TWM575927U - 插頭組件 - Google Patents
插頭組件 Download PDFInfo
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- TWM575927U TWM575927U TW107213210U TW107213210U TWM575927U TW M575927 U TWM575927 U TW M575927U TW 107213210 U TW107213210 U TW 107213210U TW 107213210 U TW107213210 U TW 107213210U TW M575927 U TWM575927 U TW M575927U
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
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- H—ELECTRICITY
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
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- H—ELECTRICITY
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4278—Electrical aspects related to pluggable or demountable opto-electronic or electronic elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
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- Engineering & Computer Science (AREA)
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- General Physics & Mathematics (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
本創作公開一種插頭組件,係設置於一交換器中,該插頭組件包括一本體、一上蓋及一電路板,所述上蓋裝設於本體的上方,所述電路板的兩側開設有第一接觸部,所述電路板的一面上開設有複數第二接觸部,所述第一接觸部及第二接觸部與本體及上蓋互相接觸,所述電路板上開設有至少一開孔,所述開孔內具有一固定部,所述固定部穿過開孔並與本體及上蓋相接觸;本創作插頭組件藉由在電路板上之第一接觸部、複數第二接觸部及開孔內之固定部與本體及上蓋相接觸,以此增加電路板與本體及上蓋間之接觸面積,使本創作插頭組件運作時所產生的熱,能快速傳遞至本體及上蓋,進而提高本創作插頭組件之散熱效率。
Description
本創作涉及一種插頭組件,尤其是涉及一種具有散熱功能的插頭組件。
習知的四通道小型可插拔接口(Quad Small Form-factor Pluggable,QSFP)係透過一與其組裝並互相接觸的外殼配合以達到散熱的功效,該外殼上具有複數散熱鰭片,當QSFP在運作時,所產生的熱能透過熱傳導的方式傳遞到外殼上,再利用外殼上面的散熱鰭片達到散熱目的。
然而,該散熱方式需另外組裝一外殼,進而增加了QSFP的體積及製造成本。
因此,有必要提供一種新型插頭組件,使得插頭組件本身即具有良好的散熱效果。
本創作之目的提供一種插頭組件,該插頭組件具有散熱的功能。
為了實現以上目的,本創作公開一種插頭組件,係設置於一交換器中,該插頭組件包括一本體、一上蓋及一電路板,所述上蓋裝設於本體的上方,所述電路板的兩側開設有第一接觸部,所述電路板的一面上開設有複數第二接觸部,所述第一接觸部及第二接觸部與本體及上蓋互相接觸,所述電路板上開設有至少一開孔,所述開孔內具有一固定部,所述固定部穿過開孔並與本體及上蓋相接觸。
