JP4502049B2 - 光トランシーバ - Google Patents
光トランシーバ Download PDFInfo
- Publication number
- JP4502049B2 JP4502049B2 JP2008189333A JP2008189333A JP4502049B2 JP 4502049 B2 JP4502049 B2 JP 4502049B2 JP 2008189333 A JP2008189333 A JP 2008189333A JP 2008189333 A JP2008189333 A JP 2008189333A JP 4502049 B2 JP4502049 B2 JP 4502049B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- lower housing
- transceiver
- circuit board
- tosa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000003287 optical effect Effects 0.000 title claims description 105
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims 1
- 235000011449 Rosa Nutrition 0.000 description 47
- 230000005540 biological transmission Effects 0.000 description 13
- 238000003860 storage Methods 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 210000000078 claw Anatomy 0.000 description 10
- 230000000712 assembly Effects 0.000 description 8
- 238000000429 assembly Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 230000009471 action Effects 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000013307 optical fiber Substances 0.000 description 6
- 239000006096 absorbing agent Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
- G02B6/4261—Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/627—Snap or like fastening
- H01R13/6275—Latching arms not integral with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6582—Shield structure with resilient means for engaging mating connector
- H01R13/6583—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
- H01R13/6584—Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members formed by conductive elastomeric members, e.g. flat gaskets or O-rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
- H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0058—Casings specially adapted for optoelectronic applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
Description
図3(A)、図3(B)はそれぞれROSA51、TOSA61の組立図を示す。ROSA51、ROSA61ともに円筒状のパッケージを有し、その前方端(図3(A)、図3(B)において下方)に調芯部材 51c、61cおよびスリーブ51e、61eが、後方側(図3(A)、図3(B)において上方)にステム51a、61aを有する。スリーブ51e、61e内に光コネクタ先端に付属するフェルール、その中心には光ファイバが保持されているが、このフェルールが挿入されることで、フェルールに保持されている光ファイバと、ステム51a、61a上に搭載されているPD、LD等の半導体光デバイスとが光結合する。
続いて図4にある様に、FPC基板52、62を組み付けたROSA51、TOSA61を回路基板15に接続する。ROSA51から伸びだすFPC基板52は、回路基板15の前方端部15gに接続される。一方TOSA61から伸びだすFPC基板62は、回路基板15の前方端であって、凹部15iの直後の個所15hにソルダリングされる。このソルダリングにおいては、FPC基板52、62のうち図4に描かれている面とは反対の面が、回路基板15にソルダリングされることになる。FPC基板52、62上の配線は、このソルダリング個所において、FPC基板52、62の裏面側にビアホールにより導通され、裏面側に形成されたソルダリングパッドと回路基板15上のパッドがソルダリングされる。
下部ハウジング12は、既に説明したROSA51/TOSA61と回路基板15との組立とは独立して組立てることができる。図5(A)は下部ハウジング12を一方向から俯瞰した斜視図であり、図5(B)は図5(A)とは反対の方向から俯瞰した斜視図である。下部ハウジング12はトランシーバ前方側から順にレセプタクル部12p、ホルダ受納部12q、およびアセンブリ収納部12rが配置されている。レセプタクル部12pには、下部ハウジング12の外壁12a、12b、中央隔壁12c、底板12d、12eに囲まれ、開口141、142を備えるレセプタクルが形成されている。当該レセプタクルに開口141、142から挿入される光コネクタを挿入し、一方、アセンブリ収納部12rに搭載されたROSA51、TOSA61のそれぞれのスリーブ 51e、61eが突き出て光コネクタと係合することで、アセンブリ内の光素子と、光コネクタ内の光ファイバとが光結合する。外壁12a、12bにはグリップ13とこの下ハウジング12が係合するための突起12sが形成されている。この突起12sにより、グリップ13が下部ハウジング12から抜け落ちることがない。
続いて回路基板15とFPC基板52、62が接続されたTOSA/ROSAをレセプタクルに組付ける。
ホルダ81とROSA51/TOSA61、及び回路基板15の組立後、放熱シート73、ブッシュ74と電波吸収体75を所定箇所に貼り付ける。まず、断面が弧状のブッシュ74をROSA51/TOSA61のステム51b、61bに貼り付ける。TOSA61については、これに先立つ工程で予め設けた下部ハウジング12の鞍座12lとTOSA61との間に設けたブッシュ74と、本工程で設けるブッシュ74との間に、TOSA61の調芯部を挟みこむ。
次いでカバー14を上部ハウジング11に対して組み立てる。カバー14はニッケルメッキを施した銅合金製であり、カバー14の内面にはその全面に予めカプトンテープと放熱シートとが貼付られており、放熱シートが回路基板5上の素子に接することで、当該素子の放熱を促すことができる構造となっている。カバー14の前方端、前方両側部、後方端のそれぞれには、複数の爪14aを備え、これら爪14aが下部ハウジング12あるいは上部ハウジング11の対応箇所の中に潜りこんで、トランシーバ内部の回路基板15、及び当該基板上の電子回路を外部からシールドする。図11(A)は回路基板15後部のプラグコネクタ部15jのシールド状況を示す拡大図であり、図11(B)はその断面図、図11Cはシールド機構の一変形例を示している。
最後に、グリップ13を下部ハウジング12に嵌合させ、ガスケット91を下部ハウジング12と上部筐体11とが合体して構成するフランジの背面に嵌める。ガスケットは表面を金属鍍金した樹脂製であり、ホストシステムにこの光トランシーバ1が搭載された際に、ホストシステムのフェースプレート5と光トランシーバ1のフランジの間に介在する。このガスケット91により、トランシーバ1が挿入されているフェースプレートの開口を効果的にシールドできるだけでなく、樹脂が本来的に有する弾性力により、トランシーバ1とレール2との係合が外れた際に、モジュールをレール外方に押出す反発力を与える。
Claims (3)
- EMI雑音耐性を有する光トランシーバであって、
金属製の上部ハウジングと、
該上部ハウジングと協働して光レセプタクルを形成する金属製の下部ハウジングと、
前記光レセプタクルに突出する光アセンブリと、
該光アセンブリと電気的に接続する電子回路を搭載する回路基板と、
前記光アセンブリを前記上部ハウジングと前記下部ハウジングに対して固定するための金属メッキされた樹脂製ホルダーとを備え、
前記上部ハウジング、前記下部ハウジング、及び前記樹脂製ホルダーは、前記搭載空間を電気的にシールドし、
前記樹脂製ホルダーは、前記光アセンブリを保持する保持部と、該保持部から突き出たラッチアームとを備え、
