CN208723185U - 插头组件 - Google Patents
插头组件 Download PDFInfo
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- CN208723185U CN208723185U CN201821585005.5U CN201821585005U CN208723185U CN 208723185 U CN208723185 U CN 208723185U CN 201821585005 U CN201821585005 U CN 201821585005U CN 208723185 U CN208723185 U CN 208723185U
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- 230000004308 accommodation Effects 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000004519 grease Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 238000010079 rubber tapping Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000000429 assembly Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4278—Electrical aspects related to pluggable or demountable opto-electronic or electronic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
本实用新型公开一种插头组件,是设置于一交换器中,所述插头组件包含一本体、一上盖及一电路板,所述电路板的两侧开设有第一接触部,所述电路板的一面上开设有数个第二接触部,所述第一接触部及所述第二接触部与所述本体及所述上盖互相接触,所述电路板上开设有至少一开孔,所述开孔内具有一固定部,所述固定部穿过所述开孔并与所述本体及所述上盖相接触;本实用新型插头组件借由在所述电路板上的第一接触部、所述数个第二接触部及所述开孔内的固定部与所述本体及所述上盖相接触,以此增加所述电路板与所述本体及所述上盖间的接触面积,使本实用新型插头组件运作时所产生的热,能快速传递至所述本体及所述上盖,进而提高本实用新型插头组件的散热效率。
Description
技术领域
本实用新型涉及一种插头组件,尤其是涉及一种具有散热功能的插头组件。
背景技术
现有的四通道小型可插拔接口(Quad Small Form-factor Pluggable,QSFP)是透过一与其组装并互相接触的外壳配合以达到散热的功效,所述外壳上具有数个散热鳍片,当QSFP在运作时,所产生的热能透过热传导的方式传递到所述外壳上,再利用所述外壳上面的所述散热鳍片达到散热目的。
然而,所述散热方式需另外组装一外壳,进而增加了QSFP的体积及制造成本。
因此,有必要提供一种新型插头组件,使得插头组件本身即具有良好的散热效果。
实用新型内容
本实用新型的目的是针对现有技术存在的缺陷和不足提供一种具有散热功能的插头组件。
为实现上述目的,本实用新型公开一种插头组件,是设置于一交换器中,其特征在于:包含一本体、一上盖和一电路板;所述上盖,装设于本体的上方,所述电路板装设于所述上盖中,所述电路板的两侧开设有第一接触部,所述电路板的一面上开设有数个第二接触部,所述第一接触部及所述第二接触部与所述本体及所述上盖互相接触,所述电路板上开设有至少一开孔,所述开孔内具有一固定部,所述固定部穿过所述开孔并与所述本体及所述上盖相接触。
作为进一步的改进,所述第一接触部为所述电路板向外裸露出的铜箔,所述第二接触部为一在所述电路板上所形成的数个圈形铜箔,所述第一接触部及所述第二接触部与所述本体及所述上盖互相接触。
作为进一步的改进,所述固定部为一由所述本体向上凸伸至所述上盖所形成的部件。
作为进一步的改进,所述固定部为一由所述上盖向下凸伸至所述本体所形成的部件。
作为进一步的改进,所述上盖的上表面后端设有数个散热鳍片,所述上盖的下表面上设有一第一导热件,所述第一导热件上具有一第二导热件,所述第一导热件开设有一容置槽,所述容置槽内具有一设于上盖的下表面并向后方凸伸的导热管。