承上所述,本創作插頭組件藉由在電路板上之第一接觸部、複數第二接觸部及開孔內之固定部與本體及上蓋相接觸,以此增加電路板與本體及上蓋間之接觸面積,使本創作插頭組件運作時所產生的熱,能快速傳遞至本體及上蓋,進而提高本創作插頭組件之散熱效率。
為詳細說明本創作之技術內容、構造特徵、所達成的目的及功效,以下茲例舉實施例並配合圖式詳予說明。
請參閱第一圖及第二圖,本創作插頭組件100為一四通道小型可插拔接口(Quad Small Form-factor Pluggable,QSFP),係設置於一交換器(圖中未示)中,該插頭組件100包括一本體1、一上蓋2及一電路板4。
請參閱第二圖及第三圖,所述本體1開設有複數上下貫穿之下固定孔11,所述每一下固定孔11內皆具有一固定件111,所述本體1的兩側邊上皆具有向內凹陷形成的下固定槽12,所述下固定槽12具有一向下凹陷形成的第一下卡固槽121,所述下固定槽12的前部具有一向下凹陷形成的第二下卡固槽122,所述本體1的後端具有一向下凹陷形成的下外接口13。
所述上蓋2裝設於本體1的上方,所述上蓋2的上表面後端設有一凸台21,所述凸台21上設有複數散熱鰭片211,所述每一散熱鰭片211上具有至少一圓柱2111,所述圓柱2111可以增加散熱面積,也有助於壓鑄製程的材料流動,本實施例中,設有七個散熱鰭片211,每一散熱鰭片211上皆具有二個圓柱2111,所述上蓋2的下表面上設有一第一導熱件22,本實施例中,該第一導熱件22為一銅片,所述第一導熱件22上具有一第二導熱件221,本實施例中,該第二導熱件221為散熱膏或散熱貼,所述第一導熱件22開設有一容置槽222,所述容置槽222內具有一設於上蓋2之下表面並向後方凸伸之導熱管23,本實施例中,所述導熱管23為一銅管,所述上蓋2之下表面還開設有複數上固定孔24,所述每一上固定孔24皆對應本體1之每一下固定孔11而設,當上蓋2組裝於本體1上時,以複數固定件111穿過每一下固定孔11及所對應的上固定孔24,如此將上蓋2固定於本體1上。
所述上蓋2的兩側皆具有向內凹陷形成的上固定槽25,所述上固定槽25對應下固定槽12而設,並與其組合形成一固定槽,所述上固定槽25具有一凹陷形成的第一上卡固槽251,所述第一上卡固槽251對應第一下卡固槽121而設,所述上固定槽25的前部具有一凹陷形成的第二上卡固槽252,所述第二上卡固槽252對應第二下卡固槽122而設,所述上蓋2的後端具有一凹陷形成的上外接口26,所述上外接口26對應下外接口13而設,當上蓋2組裝於本體1上時,所述上外接口26與下外接口13組合成一外接口,該外接口可以使外接線纜(圖中未示)通過,使外接線纜能與本創作插頭組件100中之電路板4連結,所述上蓋2內的兩側皆具有一凹陷形成的第一容置槽27,所述第一容置槽27上還具有一向內凸伸形成的卡持塊271,所述上蓋2內的兩側皆具有一向下凹陷形成的第二容置槽28,所述第二容置槽28內設置有一回彈件281,本實施例中,該回彈件281為彈簧,所述第二容置槽28的外壁上開設有一開口282。
本創作插頭組件100還具有一設置於上固定槽25及下固定槽12中的退鎖件3,所述退鎖件3的兩側皆具有一向上凸伸形成的第一上卡固塊31,所述第一上卡固塊31對應第一上卡固槽251而設並卡固於其中,所述退鎖件3的兩側皆具有一向下凸伸形成的第一下卡固塊32,所述第一下卡固塊32對應第一下卡固槽121而設並卡固於其中,所述退鎖件3的兩側前端皆具有一上下凸伸形成的第二卡固塊33,所述第二卡固塊33的上部設於第二上卡固槽252內,所述第二卡固塊33的下部設於第二下卡固槽122內,所述第二卡固塊33向前凸伸形成一凸塊34,所述退鎖件3的兩側皆具有一向內凸伸形成的抵頂塊35,所述抵頂塊35經過開口282組裝於第二容置槽28內並抵頂住回彈件281,所述退鎖件3後端上固設有一拉環36。
