JP4998249B2 - 光トランシーバの放熱装置 - Google Patents
光トランシーバの放熱装置 Download PDFInfo
- Publication number
- JP4998249B2 JP4998249B2 JP2007329666A JP2007329666A JP4998249B2 JP 4998249 B2 JP4998249 B2 JP 4998249B2 JP 2007329666 A JP2007329666 A JP 2007329666A JP 2007329666 A JP2007329666 A JP 2007329666A JP 4998249 B2 JP4998249 B2 JP 4998249B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- heat
- optical transceiver
- transceiver
- cage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
図4は、光トランシーバ13をケージ12に挿入する初期の状態を示し、図4(A)は全体の状態を示す図、図4(B)〜図4(D)は支持部の詳細を示す図である。図4(A)に示すように、ケージ上部12bに形成された窓部12cの枠内に、ヒートシンク15が前後方向(矢印Y)に移動可能で、かつ上下方向(矢印X)に変位可能に支持される。なお、図4の光トランシーバ13の挿入初期においては、図2(A)で説明したように、ヒートシンク15は、ケージ12の前方で上方に位置した状態に保持されている。
Claims (2)
- ホスト基板に設置されたケージの上部にヒートシンクを配置し、該ヒートシンクによりケージ内に挿抜可能に挿着される光トランシーバからの発熱を放熱する光トランシーバの放熱装置であって、
前記ヒートシンクとトランシーバ筐体との接触面は傾斜面とされ、前記ヒートシンク又は前記トランシーバ筐体のいずれかの接触面に軟質な熱伝導シートが貼り付けられ、前記ヒートシンクは、前記トランシーバ筐体の挿入位置に応じて前記ケージに対して前後方向及び上下方向に所定の範囲で移動可能に支持され、
前記熱伝導シートの接触面を擦ることなく前記トランシーバ筐体が挿入され、前記トランシーバ筐体の最終挿入位置で、前記熱伝導シートを挟んで前記ヒートシンクと前記トランシーバ筐体との接触面が互いに圧接されることを特徴とする光トランシーバの放熱装置。 - 前記ヒートシンクと前記トランシーバ筐体の接触面に、互いに係合する穴と突起を設け、前記熱伝導シートを挟んで前記ヒートシンクと前記トランシーバ筐体の接触面が、圧接時には前記穴と突起が係合され、非圧接時には非係合とされることを特徴とする請求項1に記載の光トランシーバの放熱装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007329666A JP4998249B2 (ja) | 2007-12-21 | 2007-12-21 | 光トランシーバの放熱装置 |
US12/332,173 US8081470B2 (en) | 2007-12-11 | 2008-12-10 | Heat-dissipating mechanism implemented in cage for optical transceiver |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007329666A JP4998249B2 (ja) | 2007-12-21 | 2007-12-21 | 光トランシーバの放熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009152427A JP2009152427A (ja) | 2009-07-09 |
JP4998249B2 true JP4998249B2 (ja) | 2012-08-15 |
Family
ID=40921222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007329666A Expired - Fee Related JP4998249B2 (ja) | 2007-12-11 | 2007-12-21 | 光トランシーバの放熱装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8081470B2 (ja) |
JP (1) | JP4998249B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015179743A (ja) * | 2014-03-19 | 2015-10-08 | 沖電気工業株式会社 | 電子モジュールの放熱装置 |
WO2019126043A1 (en) * | 2017-12-18 | 2019-06-27 | Honeywell International Inc. | Thermal interface structure for optical transceiver modules |
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CN102375512A (zh) * | 2010-08-19 | 2012-03-14 | 鸿富锦精密工业(深圳)有限公司 | 导风罩 |
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US8358504B2 (en) * | 2011-01-18 | 2013-01-22 | Avago Technologies Enterprise IP (Singapore) Pte. Ltd. | Direct cooling system and method for transceivers |
US8485739B2 (en) * | 2011-03-30 | 2013-07-16 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical transceiver module having a deformable heat sink structure |
JP5673349B2 (ja) | 2011-05-25 | 2015-02-18 | 富士通株式会社 | プラガブルモジュール |
US8670236B2 (en) * | 2011-08-03 | 2014-03-11 | Tyco Electronics Corporation | Cage assembly for receiving a pluggable module |
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US9052483B2 (en) * | 2011-09-27 | 2015-06-09 | Finisar Corporation | Communication module assembly with heat sink and methods of manufacture |
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WO2015073545A1 (en) | 2013-11-12 | 2015-05-21 | Molex Incorporated | Thermally configured connector system |
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US10720683B2 (en) | 2014-09-30 | 2020-07-21 | Cps Technology Holdings Llc | Battery module thermal management features for internal flow |
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US9577361B2 (en) | 2014-10-22 | 2017-02-21 | International Business Machines Corporation | Pluggable LGA socket for high density interconnects |
CN107111067A (zh) * | 2014-11-26 | 2017-08-29 | 慧与发展有限责任合伙企业 | 收发器模块 |
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-
2007
- 2007-12-21 JP JP2007329666A patent/JP4998249B2/ja not_active Expired - Fee Related
-
2008
- 2008-12-10 US US12/332,173 patent/US8081470B2/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015179743A (ja) * | 2014-03-19 | 2015-10-08 | 沖電気工業株式会社 | 電子モジュールの放熱装置 |
WO2019126043A1 (en) * | 2017-12-18 | 2019-06-27 | Honeywell International Inc. | Thermal interface structure for optical transceiver modules |
US10567084B2 (en) | 2017-12-18 | 2020-02-18 | Honeywell International Inc. | Thermal interface structure for optical transceiver modules |
Also Published As
Publication number | Publication date |
---|---|
US20090296350A1 (en) | 2009-12-03 |
JP2009152427A (ja) | 2009-07-09 |
US8081470B2 (en) | 2011-12-20 |
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