前記光トランシーバは、前記保持部の前記下部ハウジングに対向する縁に、該下部ハウジングに突き当たる導電性弾性体を備え、
前記樹脂製ホルダーが前記下部ハウジングによって、前記導電性弾性体を介して、前記上部ハウジングに対して押圧されて保持されていることを特徴とする光トランシーバ。 - 前記下部ハウジングは、前記樹脂製ホルダーの前記保持部が突き当たるポストを備え、
前記光トランシーバは、前記保持部と前記ポストとの間に導電性弾性体を備え、
前記下部ハウジングが前記ポストによって、前記導電性弾性体を介して、前記保持部を押圧して保持することを特徴とする請求項1に記載の光トランシーバ。 - 前記導電性弾性体は、流動体の状態で予め前記樹脂製ホルダーに塗布された後、高温で固化して形成されたものであることを特徴とする請求項1又は2に記載の光トランシーバ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56607504P | 2004-04-29 | 2004-04-29 | |
US63219404P | 2004-12-02 | 2004-12-02 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005129040A Division JP4192914B2 (ja) | 2004-04-29 | 2005-04-27 | 光トランシーバ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008250360A JP2008250360A (ja) | 2008-10-16 |
JP4502049B2 true JP4502049B2 (ja) | 2010-07-14 |
Family
ID=35464137
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005128288A Pending JP2005316475A (ja) | 2004-04-29 | 2005-04-26 | 光トランシーバ |
JP2005129040A Expired - Fee Related JP4192914B2 (ja) | 2004-04-29 | 2005-04-27 | 光トランシーバ |
JP2006173582A Pending JP2006251833A (ja) | 2004-04-29 | 2006-06-23 | 光トランシーバ |
JP2008189333A Active JP4502049B2 (ja) | 2004-04-29 | 2008-07-23 | 光トランシーバ |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005128288A Pending JP2005316475A (ja) | 2004-04-29 | 2005-04-26 | 光トランシーバ |
JP2005129040A Expired - Fee Related JP4192914B2 (ja) | 2004-04-29 | 2005-04-27 | 光トランシーバ |
JP2006173582A Pending JP2006251833A (ja) | 2004-04-29 | 2006-06-23 | 光トランシーバ |
Country Status (2)
Country | Link |
---|---|
US (6) | US7195403B2 (ja) |
JP (4) | JP2005316475A (ja) |
Families Citing this family (149)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7056032B2 (en) | 2001-09-17 | 2006-06-06 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
US7073955B1 (en) | 2001-09-17 | 2006-07-11 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
US7073954B1 (en) | 2001-09-17 | 2006-07-11 | Stratos International, Inc. | Transceiver assembly for use in fiber optics communications |
US20050238358A1 (en) * | 2004-04-22 | 2005-10-27 | Greta Light | Compact optical transceivers |
JP2005316475A (ja) * | 2004-04-29 | 2005-11-10 | Sumitomo Electric Ind Ltd | 光トランシーバ |
US7280724B2 (en) * | 2004-06-16 | 2007-10-09 | Sumitomo Electric Industries, Ltd. | Optical subassembly and optical transceiver installing the same |
US7416353B2 (en) * | 2004-10-05 | 2008-08-26 | Sumitomo Electric Industries, Ltd. | Heat dissipating mechanism of a pluggable optical transceiver |
US7406230B2 (en) * | 2004-10-05 | 2008-07-29 | Sumitomo Electric Industries, Ltd. | Optical transceiver with a pluggable function |
US7281862B2 (en) * | 2005-03-31 | 2007-10-16 | Intel Corporation | Optical device latching mechanism |
US7433193B2 (en) * | 2005-05-11 | 2008-10-07 | Cisco Technology, Inc. | Techniques for controlling a position of a transceiver module relative to a connector |
JP4513650B2 (ja) * | 2005-05-24 | 2010-07-28 | 日立電線株式会社 | 電子モジュール |
US20060285851A1 (en) * | 2005-06-16 | 2006-12-21 | Jiaxi Kan | Optical transceivers and methods to reduce interference in optical transceivers |
US20070036489A1 (en) * | 2005-08-15 | 2007-02-15 | Barbara Grzegorzewska | Industrial interconnect system incorporating transceiver module cage |
JP2007156461A (ja) * | 2005-12-01 | 2007-06-21 | Sumitomo Electric Ind Ltd | 光トランシーバ |
JP4730092B2 (ja) * | 2005-12-28 | 2011-07-20 | 日立電線株式会社 | ラッチ機構及びラッチ機構付き電子モジュール |
US7488120B2 (en) | 2005-12-29 | 2009-02-10 | Intel Corporation | Fiber optic module and optical subassembly with reduced electromagnetic interference |
JP4882481B2 (ja) * | 2006-04-24 | 2012-02-22 | 住友電気工業株式会社 | フレキシブル回路基板による接続構造を有する光モジュール |
JP4755502B2 (ja) * | 2006-02-02 | 2011-08-24 | 日本オプネクスト株式会社 | 光受信機 |
JP4735342B2 (ja) * | 2006-03-06 | 2011-07-27 | 住友電気工業株式会社 | ホストシステム |
JP4713384B2 (ja) | 2006-03-29 | 2011-06-29 | 富士通コンポーネント株式会社 | トランシーバモジュール |
US7377702B2 (en) * | 2006-05-23 | 2008-05-27 | Stratos International, Inc. | Cageless, pluggable optoelectronic device which enables belly-to-belly layouts |
CN101501545B (zh) * | 2006-06-21 | 2011-04-13 | 法尔科姆斯有限公司 | 光学连接器 |
US9319143B2 (en) * | 2006-10-13 | 2016-04-19 | Menara Networks, Inc. | 40G/100G/200G/400G pluggable optical transceivers with advanced functionality |