當本創作插頭組件100組裝於一交換器中時(圖中未示),所述本創作插頭組件100進入交換器中,此時本體1及上蓋2之兩側受交換器中之夾持部固定住,使得本創作插頭組件100得與交換器連接;當本創作插頭組件100於交換器中退出時(圖中未示),先將拉環36向後拉,由於本體1及上蓋2之兩側被交換器中的夾持部固定住而無法移動,此時抵頂塊35將回彈件281向後壓,同時所述回彈件281產生一向前的回彈力將抵頂塊35抵頂住,當拉環36持續向後拉時,由於抵頂塊35受回彈件281的回彈力影響而無法持續向後位移,使得退鎖件3之兩側向外展開,從而使所述凸塊34撐開交換器中之夾持部,使得插頭組件100得以向外退出。
請參閱第二圖及第四圖,所述電路板4的兩側裝設於上蓋2兩側之第一容置槽27中並與第二導熱件221互相接觸,所述電路板4上具有向內凹陷形成的卡持槽41,所述卡持槽41對應卡持塊271而設,所述卡持塊271組裝於卡持槽41中,如此將電路板4裝設於上蓋2中,所述電路板4的兩側開設有第一接觸部42,所述第一接觸部42為電路板4向外裸露出的銅箔,所述電路板4的一面上開設有複數第二接觸部43,所述第二接觸部43為在電路板4上所形成的複數圈形銅箔,所述電路板4上還開設有至少一開孔44,所述開孔44內具有一固定部441,該固定部441為一由本體1向上凸伸至上蓋2或由上蓋2向下凸伸至本體所形成之部件,所述固定部441穿過開孔44並與本體1及上蓋2相接觸。
當本創作插頭組件100與一交換器組裝並運作時,所述電路板4因電流的流動而發熱,此時所述第一接觸部42與本體1及上蓋2互相接觸,所述第二接觸部43與第二導熱件221互相接觸,如此將電路板4上的熱能經由第二導熱件221傳導至第一導熱件22及導熱管23上,使熱透過上蓋2傳導至本創作插頭組件100的殼體表面及散熱鰭片211上,所述開孔44能經由固定部441將熱傳導至本體1及上蓋2,所述本創作插頭組件100的殼體表面再與組裝之交換器的內壁接觸,將熱傳導至交換器上,而交換器上的散熱鰭片透過交換器中的風扇,將外部冷空氣抽入交換器內,對交換器上的散熱鰭片與外部空氣進行強制對流以達到散熱的功效。
承上所述,本創作插頭組件100藉由在電路板4上之第一接觸部42、複數第二接觸部43及開孔44內之固定部441與本體1及上蓋2相接觸,以此方法增加電路板4與本體1及上蓋2間之接觸面積,使本創作插頭組件100運作時所產生的熱,能快速傳遞至本體1及上蓋2,進而提高本創作插頭組件100之散熱效率。
100‧‧‧插頭組件
1‧‧‧本體
11‧‧‧下固定孔
111‧‧‧固定件
12‧‧‧下固定槽
121‧‧‧第一下卡固槽
122‧‧‧第二下卡固槽
13‧‧‧下外接口
2‧‧‧上蓋
21‧‧‧凸台
211‧‧‧散熱鰭片
2111‧‧‧圓柱
22‧‧‧第一導熱件
221‧‧‧第二導熱件
222‧‧‧容置槽
23‧‧‧導熱管
24‧‧‧上固定孔
25‧‧‧上固定槽
251‧‧‧第一上卡固槽
252‧‧‧第二上卡固槽
26‧‧‧上外接口
27‧‧‧第一容置槽
271‧‧‧卡持塊
28‧‧‧第二容置槽
281‧‧‧回彈件
282‧‧‧開口
3‧‧‧退鎖件
31‧‧‧第一上卡固塊
32‧‧‧第一下卡固塊
33‧‧‧第二卡固塊
34‧‧‧凸塊
35‧‧‧抵頂塊
36‧‧‧拉環
4‧‧‧電路板
41‧‧‧卡持槽
42‧‧‧第一接觸部
43‧‧‧第二接觸部
44‧‧‧開孔
441‧‧‧固定部
第一圖係本創作插頭組件之立體圖。 第二圖係本創作插頭組件之立體分解圖。 第三圖係本創作插頭組件的上蓋之下視圖。 第四圖係本創作插頭組件的電路板之平面圖。
Claims (14)
- 一種插頭組件,係設置於一交換器中,包括:一本體;一上蓋,裝設於本體的上方;一電路板,裝設於上蓋中,所述電路板的兩側開設有第一接觸部,所述電路板的一面上開設有複數第二接觸部,所述第一接觸部及第二接觸部與本體及上蓋互相接觸,所述電路板上開設有至少一開孔,所述開孔內具有一固定部,所述固定部穿過開孔並與本體及上蓋相接觸。
- 如申請專利範圍第1項所述之插頭組件,其中所述第一接觸部為電路板向外裸露出的銅箔,所述第二接觸部為一在電路板上所形成的複數圈形銅箔,所述第一接觸部及第二接觸部與本體及上蓋互相接觸。