作为进一步的改进,所述每一散热鳍片上具有至少一圆柱。
作为进一步的改进,所述第一导热件为一铜片,所述第二导热件为散热膏或散热贴,所述导热管为一铜管。
作为进一步的改进,所述本体开设有数个上下贯穿的下固定孔,所述每一下固定孔内皆具有一固定件,所述上盖的下表面还开设有数个上固定孔,所述每一上固定孔皆对应所述每一下固定孔而设,当所述上盖组装于所述本体上时,以所述数个固定件穿过所述每一下固定孔及所对应的所述上固定孔,以将所述上盖固定于所述本体上。
作为进一步的改进,所述上盖内的两侧皆具有一向下凹陷形成的第二容置槽,所述第二容置槽内设置有一回弹件,所述第二容置槽的外壁上开设有一开口。
作为进一步的改进,还进一步具有一设置于所述上固定槽及所述下固定槽中的退锁件,所述退锁件的两侧皆具有一向上凸伸形成的第一上卡固块,所述第一上卡固块对应所述第一上卡固槽而设并卡固于其中,所述退锁件的两侧皆具有一向下凸伸形成的第一下卡固块,所述第一下卡固块对应所述第一下卡固槽而设并卡固于其中,所述退锁件的两侧前端皆具有一上下凸伸形成的第二卡固块,所述第二卡固块的上部设于所述第二上卡固槽内,所述第二卡固块的下部设于所述第二下卡固槽内,所述第二卡固块向前凸伸形成一凸块,所述退锁件的两侧皆具有一向内凸伸形成的抵顶块,所述抵顶块经过所述开口组装于所述第二容置槽内并抵顶住所述回弹件,所述退锁件后端上固设有一拉环。
如上所述,本实用新型插头组件借由在所述电路板上的第一接触部、所述数个第二接触部及所述开孔内的固定部与所述本体及所述上盖相接触,以此方法增加所述电路板与所述本体及所述上盖间的接触面积,使本实用新型插头组件运作时所产生的热,能快速传递至所述本体及所述上盖,进而提高本实用新型插头组件的散热效率。
附图说明
图1为本实用新型插头组件的立体图。
图2为本实用新型插头组件的立体分解图。
图3为本实用新型插头组件的上盖的下视图。
图4为本实用新型插头组件的电路板的平面图。
具体实施方式
为详细说明本实用新型的技术内容、构造特征、所实现的目的和功效,以下结合具体实施例并配合附图予以详细说明。
请参阅图1和图2,本实用新型插头组件100为一四通道小型可插拔接口(QuadSmall Form-factor Pluggable,QSFP),是设置于一交换器(图中未示)中,所述插头组件100包含一本体1、一上盖2及一电路板4。
请参阅图2及图3,所述本体1开设有数个上下贯穿的下固定孔11,所述每一下固定孔11内均具有一固定件111,所述本体1的两侧边上均具有向内凹陷形成的下固定槽12,所述下固定槽12具有一向下凹陷形成的第一下卡固槽121,所述下固定槽12的前部具有一向下凹陷形成的第二下卡固槽122,所述本体1的后端具有一向下凹陷形成的下外接口13。
所述上盖2装设于所述本体1的上方,所述上盖2的上表面后端设有一凸台21,所述凸台21上设有数个散热鳍片211,所述每一散热鳍片211上具有至少一圆柱2111,所述圆柱2111可以增加散热面积,也有助于压铸制程的材料流动,本实施例中,设有七个所述散热鳍片211,所述每一散热鳍片211上均具有二个所述圆柱2111,所述上盖2的下表面上设有一第一导热件22,本实施例中,所述第一导热件22为一铜片,所述第一导热件22上具有一第二导热件221,本实施例中,所述第二导热件221为散热膏或散热贴,所述第一导热件22开设有一容置槽222,所述容置槽222内具有一设于所述上盖2的下表面并向后方凸伸的导热管23,本实施例中,所述导热管23为一铜管,所述上盖2的下表面还开设有数个上固定孔24,所述每一上固定孔24均对应所述本体1的每一下固定孔11而设,当所述上盖2组装于所述本体1上时,以所述数个固定件111穿过所述每一下固定孔11及所对应的所述上固定孔24,如此将所述上盖2固定于所述本体1上。
所述上盖2的两侧均具有向内凹陷形成的上固定槽25,所述上固定槽25对应所述下固定槽12而设,并与其组合形成一固定槽,所述上固定槽25具有一凹陷形成的第一上卡固槽251,所述第一上卡固槽251对应所述第一下卡固槽121而设,所述上固定槽25的前部具有一凹陷形成的第二上卡固槽252,所述第二上卡固槽252对应所述第二下卡固槽122而设,所述上盖2的后端具有一凹陷形成的上外接口26,所述上外接口26对应所述下外接口13而设,当所述上盖2组装于所述本体1上时,所述上外接口26与所述下外接口13组合成一外接口,所述外接口可以使外接线缆(图中未示)通过,使外接线缆能与本实用新型插头组件100中的所述电路板4连结,所述上盖2内的两侧均具有一凹陷形成的第一容置槽27,所述第一容置槽27上还具有一向内凸伸形成的卡持块271,所述上盖2内的两侧均具有一向下凹陷形成的第二容置槽28,所述第二容置槽28内设置有一回弹件281,本实施例中,所述回弹件281为弹簧,所述第二容置槽28的外壁上开设有一开口282。