US7347630B1 (en) * | 2006-12-06 | 2008-03-25 | Avago Technologies Fiber Ip Pte Ltd. | Fiber optic transceiver having a floating transmitter port |
US7804696B2 (en) * | 2006-12-07 | 2010-09-28 | Finisar Corporation | Electromagnetic radiation containment in an electronic module |
US8718479B2 (en) * | 2007-02-16 | 2014-05-06 | Tyco Electronics Services Gmbh | Fiber optic cable assembly for optical transceiver |
JP2008227279A (ja) * | 2007-03-14 | 2008-09-25 | Sumitomo Electric Ind Ltd | プラガブル光トランシーバ |
JP4816519B2 (ja) * | 2007-03-14 | 2011-11-16 | 住友電気工業株式会社 | 光トランシーバ |
US7898808B2 (en) * | 2007-03-23 | 2011-03-01 | Finisar Corporation | Mechanisms for heat transfer in an optical transceiver module and card cage system |
JP2008249856A (ja) * | 2007-03-29 | 2008-10-16 | Fujitsu Ltd | 光送受信モジュール |
US7374347B1 (en) | 2007-05-07 | 2008-05-20 | Sumitomo Electric Industries, Ltd. | Optical pluggable transceiver with securable latching mechanism |
US7690849B2 (en) * | 2007-05-16 | 2010-04-06 | Protokraft, Llc | Fiber optic connector, active contact inserts therefor, and associated methods |
US9100124B2 (en) | 2007-05-24 | 2015-08-04 | Federal Law Enforcement Development Services, Inc. | LED Light Fixture |
WO2008148050A1 (en) | 2007-05-24 | 2008-12-04 | Federal Law Enforcement Development Services, Inc. | Led light interior room and building communication system |
US11265082B2 (en) | 2007-05-24 | 2022-03-01 | Federal Law Enforcement Development Services, Inc. | LED light control assembly and system |
US9294198B2 (en) | 2007-05-24 | 2016-03-22 | Federal Law Enforcement Development Services, Inc. | Pulsed light communication key |
US9455783B2 (en) | 2013-05-06 | 2016-09-27 | Federal Law Enforcement Development Services, Inc. | Network security and variable pulse wave form with continuous communication |
US9414458B2 (en) | 2007-05-24 | 2016-08-09 | Federal Law Enforcement Development Services, Inc. | LED light control assembly and system |
US9258864B2 (en) | 2007-05-24 | 2016-02-09 | Federal Law Enforcement Development Services, Inc. | LED light control and management system |
JP2009036843A (ja) * | 2007-07-31 | 2009-02-19 | Sumitomo Electric Ind Ltd | 光トランシーバ |
TWI340837B (en) * | 2007-08-01 | 2011-04-21 | Amtran Technology Co Ltd | Optical communication device |
US7665903B2 (en) * | 2007-10-03 | 2010-02-23 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical receptacle having an electrically isolating ring for electrically isolating the signal ground and the chassis ground in an optical transceiver module |
TWI398683B (zh) | 2007-10-05 | 2013-06-11 | Finisar Corp | 光電傳送接收模組 |
TWI363507B (en) | 2007-10-08 | 2012-05-01 | Finisar Corp | Pcb carrier for optical electrical device |
JP4915342B2 (ja) * | 2007-12-21 | 2012-04-11 | 住友電気工業株式会社 | 光トランシーバの放熱装置 |
JP4998249B2 (ja) * | 2007-12-21 | 2012-08-15 | 住友電気工業株式会社 | 光トランシーバの放熱装置 |
US7543997B1 (en) * | 2008-02-07 | 2009-06-09 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Electromagnetic interference (EMI) system and method for sealing fiber optic ports in an optical transceiver module |
US8319118B2 (en) * | 2008-02-22 | 2012-11-27 | Sumitomo Electric Industries, Ltd. | Optical transceiver providing independent spaces for electrical components and for optical components |
JP2009212121A (ja) * | 2008-02-29 | 2009-09-17 | Sharp Corp | プリント基板収容ケースおよび高周波部品、ならびにその製造方法 |
US7780361B2 (en) * | 2008-04-02 | 2010-08-24 | Ciena Corporation | Card guide and heatsink assemblies for pluggable electro-optic modules |
US8104977B2 (en) * | 2008-04-28 | 2012-01-31 | Sumitomo Electric Industries, Ltd. | Pluggable transceiver with bi-directional optical sub-assembly |
US8430572B2 (en) * | 2008-07-10 | 2013-04-30 | Adc Telecommunications, Inc. | Field terminable fiber optic connector assembly |
US8167505B2 (en) * | 2008-09-18 | 2012-05-01 | Sumitomo Electric Industries, Ltd. | Pluggable system between optical transceiver and host system |
JP5200857B2 (ja) * | 2008-10-28 | 2013-06-05 | 住友電装株式会社 | 電気接続箱 |
JP2010129667A (ja) * | 2008-11-26 | 2010-06-10 | Sumitomo Electric Ind Ltd | 光トランシーバ |