- 如申請專利範圍第1項所述之插頭組件,其中所述固定部為一由本體向上凸伸至上蓋所形成之部件。
- 如申請專利範圍第1項所述之插頭組件,其中所述固定部為一由上蓋向下凸伸至本體所形成之部件。
- 如申請專利範圍第1項所述之插頭組件,其中所述上蓋內的兩側皆具有一凹陷形成的第一容置槽,所述第一容置槽上還具有一向內凸伸形成的卡持塊,電路板的兩側裝設於上蓋兩側之第一容置槽中,所述電路板上具有向內凹陷形成的卡持槽,所述卡持槽對應卡持塊而設,所述卡持塊組裝於卡持槽中,如此將電路板裝設於上蓋中。
- 如申請專利範圍第1項所述之插頭組件,其中所述上蓋的上表面後端設有複數散熱鰭片,所述上蓋的下表面上設有一第一導熱件,所述第一導熱件上具有一第二導熱件,所述第一導熱件開設有一容置槽,所述容置槽內具有一設於上蓋之下表面並向後方凸伸之導熱管。
- 如申請專利範圍第6項所述之插頭組件,其中所述每一散熱鰭片上具有至少一圓柱。
- 如申請專利範圍第6項所述之插頭組件,其中所述第一導熱件為一銅片,第二導熱件為散熱膏或散熱貼,所述導熱管為一銅管。
- 如申請專利範圍第1項所述之插頭組件,其中所述本體開設有複數上下貫穿之下固定孔,所述每一下固定孔內皆具有一固定件,所述上蓋之下表面還開設有複數上固定孔,所述每一上固定孔皆對應每一下固定孔而設,當上蓋組裝於本體上時,以複數固定件穿過每一下固定孔及所對應的上固定孔,以將上蓋固定於本體上。
- 如申請專利範圍第1項所述之插頭組件,其中所述本體的後端具有一向下凹陷形成的下外接口,所述上蓋的後端具有一凹陷形成的上外接口,所述上外接口對應下外接口而設,當上蓋組裝於本體上時,所述上外接口與下外接口組合成一外接口。
- 如申請專利範圍第1項所述之插頭組件,其中所述本體的兩側邊上皆具有向內凹陷形成的下固定槽,所述下固定槽具有一向下凹陷形成的第一下卡固槽,所述下固定槽的前部具有一向下凹陷形成的第二下卡固槽,所述上蓋的兩側皆具有向內凹陷形成的上固定槽,所述上固定槽對應下固定槽而設,並與其組合形成一固定槽,所述上固定槽具有一凹陷形成的第一上卡固槽,所述第一上卡固槽對應第一下卡固槽而設,所述上固定槽的前部具有一凹陷形成的第二上卡固槽,所述第二上卡固槽對應第二下卡固槽而設。
- 如申請專利範圍第11項所述之插頭組件,其中所述上蓋內的兩側皆具有一向下凹陷形成的第二容置槽,所述第二容置槽內設置有一回彈件,所述第二容置槽的外壁上開設有一開口。
- 如申請專利範圍第12項所述之插頭組件,其中所述回彈件為彈簧。
- 如申請專利範圍第12項所述之插頭組件,其中還進一步具有一設置於上固定槽及下固定槽中的退鎖件,所述退鎖件的兩側皆具有一向上凸伸形成的第一上卡固塊,所述第一上卡固塊對應第一上卡固槽而設並卡固於其中,所述退鎖件的兩側皆具有一向下凸伸形成的第一下卡固塊,所述第一下卡固塊對應第一下卡固槽而設並卡固於其中,所述退鎖件的兩側前端皆具有一上下凸伸形成的第二卡固塊,所述第二卡固塊的上部設於第二上卡固槽內,所述第二卡固塊的下部設於第二下卡固槽內,所述第二卡固塊向前凸伸形成一凸塊,所述退鎖件的兩側皆具有一向內凸伸形成的抵頂塊,所述抵頂塊經過開口組裝於第二容置槽內並抵頂住回彈件,所述退鎖件後端上固設有一拉環。
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JP3222907U (ja) | 2019-09-05 |
JP3222906U (ja) | 2019-09-05 |
US10674633B2 (en) | 2020-06-02 |
CN208723185U (zh) | 2019-04-09 |
EP3588156B1 (en) | 2021-08-04 |
US10617037B2 (en) | 2020-04-07 |
EP3588156A1 (en) | 2020-01-01 |
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