天津大学 硅锰铁合金热电材料的制备方法
WO2013112710A1 (en) 2012-01-25 2013-08-01 Alphabet Energy, Inc. Modular thermoelectric units for heat recovery systems and methods thereof
US11968899B2 (en) * 2012-02-07 2024-04-23 Ethan James Ciccotelli Method and device for the generation of electricity directly from heat
JP6127041B2 (ja) * 2012-03-21 2017-05-10 リンテック株式会社 熱電変換材料及びその製造方法
US9257627B2 (en) 2012-07-23 2016-02-09 Alphabet Energy, Inc. Method and structure for thermoelectric unicouple assembly
DE102013213334A1 (de) * 2013-07-08 2015-01-08 Deutsches Zentrum für Luft- und Raumfahrt e.V. Herstellung von Skutterudit
US9065017B2 (en) * 2013-09-01 2015-06-23 Alphabet Energy, Inc. Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same
JP2014220506A (ja) * 2014-06-17 2014-11-20 ダイヤモンドイノベイションズ インコーポレーテッド 高圧高温焼結による熱電性能指数(zt)の影響
CN104022218A (zh) * 2014-06-23 2014-09-03 武汉理工大学 一种高性能SbAgSeS基热电材料及其制备方法
CN105355771B (zh) * 2015-10-16 2018-09-28 中国科学院上海硅酸盐研究所 一种高功率因子氧化锌热电材料及其制备方法
CN108701749B (zh) * 2016-02-24 2022-02-01 三菱综合材料株式会社 镁系热电转换材料的制造方法、镁系热电转换元件的制造方法、镁系热电转换材料、镁系热电转换元件及热电转换装置
EP3493281B1 (en) 2016-07-28 2021-03-24 Kabushiki Kaisha Toshiba Thermoelectric material, manufacturing method of thermoelectric material, thermoelectric conversion element, and thermoelectric conversion module
JP6617840B2 (ja) * 2017-01-20 2019-12-11 日立金属株式会社 p型熱電変換材料、熱電変換モジュール及びp型熱電変換材料の製造方法
KR102490113B1 (ko) 2018-06-12 2023-01-17 주식회사 케이티 재난 방송 장치 및 방법
JPWO2021193481A1 (zh) 2020-03-23 2021-09-30

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06237018A (ja) * 1993-02-09 1994-08-23 Onoda Cement Co Ltd 熱電変換材料の製造方法
JPH10209508A (ja) * 1997-01-22 1998-08-07 Toshiba Corp 熱電変換素子及びその製造方法
JPH10303468A (ja) * 1997-04-23 1998-11-13 Matsushita Electric Ind Co Ltd 熱電材料とその製造方法
JPH11261119A (ja) * 1998-03-13 1999-09-24 Komatsu Ltd 熱電半導体材料の製造方法
JPH11284237A (ja) * 1998-03-31 1999-10-15 Matsushita Electric Works Ltd P型熱電変換材料の製造方法
JP2002076452A (ja) * 2000-09-04 2002-03-15 Japan Aviation Electronics Industry Ltd 熱電変換材料及びその製造方法
JP2002223013A (ja) * 2001-01-29 2002-08-09 Kyocera Corp 熱電変換素子及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6043424A (en) * 1996-07-03 2000-03-28 Yamaha Corporation Thermoelectric alloy achieving large figure of merit by reducing oxide and process of manufacturing thereof
EP0874406A3 (en) * 1997-04-23 2000-12-13 Matsushita Electric Industrial Co., Ltd. A co-sb based thermoelectric material and a method of producing the same
KR20000028741A (ko) * 1998-10-12 2000-05-25 안자키 사토루 열전반도체 재료 또는 소자의 제조방법 및 열전모듈의제조방법
EP0996174B1 (en) * 1998-10-22 2005-04-27 Yamaha Corporation Thermoelectric materials and thermoelectric conversion element
CN100385694C (zh) * 1999-03-10 2008-04-30 日立金属株式会社 热电转换材料及其制作方法
JP2000307158A (ja) * 1999-04-19 2000-11-02 Yamaha Corp 熱電材料の製造方法
JP3594008B2 (ja) * 2000-11-30 2004-11-24 ヤマハ株式会社 熱電材料、その製造方法及びペルチェモジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06237018A (ja) * 1993-02-09 1994-08-23 Onoda Cement Co Ltd 熱電変換材料の製造方法
JPH10209508A (ja) * 1997-01-22 1998-08-07 Toshiba Corp 熱電変換素子及びその製造方法
JPH10303468A (ja) * 1997-04-23 1998-11-13 Matsushita Electric Ind Co Ltd 熱電材料とその製造方法
JPH11261119A (ja) * 1998-03-13 1999-09-24 Komatsu Ltd 熱電半導体材料の製造方法
JPH11284237A (ja) * 1998-03-31 1999-10-15 Matsushita Electric Works Ltd P型熱電変換材料の製造方法
JP2002076452A (ja) * 2000-09-04 2002-03-15 Japan Aviation Electronics Industry Ltd 熱電変換材料及びその製造方法
JP2002223013A (ja) * 2001-01-29 2002-08-09 Kyocera Corp 熱電変換素子及びその製造方法

Also Published As

Publication number Publication date
WO2004049464A1 (ja) 2004-06-10
AU2003284476A1 (en) 2004-06-18
US20060053969A1 (en) 2006-03-16
CN100459201C (zh) 2009-02-04
JPWO2004049464A1 (ja) 2006-03-30
KR100924054B1 (ko) 2009-10-27
CN1717814A (zh) 2006-01-04
KR20050085179A (ko) 2005-08-29

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