US7910839B2 (en) * | 2008-11-26 | 2011-03-22 | Itt Manufacturing Enterprises, Inc. | Electro-conductive contact structure for enclosure sealing in housings |
US8066437B2 (en) * | 2009-03-12 | 2011-11-29 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd | Optical transceiver module providing EMI shielding and electrical isolation between a signal ground and a chassis ground |
CN201392412Y (zh) * | 2009-03-13 | 2010-01-27 | 鸿富锦精密工业(深圳)有限公司 | 光电收发模组 |
US8285414B2 (en) * | 2009-03-31 | 2012-10-09 | International Business Machines Corporation | Method and system for evaluating a machine tool operating characteristics |
US8890773B1 (en) | 2009-04-01 | 2014-11-18 | Federal Law Enforcement Development Services, Inc. | Visible light transceiver glasses |
FR2944408B1 (fr) * | 2009-04-14 | 2012-09-21 | Eads Europ Aeronautic Defence | Boitier pour carte electronique embarquee |
US7854554B1 (en) * | 2009-05-18 | 2010-12-21 | Lockheed Martin Corporation | Fiber optic transceiver within a connector assembly |
JP4863319B2 (ja) * | 2009-05-19 | 2012-01-25 | 日本航空電子工業株式会社 | 光コネクタ |
US8535787B1 (en) | 2009-06-29 | 2013-09-17 | Juniper Networks, Inc. | Heat sinks having a thermal interface for cooling electronic devices |
US8035973B2 (en) * | 2009-08-31 | 2011-10-11 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Cage having a heat sink device secured thereto in a floating arrangement that ensures that continuous contact is maintained between the heat sink device and a parallel optical communications device secured to the cage |
US8534930B1 (en) | 2009-09-24 | 2013-09-17 | Juniper Networks, Inc. | Circuit boards defining openings for cooling electronic devices |
JP5736703B2 (ja) * | 2010-09-24 | 2015-06-17 | 住友電気工業株式会社 | 光コネクタアセンブリ |
US8821039B2 (en) | 2009-10-29 | 2014-09-02 | Sumitomo Electric Industries, Ltd. | Optical transceiver having optical receptacle arranged diagonally to longitudinal axis |
WO2011052802A2 (en) | 2009-10-29 | 2011-05-05 | Sumitomo Electric Industries, Ltd. | Pluggable optical transceiver and method for manufacturing the same |
JP5471788B2 (ja) * | 2010-04-30 | 2014-04-16 | 住友電気工業株式会社 | 光トランシーバ |
US9052477B2 (en) | 2009-10-29 | 2015-06-09 | Sumitomo Electric Industries, Ltd. | Optical transceiver with inner fiber set within tray securing thermal path from electronic device to housing |
US8223498B2 (en) | 2009-11-11 | 2012-07-17 | Juniper Networks, Inc. | Thermal interface members for removable electronic devices |
WO2011114432A1 (ja) * | 2010-03-15 | 2011-09-22 | 富士通オプティカルコンポーネンツ株式会社 | 通信モジュール及び通信装置 |
US8414309B2 (en) * | 2010-05-03 | 2013-04-09 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd | Receptacle for an optical transceiver module for protecting the module from airborne particles |
JP2012239025A (ja) * | 2011-05-11 | 2012-12-06 | Sumitomo Electric Ind Ltd | 光トランシーバ、及びホストコネクタカバー |
JP2013054214A (ja) * | 2011-09-05 | 2013-03-21 | Sumitomo Electric Ind Ltd | 光トランシーバ |
US8807846B2 (en) * | 2012-03-02 | 2014-08-19 | Sae Magnetics (H.K.) Ltd. | Pluggable optical transceiver |
JP2014016395A (ja) * | 2012-07-06 | 2014-01-30 | Sumitomo Electric Ind Ltd | 光トランシーバ |
US9304274B2 (en) | 2012-07-09 | 2016-04-05 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Metal strain relief device for use in an optical communications system, an optical fiber cable that employs the strain relief device, and a method |
US8911158B2 (en) * | 2012-07-09 | 2014-12-16 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Z-pluggable optical communications module, an optical communications system, and a method |
US9297972B2 (en) * | 2012-07-30 | 2016-03-29 | Glenair, Inc. | Advanced fiber-optic contact and method |
US8950954B2 (en) | 2012-07-31 | 2015-02-10 | Avago Technologies General Ip ( Singapore) Pte. Ltd. | Side-edge mountable parallel optical communications module, an optical communications system that incorporates the module, and a method |
JP5486061B2 (ja) * | 2012-09-20 | 2014-05-07 | 株式会社小松製作所 | 建設機械に搭載されるコントローラの接地構造 |
US8998504B2 (en) * | 2013-02-21 | 2015-04-07 | Avago Technologies General Ip (Singapore) Pte. Ltd. | User-configurable optical fiber link |
US10321607B2 (en) * | 2013-03-13 | 2019-06-11 | Yamaichi Electronics Co., Ltd. | Receptacle assembly and transceiver module assembly |