本实用新型插头组件100还具有一设置于所述上固定槽25及所述下固定槽12中的退锁件3,所述退锁件3的两侧均具有一向上凸伸形成的第一上卡固块31,所述第一上卡固块31对应所述第一上卡固槽251而设并卡固于其中,所述退锁件3的两侧均具有一向下凸伸形成的第一下卡固块32,所述第一下卡固块32对应所述第一下卡固槽121而设并卡固于其中,所述退锁件3的两侧前端均具有一上下凸伸形成的第二卡固块33,所述第二卡固块33的上部设于所述第二上卡固槽252内,所述第二卡固块33的下部设于所述第二下卡固槽122内,所述第二卡固块33向前凸伸形成一凸块34,所述退锁件3的两侧均具有一向内凸伸形成的抵顶块35,所述抵顶块35经过所述开口282组装于所述第二容置槽28内并抵顶住所述回弹件281,所述退锁件3后端上固设有一拉环36。
当本实用新型插头组件100组装于一交换器中时(图中未示),所述本实用新型插头组件100进入所述交换器中,此时所述本体1及所述上盖2的两侧受所述交换器中的夹持部固定住,使得本实用新型插头组件100得与所述交换器连接;当本实用新型插头组件100于所述交换器中退出时(图中未示),先将所述拉环36向后拉,由于所述本体1及所述上盖2的两侧被所述交换器中的夹持部固定住而无法移动,此时所述抵顶块35将所述回弹件281向后压,同时所述回弹件281产生一向前的回弹力将所述抵顶块35抵顶住,当所述拉环36持续向后拉时,由于所述抵顶块35受所述回弹件281的回弹力影响而无法持续向后位移,使得所述退锁件3的两侧向外展开,从而使所述凸块34撑开所述交换器中的夹持部,使得所述插头组件100得以向外退出。
请参阅图2及图4,所述电路板4的两侧装设于所述上盖2两侧的第一容置槽27中并与所述第二导热件221互相接触,所述电路板4上具有向内凹陷形成的卡持槽41,所述卡持槽41对应所述卡持块271而设,所述卡持块271组装于卡持槽41中,如此将电路板4装设于上盖2中,所述电路板4的两侧开设有第一接触部42,所述第一接触部42为所述电路板4向外裸露出的铜箔,所述电路板4的一面上开设有数个第二接触部43,所述第二接触部43为在所述电路板4上所形成的数个圈形铜箔,所述电路板4上还开设有至少一开孔44,所述开孔44内具有一固定部441,所述固定部441为一由所述本体1向上凸伸至所述上盖2或由所述上盖2向下凸伸至所述本体所形成的部件,所述固定部441穿过所述开孔44并与所述本体1及所述上盖2相接触。
当本实用新型插头组件100与一交换器组装并运作时,所述电路板4因电流的流动而发热,此时所述第一接触部42与所述本体1及所述上盖2互相接触,所述第二接触部43与所述第二导热件221互相接触,如此将所述电路板4上的热能经由所述第二导热件221传导至所述第一导热件22及所述导热管23上,使热透过所述上盖2传导至本实用新型插头组件100的壳体表面及所述散热鳍片211上,所述开孔44能经由所述固定部441将热传导至所述本体1及所述上盖2,所述本实用新型插头组件100的壳体表面再与组装的所述交换器的内壁接触,将热传导至所述交换器上,而所述交换器上的散热鳍片透过所述交换器中的风扇,将外部冷空气抽入所述交换器内,对所述交换器上的散热鳍片与外部空气进行强制对流以达到散热的功效。
承上所述,本实用新型插头组件100借由在所述电路板4上的第一接触部42、所述数个第二接触部43及所述开孔44内的固定部441与所述本体1及所述上盖2相接触,以此方法增加所述电路板4与所述本体1及所述上盖2间的接触面积,使本实用新型插头组件100运作时所产生的热,能快速传递至所述本体1及所述上盖2,进而提高本实用新型插头组件100的散热效率。
其中,附图标记说明如下:
100插头组件
1本体
11下固定孔
111固定件
12下固定槽
121第一下卡固槽
122第二下卡固槽
13下外接口
2上盖
21凸台
211散热鳍片
2111圆柱
22第一导热件
221第二导热件
222容置槽
23导热管
24上固定孔
25上固定槽
251第一上卡固槽
252第二上卡固槽
26上外接口
27第一容置槽
271卡持块
28第二容置槽
281回弹件