WO2014160096A1 (en) | 2013-03-13 | 2014-10-02 | Federal Law Enforcement Development Services, Inc. | Led light control and management system |
MY181289A (en) | 2013-04-24 | 2020-12-21 | Molex Llc | Connector system with thermal surface |
TWI486659B (zh) * | 2013-06-27 | 2015-06-01 | Formerica Optoelectronics Inc | 光電轉換器 |
JP5656099B1 (ja) * | 2013-06-28 | 2015-01-21 | Toto株式会社 | 光レセプタクル、フェルールおよびプラグフェルール |
JP2015041696A (ja) * | 2013-08-22 | 2015-03-02 | 三菱電機株式会社 | 基板、基板の接続構造、光モジュール、光通信装置、光通信システムおよび基板の接続方法 |
US20150117819A1 (en) * | 2013-10-31 | 2015-04-30 | Ming-Feng Ho | Pluggable optical transceiver module |
US9819107B2 (en) | 2013-11-26 | 2017-11-14 | Glenair, Inc. | Advanced panel mount connector and method |
US20150198941A1 (en) | 2014-01-15 | 2015-07-16 | John C. Pederson | Cyber Life Electronic Networking and Commerce Operating Exchange |
CN105518940A (zh) * | 2014-02-28 | 2016-04-20 | 日立金属株式会社 | 连接器以及附带连接器的缆线 |
US9960553B2 (en) * | 2014-03-27 | 2018-05-01 | Molex, Llc | Thermally efficient connector system |
CN103995324B (zh) * | 2014-05-22 | 2016-02-24 | 苏州旭创科技有限公司 | 光收发模块及其组装方法 |
US10534147B2 (en) * | 2014-06-27 | 2020-01-14 | Mitsubishi Electric Corporation | Optical transceiver |
US9720187B2 (en) | 2014-08-08 | 2017-08-01 | Panduit Corp. | Direct attached pluggable module with a cable attachment and actuation sub-assembly |
US9614619B1 (en) * | 2014-10-10 | 2017-04-04 | Google Inc. | Optical transceiver having separate transmitter and receiver lenses |
US9641254B1 (en) | 2014-10-10 | 2017-05-02 | Google Inc. | Heat dissipation approach in chip on board assembly by using stacked copper microvias |
CN107278345B (zh) * | 2015-01-27 | 2021-01-29 | 莫列斯有限公司 | 插头模块系统 |
US10331182B2 (en) | 2015-07-31 | 2019-06-25 | Hewlett Packard Enterprise Development Lp | Heat exchangers |
US20170046950A1 (en) | 2015-08-11 | 2017-02-16 | Federal Law Enforcement Development Services, Inc. | Function disabler device and system |
DE102016103663A1 (de) * | 2016-03-01 | 2017-09-07 | Kathrein-Werke Kg | Nodegehäuse und Node, enthaltend optionales Diplexfilter von außen steckbar |
US10455863B2 (en) | 2016-03-03 | 2019-10-29 | Altria Client Services Llc | Cartridge for electronic vaping device |
US10433580B2 (en) | 2016-03-03 | 2019-10-08 | Altria Client Services Llc | Methods to add menthol, botanic materials, and/or non-botanic materials to a cartridge, and/or an electronic vaping device including the cartridge |
US10368580B2 (en) | 2016-03-08 | 2019-08-06 | Altria Client Services Llc | Combined cartridge for electronic vaping device |
US10368581B2 (en) | 2016-03-11 | 2019-08-06 | Altria Client Services Llc | Multiple dispersion generator e-vaping device |
US10357060B2 (en) | 2016-03-11 | 2019-07-23 | Altria Client Services Llc | E-vaping device cartridge holder |
US20170258140A1 (en) * | 2016-03-11 | 2017-09-14 | Altria Client Services Llc | Multiple dispersion generator e-vaping device |
US11187859B2 (en) | 2017-06-28 | 2021-11-30 | Corning Research & Development Corporation | Fiber optic connectors and methods of making the same |
US11668890B2 (en) | 2017-06-28 | 2023-06-06 | Corning Research & Development Corporation | Multiports and other devices having optical connection ports with securing features and methods of making the same |
US10359577B2 (en) | 2017-06-28 | 2019-07-23 | Corning Research & Development Corporation | Multiports and optical connectors with rotationally discrete locking and keying features |
US11300746B2 (en) | 2017-06-28 | 2022-04-12 | Corning Research & Development Corporation | Fiber optic port module inserts, assemblies and methods of making the same |
CA3068166A1 (en) | 2017-06-28 | 2019-01-03 | Corning Research & Development Corporation | Multiports and devices having a connector port with a rotating securing feature |
CN110730599B (zh) | 2017-07-19 | 2021-07-09 | 苏州旭创科技有限公司 | 光模块 |
CN110658599B (zh) | 2017-07-19 | 2024-04-02 | 苏州旭创科技有限公司 | 光模块 |
US11226453B2 (en) * | 2017-08-09 | 2022-01-18 | Commscope Technologies Llc | Board mounted active component assembly |
US10541758B2 (en) | 2017-09-18 | 2020-01-21 | Cisco Technology, Inc. | Power delivery through an optical system |
US11431420B2 (en) | 2017-09-18 | 2022-08-30 | Cisco Technology, Inc. | Power delivery through an optical system |
US10212864B1 (en) * | 2018-05-22 | 2019-02-19 | Ohio Associated Enterprises, Llc | Electrically-conductive gasket |
US20190391349A1 (en) * | 2018-06-20 | 2019-12-26 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
TWM575927U (zh) * | 2018-06-22 | 2019-03-21 | 盔甲奈米科技股份有限公司 | 插頭組件 |
WO2020024109A1 (en) | 2018-07-31 | 2020-02-06 | Lumentum Operations Llc | Electromagnetic interference leakage reduction for a pluggable optical module |
US10641967B1 (en) | 2018-11-16 | 2020-05-05 | Corning Research & Development Corporation | Multiport assemblies including a modular adapter support array |
US10768382B2 (en) | 2018-11-29 | 2020-09-08 | Corning Research & Development Corporation | Multiport assemblies including access apertures and a release tool |
CA3125271C (en) | 2018-12-28 | 2024-02-27 | Corning Research & Development Corporation | Multiport assemblies including mounting features or dust plugs |
TWI735857B (zh) * | 2019-03-29 | 2021-08-11 | 佳必琪國際股份有限公司 | 小型可插拔連接器殼體結構 |
JP7370160B2 (ja) * | 2019-04-12 | 2023-10-27 | 日本ルメンタム株式会社 | 光伝送装置 |
US10754111B1 (en) * | 2019-04-22 | 2020-08-25 | The Boeing Company | Method for modifying small form factor pluggable transceiver for avionics applications |
WO2020242847A1 (en) | 2019-05-31 | 2020-12-03 | Corning Research & Development Corporation | Multiports and other devices having optical connection ports with sliding actuators and methods of making the same |
US11294133B2 (en) | 2019-07-31 | 2022-04-05 | Corning Research & Development Corporation | Fiber optic networks using multiports and cable assemblies with cable-to-connector orientation |
US11487073B2 (en) | 2019-09-30 | 2022-11-01 | Corning Research & Development Corporation | Cable input devices having an integrated locking feature and assemblies using the cable input devices |
EP3805827A1 (en) | 2019-10-07 | 2021-04-14 | Corning Research & Development Corporation | Fiber optic terminals and fiber optic networks having variable ratio couplers |
US11650388B2 (en) | 2019-11-14 | 2023-05-16 | Corning Research & Development Corporation | Fiber optic networks having a self-supporting optical terminal and methods of installing the optical terminal |
WO2021150601A1 (en) * | 2020-01-21 | 2021-07-29 | Commscope Technologies Llc | Latching system unitarily molded with a re-enterable enclosure |
US11536921B2 (en) | 2020-02-11 | 2022-12-27 | Corning Research & Development Corporation | Fiber optic terminals having one or more loopback assemblies |
US11474312B2 (en) * | 2020-02-28 | 2022-10-18 | Ii-Vi Delaware, Inc. | Optoelectronic module for receiving multiple optical connectors |
WO2022037226A1 (zh) * | 2020-08-18 | 2022-02-24 | 青岛海信宽带多媒体技术有限公司 | 一种光模块 |
JP7480646B2 (ja) | 2020-09-07 | 2024-05-10 | 住友電気工業株式会社 | 光トランシーバ |
US11199669B1 (en) | 2020-09-24 | 2021-12-14 | Hewlett Packard Enterprise Development Lp | Modular faceplate optical sub-assembly |
US11604320B2 (en) | 2020-09-30 | 2023-03-14 | Corning Research & Development Corporation | Connector assemblies for telecommunication enclosures |
JP2022077866A (ja) * | 2020-11-12 | 2022-05-24 | 住友電気工業株式会社 | 光トランシーバ |
US11686913B2 (en) | 2020-11-30 | 2023-06-27 | Corning Research & Development Corporation | Fiber optic cable assemblies and connector assemblies having a crimp ring and crimp body and methods of fabricating the same |
US11880076B2 (en) | 2020-11-30 | 2024-01-23 | Corning Research & Development Corporation | Fiber optic adapter assemblies including a conversion housing and a release housing |
US11927810B2 (en) | 2020-11-30 | 2024-03-12 | Corning Research & Development Corporation | Fiber optic adapter assemblies including a conversion housing and a release member |
US11994722B2 (en) | 2020-11-30 | 2024-05-28 | Corning Research & Development Corporation | Fiber optic adapter assemblies including an adapter housing and a locking housing |
US11947167B2 (en) | 2021-05-26 | 2024-04-02 | Corning Research & Development Corporation | Fiber optic terminals and tools and methods for adjusting a split ratio of a fiber optic terminal |