282开口
3退锁件
31第一上卡固块
32第一下卡固块
33第二卡固块
34凸块
35抵顶块
36拉环
4电路板
41卡持槽
42第一接触部
43第二接触部
44开孔
441固定部
Claims (10)
1.一种插头组件,是设置于一交换器中,其特征在于:包含一本体、一上盖和一电路板;所述上盖,装设于本体的上方,所述电路板装设于所述上盖中,所述电路板的两侧开设有第一接触部,所述电路板的一面上开设有数个第二接触部,所述第一接触部及所述第二接触部与所述本体及所述上盖互相接触,所述电路板上开设有至少一开孔,所述开孔内具有一固定部,所述固定部穿过所述开孔并与所述本体及所述上盖相接触。
2.根据权利要求1所述的插头组件,其特征在于:所述第一接触部为所述电路板向外裸露出的铜箔,所述第二接触部为一在所述电路板上所形成的数个圈形铜箔,所述第一接触部及所述第二接触部与所述本体及所述上盖互相接触。
3.根据权利要求1所述的插头组件,其特征在于:所述固定部为一由所述本体向上凸伸至所述上盖所形成的部件。
4.根据权利要求1所述的插头组件,其特征在于:所述固定部为一由所述上盖向下凸伸至所述本体所形成的部件。
5.根据权利要求1所述的插头组件,其特征在于:所述上盖的上表面后端设有数个散热鳍片,所述上盖的下表面上设有一第一导热件,所述第一导热件上具有一第二导热件,所述第一导热件开设有一容置槽,所述容置槽内具有一设于上盖的下表面并向后方凸伸的导热管。
6.根据权利要求5所述的插头组件,其特征在于:所述每一散热鳍片上具有至少一圆柱。
7.根据权利要求5所述的插头组件,其特征在于:所述第一导热件为一铜片,所述第二导热件为散热膏或散热贴,所述导热管为一铜管。
8.根据权利要求1所述的插头组件,其特征在于:所述本体开设有数个上下贯穿的下固定孔,所述每一下固定孔内皆具有一固定件,所述上盖的下表面还开设有数个上固定孔,所述每一上固定孔皆对应所述每一下固定孔而设,当所述上盖组装于所述本体上时,以所述数个固定件穿过所述每一下固定孔及所对应的所述上固定孔,以将所述上盖固定于所述本体上。
9.根据权利要求1所述的插头组件,其特征在于:所述上盖内的两侧皆具有一向下凹陷形成的第二容置槽,所述第二容置槽内设置有一回弹件,所述第二容置槽的外壁上开设有一开口。
10.根据权利要求1所述的插头组件,其特征在于:所述本体的两侧边上皆具有向内凹陷形成的下固定槽,所述下固定槽具有一向下凹陷形成的第一下卡固槽,所述下固定槽的前部具有一向下凹陷形成的第二下卡固槽,所述上盖的两侧皆具有向内凹陷形成的上固定槽,所述上固定槽对应下固定槽而设,并与其组合形成一固定槽,所述上固定槽具有一凹陷形成的第一上卡固槽,所述第一上卡固槽对应第一下卡固槽而设,所述上固定槽的前部具有一凹陷形成的第二上卡固槽,所述第二上卡固槽对应第二下卡固槽而设,所述上盖内的两侧皆具有一向下凹陷形成的第二容置槽,所述第二容置槽内设置有一回弹件,所述第二容置槽的外壁上开设有一开口;还进一步具有一设置于所述上固定槽及所述下固定槽中的退锁件,所述退锁件的两侧皆具有一向上凸伸形成的第一上卡固块,所述第一上卡固块对应所述第一上卡固槽而设并卡固于其中,所述退锁件的两侧皆具有一向下凸伸形成的第一下卡固块,所述第一下卡固块对应所述第一下卡固槽而设并卡固于其中,所述退锁件的两侧前端皆具有一上下凸伸形成的第二卡固块,所述第二卡固块的上部设于所述第二上卡固槽内,所述第二卡固块的下部设于所述第二下卡固槽内,所述第二卡固块向前凸伸形成一凸块,所述退锁件的两侧皆具有一向内凸伸形成的抵顶块,所述抵顶块经过所述开口组装于所述第二容置槽内并抵顶住所述回弹件,所述退锁件后端上固设有一拉环。
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JP3222906U (ja) | 2019-09-05 |
US10674633B2 (en) | 2020-06-02 |
EP3588156B1 (en) | 2021-08-04 |
US20190394897A1 (en) | 2019-12-26 |
TWM573526U (zh) | 2019-01-21 |
US10617037B2 (en) | 2020-04-07 |
TWM575927U (zh) | 2019-03-21 |
EP3588156A1 (en) | 2020-01-01 |
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