TWI836782B (zh) * | 2021-12-12 | 2024-03-21 | 美商莫仕有限公司 | 連接器組件及插座連接器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0397123U (ja) * | 1990-01-25 | 1991-10-04 | ||
JP2001185754A (ja) * | 1999-12-22 | 2001-07-06 | Mitsubishi Electric Corp | 光電子機器 |
JP2003270492A (ja) * | 2002-03-13 | 2003-09-25 | Hitachi Cable Ltd | 光送受信モジュール |
JP2004096054A (ja) * | 2002-08-30 | 2004-03-25 | Hitachi Hybrid Network Co Ltd | 光伝送モジュール |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US645991A (en) * | 1899-10-05 | 1900-03-27 | Henry W Yerrington | Drawbridge-gate. |
JPH02143498A (ja) * | 1988-11-24 | 1990-06-01 | Fujitsu Ltd | 回路基板のシールド構造 |
JPH0536312Y2 (ja) * | 1989-05-15 | 1993-09-14 | ||
JPH02303090A (ja) * | 1989-05-17 | 1990-12-17 | Seiko Epson Corp | 多層基板 |
JP3326959B2 (ja) * | 1994-04-25 | 2002-09-24 | 松下電器産業株式会社 | 光ファイバモジュール |
US5879173A (en) * | 1995-01-13 | 1999-03-09 | Methode Electronics, Inc. | Removable transceiver module and receptacle |
GB2297007B (en) * | 1995-01-13 | 1999-05-05 | Methode Electronics Inc | Removable transceiver module and receptacle |
SE504811C2 (sv) * | 1995-08-21 | 1997-04-28 | Ericsson Telefon Ab L M | Kopplingsdon samt anordning vid elektrooptisk krets |
US6333917B1 (en) * | 1998-08-19 | 2001-12-25 | Nortel Networks Limited | Method and apparatus for red (random early detection) and enhancements. |
JP3538834B2 (ja) * | 1999-03-19 | 2004-06-14 | 住友電気工業株式会社 | 光データリンク |
US6873800B1 (en) * | 1999-05-26 | 2005-03-29 | Jds Uniphase Corporation | Hot pluggable optical transceiver in a small form pluggable package |
US6538196B1 (en) * | 1999-10-28 | 2003-03-25 | Ericsson Inc. | Electric module structure formed with a polymer shrunk material |
DE10001680C1 (de) * | 2000-01-12 | 2001-08-23 | Infineon Technologies Ag | Mehrkanalige optische Koppelanordnung |
US6540412B2 (en) * | 2000-02-10 | 2003-04-01 | Sumitomo Electric Industries, Ltd. | Optical transceiver |
JP2001296458A (ja) * | 2000-02-10 | 2001-10-26 | Sumitomo Electric Ind Ltd | 光通信モジュール |
US6721316B1 (en) * | 2000-02-14 | 2004-04-13 | Cisco Technology, Inc. | Flexible engine and data structure for packet header processing |
JP2001231759A (ja) * | 2000-02-24 | 2001-08-28 | Tomy Ltd | 脳電極固定装置 |
US6851869B2 (en) * | 2000-08-04 | 2005-02-08 | Cool Options, Inc. | Highly thermally conductive electronic connector |
JP2002098844A (ja) * | 2000-09-25 | 2002-04-05 | Sumitomo Electric Ind Ltd | ヒータモジュール及び光導波路モジュール |
US6846115B1 (en) * | 2001-01-29 | 2005-01-25 | Jds Uniphase Corporation | Methods, apparatus, and systems of fiber optic modules, elastomeric connections, and retention mechanisms therefor |
US6371787B1 (en) * | 2001-03-07 | 2002-04-16 | International Business Machines Corporation | Pull-to-release type latch mechanism for removable small form factor electronic modules |
GB2373374B (en) * | 2001-03-15 | 2004-03-17 | Agilent Technologies Inc | Novel fiber optic transceiver module |
US6796715B2 (en) * | 2001-04-14 | 2004-09-28 | E20 Communications, Inc. | Fiber optic modules with pull-action de-latching mechanisms |
US6901593B2 (en) * | 2001-05-08 | 2005-05-31 | Nortel Networks Limited | Active queue management with flow proportional buffering |
JP3979053B2 (ja) * | 2001-09-28 | 2007-09-19 | 住友電気工業株式会社 | 光モジュール |
US6439918B1 (en) * | 2001-10-04 | 2002-08-27 | Finisar Corporation | Electronic module having an integrated latching mechanism |
TW508033U (en) * | 2001-10-12 | 2002-10-21 | Hon Hai Prec Ind Co Ltd | Optical transceiver module |
TW582559U (en) * | 2001-10-17 | 2004-04-01 | Hon Hai Prec Ind Co Ltd | Optical transceiver |
US6430053B1 (en) * | 2001-12-13 | 2002-08-06 | Stratos Lightwave | Pluggable transceiver module having rotatable release and removal lever with living hinge |
US20030161593A1 (en) * | 2002-02-27 | 2003-08-28 | Optronx, Inc. | Thermal pads for surface mounting of optical devices |
US6890206B2 (en) * | 2002-03-05 | 2005-05-10 | Jds Uniphase Corporation | Optical transceiver latch |
JP4237975B2 (ja) * | 2002-04-24 | 2009-03-11 | 株式会社神戸製鋼所 | 電子機器用アルミニウム板及びこれを用いた電子機器用成形品 |
JP2004012672A (ja) * | 2002-06-05 | 2004-01-15 | Hitachi Cable Ltd | 光送受信モジュール |
US6935882B2 (en) * | 2002-06-21 | 2005-08-30 | Jds Uniphase Corporation | Pluggable optical transceiver latch |
JP2004103743A (ja) * | 2002-09-06 | 2004-04-02 | Sumitomo Electric Ind Ltd | 位置決め部材、及び光モジュールとその製造方法 |
US6999323B1 (en) * | 2002-10-17 | 2006-02-14 | Finisar Corporation | Electromagnetic interference containment transceiver module |
JP4134695B2 (ja) * | 2002-11-21 | 2008-08-20 | 住友電気工業株式会社 | 光モジュール |
US6824416B2 (en) * | 2003-04-30 | 2004-11-30 | Agilent Technologies, Inc. | Mounting arrangement for plug-in modules |
US7023703B2 (en) * | 2003-10-20 | 2006-04-04 | Molex Incorporated | Module retention latch assembly |
US7090523B2 (en) * | 2004-01-06 | 2006-08-15 | Tyco Electronics Corporation | Release mechanism for transceiver module assembly |
US7059779B2 (en) * | 2004-02-19 | 2006-06-13 | Albert Wooi Quan Khor | Optical fiber receptacle adaptor |
US20050185897A1 (en) * | 2004-02-25 | 2005-08-25 | Infineon Technologies North America Corp. | Small form factor transceiver front panel adapter |
US7178996B2 (en) * | 2004-04-09 | 2007-02-20 | Jds Uniphase Corporation | High density optical transceiver |
JP2005316475A (ja) * | 2004-04-29 | 2005-11-10 | Sumitomo Electric Ind Ltd | 光トランシーバ |
-
2005
- 2005-04-26 JP JP2005128288A patent/JP2005316475A/ja active Pending
- 2005-04-27 US US11/115,392 patent/US7195403B2/en active Active
- 2005-04-27 US US11/115,388 patent/US20050286837A1/en not_active Abandoned
- 2005-04-27 JP JP2005129040A patent/JP4192914B2/ja not_active Expired - Fee Related
- 2005-04-28 US US11/116,435 patent/US7213980B2/en active Active
-
2006
- 2006-06-23 JP JP2006173582A patent/JP2006251833A/ja active Pending
- 2006-10-26 US US11/586,633 patent/US7407332B2/en not_active Expired - Fee Related
-
2007
- 2007-01-05 US US11/649,783 patent/US7357582B2/en active Active
-
2008
- 2008-07-09 US US12/216,702 patent/US20090067849A1/en not_active Abandoned
- 2008-07-23 JP JP2008189333A patent/JP4502049B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0397123U (ja) * | 1990-01-25 | 1991-10-04 | ||
JP2001185754A (ja) * | 1999-12-22 | 2001-07-06 | Mitsubishi Electric Corp | 光電子機器 |
JP2003270492A (ja) * | 2002-03-13 | 2003-09-25 | Hitachi Cable Ltd | 光送受信モジュール |
JP2004096054A (ja) * | 2002-08-30 | 2004-03-25 | Hitachi Hybrid Network Co Ltd | 光伝送モジュール |
Also Published As
Publication number | Publication date |
---|---|
JP4192914B2 (ja) | 2008-12-10 |
US20050286837A1 (en) | 2005-12-29 |
US7213980B2 (en) | 2007-05-08 |
JP2008250360A (ja) | 2008-10-16 |
US7195403B2 (en) | 2007-03-27 |
US20070041732A1 (en) | 2007-02-22 |
US20070110374A1 (en) | 2007-05-17 |
JP2005316484A (ja) | 2005-11-10 |
US20050281514A1 (en) | 2005-12-22 |
JP2005316475A (ja) | 2005-11-10 |
US20090067849A1 (en) | 2009-03-12 |
US20050286838A1 (en) | 2005-12-29 |
JP2006251833A (ja) | 2006-09-21 |
US7407332B2 (en) | 2008-08-05 |
US7357582B2 (en) | 2008-04-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4502049B2 (ja) | 光トランシーバ | |
US7406230B2 (en) | Optical transceiver with a pluggable function | |
US7125261B2 (en) | Optical transceiver with a pluggable function | |
JP3740748B2 (ja) | 光ファイバモジュール | |
EP2281345B1 (en) | Transceiver module with dual printed circuit boards | |
JP4424319B2 (ja) | 光トランシーバ | |
JP2007156461A (ja) | 光トランシーバ | |
CN111952817A (zh) | 高速线端连接器制造方法 | |
US6863451B2 (en) | Optical module | |
US20230341640A1 (en) | Optical module | |
CN110927894B (zh) | 光收发器 | |
JP4192960B2 (ja) | 光トランシーバ | |
CN115097581A (zh) | 一种光模块 | |
US20030086244A1 (en) | Flexible cable stiffener for an optical transceiver | |
JP3803264B2 (ja) | 光トランシーバ及び光トランシーバの製造方法 | |
JP4882481B2 (ja) | フレキシブル回路基板による接続構造を有する光モジュール | |
JP4192959B2 (ja) | 光トランシーバ | |
CN216285842U (zh) | 一种光模块 | |
JP2015019021A (ja) | 光トランシーバ | |
JP2005269474A (ja) | 光トランシーバ | |
WO2014203384A1 (ja) | 光モジュールおよびコネクタ一体型光モジュール | |
JP2005223169A (ja) | パッケージ素子と回路基板の接続構造および光モジュール |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080723 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100330 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100412 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4502049 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130430 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130430 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140430 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |